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Patent # Description
2018/0190649 Semiconductor Device with an IGBT Region and a Non-Switchable Diode Region
A semiconductor device includes a semiconductor substrate having a body layer arranged between a front side and a drift layer, and forming a pn-junction with...
2018/0190648 HIGH DENSITY CAPACITORS FORMED FROM THIN VERTICAL SEMICONDUCTOR STRUCTURES SUCH AS FINFETS
A vertical structure may be used as a high density capacitance for an integrated circuit. These thin vertical structures can be configured to operate as an...
2018/0190647 SEMICONDUCTOR CARRIER WITH VERTICAL POWER FET MODULE
A monolithic power management module provides a chip carrier with surfaces, ground traces, signal and power interconnects; a three dimensional FET formed on...
2018/0190646 ELECTRONIC DEVICE WITH INTEGRATED GALVANIC ISOLATION, AND MANUFACTURING METHOD OF THE SAME
A method of manufacturing an electronic device for providing galvanic isolation includes forming a dielectric layer on a semiconductor body and integrating, in...
2018/0190645 Electrostatic Discharge (ESD) Circuit, Array Substrate and Display Device
An electrostatic discharge (ESD) circuit, an array substrate and a display device are provided. The ESD circuit including a first signal line, a second signal...
2018/0190644 SILICON-CONTROLLED RECTIFIERS HAVING A CATHODE COUPLED BY A CONTACT WITH A DIODE TRIGGER
Silicon-controlled rectifiers, electrostatic discharge circuits, and methods of fabricating a silicon-controlled rectifier for use in an electrostatic...
2018/0190643 TRANSIENT OVERVOLTAGE PROTECTION DEVICE
In one embodiment, an overvoltage protection device may include a semiconductor substrate comprising an n-type body region. The overvoltage protection device...
2018/0190642 SEMICONDUCTOR DEVICE
A semiconductor device according to the present invention includes: a substrate; a plurality of trenches formed in the substrate; and a plurality of functional...
2018/0190641 Semiconductor Device Comprising a Clamping Structure
Semiconductor device is provided with a semiconductor body that includes a clamping structure including a first pn junction diode and a second pn junction...
2018/0190640 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
Disclosed herein is a semiconductor integrated circuit device which includes a standard cell with a plurality of fins extending in a first direction and...
2018/0190639 ESD PROTECTION FOR DEPLETION-MODE DEVICES
A device includes a transistor configured for depletion-mode operation, the transistor having a gate terminal and a drain terminal, and an electrostatic...
2018/0190638 CoWoS Structures and Method of Forming the Same
Chip on wafer on substrate structures and methods of forming are provided. The method includes attaching a first die and a second die to an interposer. The...
2018/0190637 MODULE AND MANUFACTURING METHOD THEREOF
The module is implemented on a circuit board, the module including a wiring board; an electronic component implemented on a first surface of the wiring board;...
2018/0190636 POWER SEMICONDUCTOR MODULE
A power semiconductor module including a positive-side switching device and a positive-side diode device which are mounted on a positive-side conductive...
2018/0190635 ELECTRONIC DEVICE PACKAGE
An electronic device package includes a package substrate, an interposer located above the package substrate and electrically connected to the package...
2018/0190634 CONFIGURABLE SEMICONDUCTOR PACKAGE
Configurable semiconductor packages and processes to attain a defined configuration are provided. A configurable semiconductor package includes a base...
2018/0190633 LASER LIFT-OFF ON ISOLATED III-NITRIDE LIGHT ISLANDS FOR INTER-SUBSTRATE LED TRANSFER
A laser liftoff process is provided. A device layer can be provided on a transfer substrate. Channels can be formed through the device layer such that devices...
2018/0190632 DISPLAY MODULE AND SYSTEM APPLICATIONS
A display module and system applications including a display module are described. The display module may include a display substrate including a front...
2018/0190631 DISPLAY DEVICE AND MULTI-SCREEN DISPLAY DEVICE USING THE SAME
Disclosed is a display device and a multi-screen display device using the same, which include a minimized bezel area. The display device includes a display...
2018/0190630 PACKAGE STRUCTURE OF OPTICAL MODULE
A package structure of an optical module includes a substrate, a light-emitting chip, a sensing chip, two packaging gel bodies, and a cover layer. The...
2018/0190628 ISOLATOR INTEGRATED CIRCUITS WITH PACKAGE STRUCTURE CAVITY AND FABRICATION METHODS
Disclosed examples include integrated circuits with a leadframe structure, a first circuit structure including a light source configured to generate a light...
2018/0190627 LIGHT EMITTING DEVICE
A light-emitting device including a light-emitting unit, an electrode unit, and an insulating unit is provided. The light-emitting unit includes an illuminator...
2018/0190626 LIGHT-EMITTING DEVICE AND THE METHOD OF MANUFACTURING THE SAME
The present application discloses a light-emitting device including a first support structure having a first surface, a plurality of light-emitting elements...
2018/0190625 QUANTUM DOT INTEGRATION SCHEMES
Display panels and methods of manufacture are described for down converting a peak emission wavelength of a pump LED within a subpixel with a quantum dot...
2018/0190624 SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARRIER DIODE
A semiconductor device includes a MOSFET including a PN junction diode. A unipolar device is connected in parallel to the MOSFET and has two terminals. A first...
