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Patent # Description
2018/0053683 LIFT PIN AND METHOD FOR MANUFACTURING SAME
A lift pin passes through a hole of a susceptor on which a wafer is placed inside a process chamber in which an epitaxial process is performed with respect to...
2018/0053682 CERAMIC RING WITH A LADDER STRUCTURE
A ceramic ring for supporting a wafer, comprising: a body; and an annular recess provided in the center of the body, the annular recess having a bottom surface...
2018/0053681 A COMPONENT HANDLING ASSEMBLY
According to the present invention there is provided a component handling assembly ( ) suitable for facilitating loading or unloading a plurality of components...
2018/0053680 PEELING METHOD AND PEELING APPARATUS
Disclosed is a method of peeling a protective member from a wafer, the protective member composed of a resin and a film, the film attached to one side of the...
2018/0053679 Composite Substrate, Elastic Wave Device, and Method for Producing Elastic Wave Device
A composite substrate 10 is formed by bonding together a piezoelectric substrate 12 and a support substrate 14 that has a lower thermal expansion coefficient...
2018/0053678 ELECTROSTATIC CHUCK DEVICE
An object is to provide an electrostatic chuck device having high heat resistance, which can be used even under high-temperature environment. An electrostatic...
2018/0053677 APPARATUS AND METHOD TO ELECTROSTATICALLY CHUCK SUBSTRATES TO A MOVING CARRIER
An electrostatic chucking apparatus includes a movable member arranged for movement relative to an axial axis, at least one electrostatic chuck coupled to the...
2018/0053676 BIPOLAR ELECTROSTATIC CHUCK AND METHOD FOR USING THE SAME
Described herein are an electrostatic chuck and method for using the same. In one example, an electrostatic chuck is provided that includes a plurality of...
2018/0053675 BIPOLAR ELECTROSTATIC CHUCK AND METHOD FOR USING THE SAME
Described herein are an electrostatic chuck and method for using the same. In one example, an electrostatic chuck is provided that includes a plurality of...
2018/0053674 ELECTROSTATIC CHUCK ASSEMBLY AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME
Disclosed are an electrostatic chuck assembly and a substrate processing apparatus including the same. The substrate processing apparatus comprises a process...
2018/0053673 STAGE LEVELING DEVICE FOR HIGH PERFORMANCE MASK ALIGNER
Embodiments of the invention relate to a stage leveling device for a high-performance mask aligner, having enhanced leveling maintenance and, in particular, a...
2018/0053672 SUBSTRATE CONVEYING ROBOT AND SUBSTRATE PROCESSING SYSTEM
A control device is configured to make a robot arm and a substrate holding device execute a blade member advancing operation for advancing a pair of blade...
2018/0053671 APPARATUS AND METHOD FOR TRANSFERRING ELECTRONIC DEVICES
The present invention relates to an apparatus for transferring electronic devices from a holding unit to a processing station. The apparatus comprises first...
2018/0053670 UPPER CONE FOR EPITAXY CHAMBER
An epitaxial deposition chamber having an upper cone for controlling air flow above a dome in the chamber, such as a high growth rate epitaxy chamber, is...
2018/0053669 Temperature Controller of Semiconductor Wafer and Temperature Control Method of Semiconductor Wafer
A plurality of temperature adjusters each independently include a control loop. A manipulated variable calculator is configured to give manipulated variables...
2018/0053668 Temperature Controller of Semiconductor Wafer
A temperature controller for a semiconductor wafer is configured to perform a temperature control on a plurality of temperature adjusters including a reference...
2018/0053667 High Temperature Process Chamber Lid
Lid assemblies for processing chamber and processing chambers including the lid assemblies are described. The lid assemblies include a high temperature lid...
2018/0053666 SUBSTRATE CARRIER WITH ARRAY OF INDEPENDENTLY CONTROLLABLE HEATER ELEMENTS
A substrate carrier is described with an array of independently controllable heater elements. In one example an apparatus includes a substrate carrier to carry...
2018/0053665 PRE-BUMPED REDISTRIBUTION LAYER STRUCTURE AND SEMICONDUCTOR PACKAGE INCORPORATING SUCH PRE-BUMPED...
A pre-bumped redistribution layer (RDL) structure is disclosed. The pre-bumped RDL structure includes at least a dielectric layer, a first metal layer on the...
2018/0053664 BONDING DEVICE FOR CHIP ON FILM AND DISPLAY PANEL AND BONDING METHOD FOR THE SAME
The embodiments of the present disclosure provide a bonding device for a chip on film and a display panel and a bonding method for the same. The bonding device...
2018/0053663 SEMICONDUCTOR COMPONENT, METHOD FOR PROCESSING A SUBSTRATE AND METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT
In various embodiments, a method is provided. The method includes forming a metallization layer above at least one first region of a substrate. After forming...
2018/0053662 TEXTURING OF SILICON SURFACE WITH DIRECT-SELF ASSEMBLY PATTERNING
A method of texturing a silicon (Si) wafer and the resulting device are provided. Embodiments include forming a mask over an upper surface of a Si wafer;...
2018/0053661 PLASMA ETCHING APPARATUS AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME
Disclosed are a plasma etching apparatus and a method of manufacturing semiconductor devices using the same. The plasma etching apparatus includes a process...
2018/0053660 METHOD FOR PREVENTING LINE BENDING DURING METAL FILL PROCESS
Provided herein are methods and apparatuses for reducing line bending when depositing a metal such as tungsten, molybdenum, ruthenium, or cobalt into features...
2018/0053659 METHODS AND APPARATUS FOR DEPOSITION PROCESSES
Methods for selective dielectric deposition using self-assembled monolayer (SAM) are provided herein. A method of selectively depositing a low-k dielectric...
