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| Patent # | Description |
|---|---|
| 2018/0190548 |
METHOD AND A DEVICE FOR MEASURING GAS DISSOCIATION DEGREES WITH AN OPTICAL
SPECTROMETER In current application of gas, the dissociation degree in some special gas is generally detected and controlled by a physical or chemical method instead of an... |
| 2018/0190547 |
WAFER AND WAFER DEFECT ANALYSIS METHOD A wafer defect analysis method according to one embodiment comprises the steps of: thermally treating a wafer at different temperatures; measuring an oxygen... |
| 2018/0190546 |
METHOD FOR FORMING REPLACEMENT METAL GATE AND RELATED DEVICE A method for eliminating line voids during RMG processing and the resulting device are provided. Embodiments include forming dummy gates over PFET and NFET... |
| 2018/0190545 |
HYBRID-CHANNEL NANO-SHEET FETS Semiconductor devices and methods of forming a first layer cap at ends of layers of first channel material in a stack of alternating layers of first channel... |
| 2018/0190544 |
HYBRID-CHANNEL NANO-SHEET FETS Integrated chips include a first device and a second device. The first device includes a stack of vertically arranged sheets of a first channel material, a... |
| 2018/0190542 |
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma... |
| 2018/0190541 |
FAN-OUT LINE ARRANGEMENT, DISPLAY PANEL AND MANUFACTURING METHOD THEREOF A fan-out line arrangement, a display panel and a manufacture method thereof are provided. The fan-out line arrangement provided by the present disclosure... |
| 2018/0190540 |
A Solid State Memory Device, and Manufacturing Method Thereof Conductive structure technology is disclosed. In one example, a conductive structure can include an interconnect and a plurality of conductive layers overlying... |
| 2018/0190539 |
METHOD FOR PREPARING SUBSTRATE WITH CARRIER TRAPPING CENTER The present disclosure provides a method for preparing a substrate with a carrier trapping center. The method includes: implanting bubbling ions into the... |
| 2018/0190538 |
METHOD OF FABRICATING STI TRENCH A method of fabricating an STI trench includes providing a substrate. Later, a first mask is formed to cover the substrate. The first mask includes numerous... |
| 2018/0190537 |
METHODS FOR REMOVAL OF HARD MASK Embodiments of a method of processing semiconductor devices are presented. The method includes providing a substrate prepared with isolation regions having a... |
| 2018/0190536 |
RECEPTACLE DEVICE, DEVICE AND METHOD FOR HANDLING SUBSTRATE STACKS The invention relates to a retaining system for handling substrate stacks, including a retaining surface for retaining a first substrate, and one or more... |
| 2018/0190535 |
Apparatus And Methods For Wafer Rotation To Improve Spatial ALD Process
Uniformity Apparatus and methods for rotating wafers during processing include a wafer rotation assembly with a support fixture connected to a shaft and a wafer transfer... |
| 2018/0190534 |
SUBSTRATE HOLDER, A LITHOGRAPHIC APPARATUS AND METHOD OF MANUFACTURING
DEVICES A substrate holder for use in a lithographic apparatus and configured to support a substrate, the substrate holder including: a main body having a main body... |
| 2018/0190533 |
PEELING METHOD, SEMICONDUCTOR DEVICE, AND PEELING APPARATUS To improve peelability, yield in a peeling step, and yield in manufacturing a flexible device. A peeling method is employed which includes a first step of... |
| 2018/0190532 |
FILM FOR SEMICONDUCTOR BACK SURFACE Provided is a film for semiconductor protection, which can prevent warpage in a semiconductor wafer or a semiconductor chip and can also prevent the occurrence... |
| 2018/0190531 |
SEMICONDUCTOR PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS A package structure and a method for fabricating thereof are provided. The package structure includes a substrate, a first connector, a redistribution layer, a... |
| 2018/0190530 |
Frame mounting after foil expansion An apparatus which comprises an expansion unit configured for expanding a foil, and a mounting unit configured for subsequently mounting the expanded foil on a... |
| 2018/0190529 |
ELECTROSTATIC CHUCK HEATER An electrostatic chuck heater includes an electrostatic chuck in which an electrostatic electrode is embedded in a ceramic sintered body; a small-zone... |
| 2018/0190528 |
ELECTROSTATIC CHUCK ASSEMBLY FOR HIGH TEMPERATURE PROCESSES An electrostatic chuck assembly includes a puck and a cooling plate. The puck includes an electrically insulative upper puck plate comprising one or more... |
| 2018/0190527 |
ELECTROSTATIC CHUCK An electrostatic chuck includes a dielectric layer including an oriented alumina sintered body having a degree of c-plane orientation of 5% or more, the degree... |
| 2018/0190526 |
SUBSTRATE SUPPORT WITH IMPROVED PROCESS UNIFORMITY A substrate support for supporting a substrate in a substrate processing system includes a baseplate and a ceramic layer arranged above the baseplate. An outer... |
| 2018/0190525 |
BOWING SEMICONDUCTOR WAFERS Methods for processing semiconductor wafers, methods for loading semiconductor wafers into wafer carriers, and semiconductor wafer carriers. The methods and... |
| 2018/0190524 |
SEMICONDUCTOR WAFER CARRIERS Semiconductor wafer carriers, methods for manufacturing the semiconductor wafer carriers, and methods for using the semiconductor wafer carriers. The... |
| 2018/0190523 |
Substrate Breakage Detection in a Thermal Processing System Apparatus, systems, and processes for substrate breakage detection in a thermal processing system are provided. In one example implementation, a process can... |
| 2018/0190522 |