2018/0190623 PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
The present invention provides a method of manufacturing a package structure. An array chip including a plurality of first dies is provided. A wafer including...
2018/0190622 3-D STACKING SEMICONDUCTOR ASSEMBLY HAVING HEAT DISSIPATION CHARACTERISTICS
A semiconductor assembly having heat dissipation characteristics includes stacked semiconductor chips thermally conductible to a thermal pad of an interconnect...
2018/0190621 SEMICONDUCTOR DEVICE INCLUDING DUAL PAD WIRE BOND INTERCONNECTION
A semiconductor device is disclosed including semiconductor die formed with a row of functional die bond pads and an adjacent row of dummy die bond pads. The...
2018/0190620 INTERCONNECT STRUCTURES WITH INTERMETALLIC PALLADIUM JOINTS AND ASSOCIATED SYSTEMS AND METHODS
Interconnect structures with intermetallic palladium joints are disclosed herein. In one embodiment, a method of forming an interconnect structure includes...
2018/0190619 3D SEMICONDUCTOR DEVICE AND STRUCTURE
A 3D semiconductor device, the device including: a first single crystal layer including a plurality of first transistors; at least one metal layer...
2018/0190618 THREE-DIMENSIONAL INTEGRATED CIRCUIT COOLING SYSTEM
A three-dimensional integrated circuit cooling system is provided for removing heat from a three-dimensional integrated circuit. Plural fluid microchannels are...
2018/0190617 HEAT REMOVAL BETWEEN TOP AND BOTTOM DIE INTERFACE
Heat dissipation technology in a die stack is disclosed. In one example, an electronic device comprises a pair of electrically coupled dies; and a heat...
2018/0190616 SEMICONDUCTOR SENSOR PACKAGE
A package packaged with a cap. The package features trenches, through holes, and a non-conductive coupling element forming a locking mechanism integrated...
2018/0190615 LARGER DISPLAYS FORMED BY MULTIPLE INTEGRATED LED ARRAY MICRO-DISPLAYS
Larger displays formed by multiple sub-displays, e.g., integrated light-emitting diode (LED) pixel array micro-displays, and methods of operating and making...
2018/0190614 Massively parallel transfer of microLED devices
MicroLED devices can be transferred in large numbers to form microLED displays using processes such as pick-and-place, thermal adhesion transfer, or fluidic...
2018/0190613 WIRING WITH EXTERNAL TERMINAL
Apparatuses for providing external terminals of a semiconductor device are described. An example apparatus includes: a connection wiring of a ring-shape having...
2018/0190612 ANTENNA APPARATUS HAVING BOND WIRES
An antenna apparatus includes a radio-frequency chip arranged on a substrate, wherein the radio-frequency chip includes at least one antenna output terminal...
2018/0190611 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A semiconductor device includes an electrode having a flat part and a non-flat part made up of a concave part, a joint layer being made of a sintered body of...
2018/0190610 METHOD FOR JOINING AT LEAST TWO COMPONENTS
The invention relates to a method for connecting at least two components (1, 2), comprising the following steps: A) providing at least a first component (1)...
2018/0190609 Ball Grid Array Rework
Embodiments relate to an apparatus for rework of a BGA package. Memory shape material is placed adjacent to a plurality of solder joints of the package....
2018/0190608 PACKAGED SEMICONDUCTOR DEVICE WITH A REFLOW WALL
A packaged semiconductor device includes a lead frame and a semiconductor device. A solder joint is coupled between the lead frame and a terminal on the...
2018/0190607 SEMICONDUCTOR PACKAGE AND METHOD FOR PREPARING THE SAME
A semiconductor package includes a first device and a bump structure disposed over the first device. In some embodiments, the first device has a first upper...
2018/0190606 SEMICONDUCTOR DEVICES HAVING METAL POSTS FOR STRESS RELIEF AT FLATNESS DISCONTINUITIES
A semiconductor device includes a first body having a first coefficient of thermal expansion (CTE) and a first surface, a third body having a third CTE and a...
2018/0190605 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
An aluminum electrode (2) is provided on a semiconductor device (1). A metallic film (3) for a solder joint is provided on the aluminum electrode (2). The...
2018/0190604 SINTERED SOLDER FOR FINE PITCH FIRST-LEVEL INTERCONNECT (FLI) APPLICATIONS
Foundation layers and methods of forming a foundation layer are described. Die pads are formed over a die. A dielectric layer is formed over die pads and the...
2018/0190603 CONTACT HOLE STRUCTURE AND FABRICATING METHOD OF CONTACT HOLE AND FUSE HOLE
A method of fabricating a contact hole and a fuse hole includes providing a dielectric layer. A conductive pad and a fuse are disposed within the dielectric...
2018/0190602 FAN-OUT SEMICONDUCTOR PACKAGE
A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an...
2018/0190601 HIGH-FREQUENCY MODULE
A high-frequency module (1) includes a first substrate (101), a second substrate (102) that faces the first substrate (101), a support (103) that supports the...
2018/0190600 PACKAGED DEVICES WITH INTEGRATED ANTENNAS
Various embodiments of an integrated device package with integrated antennas are disclosed. In some embodiments, an antenna can be defined along a die pad of...
2018/0190599 Multi-Die Integrated Circuit Device With Capacitive Overvoltage Protection
An electronic device includes a package, a plurality of external leads extending outside the package, a first die within the package having one or more first...
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