2018/0053658 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
In a semiconductor device, a memory cell is formed of a control gate electrode and a memory gate electrode adjacent to each other, a gate insulating film...
2018/0053657 SONOS Stack With Split Nitride Memory Layer
A semiconductor device and method of manufacturing the same are provided. In one embodiment, method includes forming a first oxide layer over a substrate,...
2018/0053656 Gate-Stack Structure with a Diffusion Barrier Material
This invention relates to an apparatus, system, and method for creating a high-k gate stack structure that includes a passivation layer. The passivation layer...
2018/0053655 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
A method for manufacturing a semiconductor device includes the steps of forming a layer of a second conductivity type on a top-surface side of a substrate of a...
2018/0053654 SIGNAL RELAY BOARD FOR POWER SEMICONDUCTOR MODULES
Signal relay board for power semiconductor modules enabling electrical connection between power semiconductor modules and a drive unit driving same. A first...
2018/0053653 GAS FLOW CONTROL FOR EPI THICKNESS UNIFORMITY IMPROVEMENT
One implementation provides a method including providing a substrate into a processing chamber through a loading port, rotating the substrate clockwise,...
2018/0053652 METHOD OF FORMING AMORPHOUS SILICON LAYER
Provided is a method of forming an amorphous silicon layer. The method includes depositing an amorphous silicon layer on a substrate in a chamber; performing a...
2018/0053651 DENSE VERTICAL NANOSHEET
After forming a sacrificial mandrel located over a substrate, alternating channel layer portions and sacrificial layer portions are formed on sidewalls of the...
2018/0053650 LOW EXTERNAL RESISTANCE CHANNELS IN III-V SEMICONDUCTOR DEVICES
The present invention relates generally to semiconductor devices and more particularly, to a method of forming a replacement channel composed of a III-V...
2018/0053649 METHOD TO GROW A SEMI-CONDUCTING SIC LAYER
A method to grow a semi insulating SiC layer. The method may include growing the semi insulating SiC layer on a substrate, and creating deep defects in the...
2018/0053648 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A method of manufacturing a semiconductor device according to an embodiment of the present invention includes steps of forming an AlN layer on a SiC substrate...
2018/0053647 COMPOSITE SEMICONDUCTOR SUBSTRATE
A composite semiconductor substrate being able to improve voltage withstanding and crystalline quality is provided. A composite semiconductor substrate is...
2018/0053646 Gas Discharge Lamp and Spotlight System Comprising Gas Discharge Lamp
The preferred embodiments are directed to discloses a metal halide high-pressure discharge lamp comprising a burner which is enclosed by an outer bulb. In the...
2018/0053645 TIME VERSUS INTENSITY DISTRIBUTION ANALYSIS USING A MATRIX-ASSISTED LASER DESORPTION/IONIZATION TIME-OF-FLIGHT...
An apparatus, method, or computer program. spectrometer test data of a sample may be received for processing. The spectrometer test data may include...
2018/0053644 Improved Ionisation of Gaseous Samples
A method of mass spectrometry or ion mobility spectrometry is disclosed comprising: providing an analyte; supplying a matrix compound to said analyte such that...
2018/0053643 SAMPLE PLATE FOR MASS SPECTROMETRIC ANALYSIS, MASS SPECTROMETRIC ANALYSIS METHOD, AND MASS SPECTROMETRIC...
To provide a sample plate for mass spectrometric analysis, which requires no use of a matric in combination, of which the ionization-assisting effect will...
2018/0053642 CATEGORIZATION DATA MANIPULATION USING A MATRIX-ASSISTED LASER DESORPTION/IONIZATION TIME-OF-FLIGHT MASS...
Methods, systems, apparatuses, and/or computer programs. Mass spectrometer test data (e.g. a blood sample of a medical patient) may be associated with metadata...
2018/0053641 SHOT-TO-SHOT SAMPLING USING A MATRIX-ASSISTED LASER DESORPTION/IONIZATION TIME-OF-FLIGHT MASS SPECTROMETER
Embodiments relate to an apparatus, method, or computer program. A laser may be configured to irradiate a plurality of laser pulses on a target area to ionize...
2018/0053640 IN-SOURCE COLLISION-INDUCED HEATING AND ACTIVATION OF GAS-PHASE IONS FOR SPECTROMETRY
An electrode assembly is provided in a high sub-atmospheric pressure region of an ion source, between an ionization chamber and a vacuum region of a...
2018/0053639 APPARATUS FOR TREATING OBJECTS WITH PLASMA, USE OF THIS APPARATUS AND METHOD OF USING THIS APPARATUS
Apparatus for treating the surface of objects with plasma, having: an enclosure; a means for placing this enclosure under vacuum; a zone for storing objects to...
2018/0053638 MAGNET USED WITH A PLASMA CLEANER
A plasma generator is located outside the vacuum chamber and generates neutral reactive particles and charged particles. A magnet positioned outside the plasma...
2018/0053637 METHOD FOR INSPECTING SHOWER PLATE OF PLASMA PROCESSING APPARATUS
The present disclosure provides a method for inspecting a shower plate of a plasma processing apparatus. In the plasma processing apparatus, a gas ejection...
2018/0053636 TEMPERATURE MEASUREMENT FOR SUBSTRATE CARRIER USING A HEATER ELEMENT ARRAY
Temperature measurement is described for a substrate carrier using a heater element array. In one example a method includes measuring a first combined current...
2018/0053635 PLASMA PROCESSING APPARATUS
A plasma processing apparatus includes at least one asymmetry member that causes a non-uniformity of plasma density around a high frequency electrode in an...
2018/0053633 Plasma Impedance Matching for Supplying RF Power to a Plasma Load
A plasma impedance matching unit for a plasma power supply system includes a first power connector for coupling the matching unit to a RF power source, a...
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