WAFER CARRIER A wafer carrier including a case having an opening at one end, slots disposed in the case and receiving wafers, and a wireless communication circuitry disposed... |
| 2018/0190521 |
SUBSTRATE PROCESSING APPARATUS Disclosed is a substrate processing apparatus including: n (n is an integer of 4 or more) vacuum processing modules each provided with a vacuum container for... |
| 2018/0190520 |
COMPOSITE HEAT-DISSIPATING SUBSTRATE The present invention provides a composite heat-dissipating substrate structure, comprising: a heat-dissipating substrate and a heat-conducting metal layer.... |
| 2018/0190519 |
GAS SUPPLY DEVICE AND SUBSTRATE PROCESSING APPARATUS A gas supply device of supplying a gas into a processing space from a gas supply source includes a facing plate that faces the processing space and includes... |
| 2018/0190518 |
APPARATUS FOR FIELD GUIDED ACID PROFILE CONTROL IN A PHOTORESIST LAYER Implementations described herein relate to apparatus and methods for processing a substrate. More specifically, a process chamber having movable electrodes for... |
| 2018/0190517 |
RECIPE SELECTABLE DISPENSE SYSTEM AND METHOD OF OPERATING An apparatus for cleaning a microelectronic workpiece and a method of operating is described. The apparatus includes a workpiece holding mechanism to support... |
| 2018/0190516 |
COATING METHOD OF NON-NEWTONIAN FLUID MATERIAL AND COATING SYSTEM THEREOF A coating method of a non-Newtonian fluid material and a coating system thereof are provided. The coating method includes the following steps. An equation of... |
| 2018/0190515 |
SUBSTRATE PROCESSING DEVICE A substrate processing device (10) for processing a plurality of substrates disposed at predetermined intervals includes a processing bath (12) that is... |
| 2018/0190514 |
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE
MANUFACTURED THEREBY An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide methods of making an... |
| 2018/0190513 |
SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR PACKAGE AND STACKED
SEMICONDUCTOR PACKAGES A semiconductor packaging method, a semiconductor package and stacked semiconductor packages are provided. The method includes providing a carrier (10) having... |
| 2018/0190512 |
METHOD FOR MANUFACTURING AN ENCAPSULATION COVER FOR AN ELECTRONIC PACKAGE
AND ELECTRONIC PACKAGE COMPRISING A COVER A method for manufacturing a cover for an electronic package includes placing an insert having opposite faces between opposite faces of a cavity of a mold. A... |
| 2018/0190511 |
METHOD FOR MANUFACTURING A COVER FOR AN ELECTRONIC PACKAGE AND ELECTRONIC
PACKAGE COMPRISING A COVER A method for manufacturing a cover for an electronic package includes placing an electrically conductive insert (including an electrical contact surface)... |
| 2018/0190510 |
LOW COST PACKAGE WARPAGE SOLUTION Embodiments of the invention include device packages and methods of forming such packages. In an embodiment, the method of forming a device package may... |
| 2018/0190509 |
INTEGRATED CIRCUIT PACKAGE MOLD ASSEMBLY An integrated circuit ("IC") package mold includes an upper mold platen that defines an upper mold cavity for receiving an upper substrate having a die attach... |
| 2018/0190508 |
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE A silicon oxide film having at least one opening portion is formed, on a silicon substrate. A structural member formed of a material less prone to be etched by... |
| 2018/0190507 |
MANUFACTURING METHOD OF A CHIP PACKAGE STRUCTURE A manufacturing method of a chip package structure is provided. Firstly, a conductive frame including a bottom plate and a plurality of partition plates is... |
| 2018/0190506 |
COMPOSITION AND METHOD FOR POLISHING SILICON CARBIDE The invention provides a chemical-mechanical polishing composition comprising (a) silica particles, (b) a polymer comprising sulfonic acid monomeric units, (c)... |
| 2018/0190505 |
METHOD OF SELECTIVELY ETCHING SILICON OXIDE FILM ON SUBSTRATE An etching method including: (a) providing a workpiece including a first region made of a first material and a second region made of a second material defining... |
| 2018/0190504 |
SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME In a method of manufacturing a semiconductor device, an interlayer dielectric (ILD) layer is formed over an underlying structure. The underlying structure... |
| 2018/0190503 |
LOW ROUGHNESS EUV LITHOGRAPHY Provided herein are methods and related apparatus to smooth the edges of features patterned using extreme ultraviolet (EUV) lithography. In some embodiments,... |
| 2018/0190502 |
PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD A plasma processing apparatus includes a plasma processing chamber processing a sample using plasma, a radio frequency power supply supplying radio frequency... |
| 2018/0190501 |
PLASMA PROCESSING APPARATUS Disclosed is a plasma processing apparatus including: a first placing table including a placing surface configured to place thereon a workpiece serving as a... |
| 2018/0190500 |
METHOD FOR ETCHING MULTILAYER FILM In a method for etching a multilayer film of a target object by using a plasma processing apparatus, the multilayer film of the target object includes a layer... |
| 2018/0190499 |
METHOD FOR FABRICATING METAL GATE STRUCTURE A method for fabricating a metal gate structure includes following steps. A substrate is provided and followed by forming a high-K dielectric layer on the... |
| 2018/0190498 |
MEMORY DEVICE AND METHOD OF OPERATING THE SAME Provided herein may be a memory device and a method of operating the same. The memory device may include a memory block including a plurality of pages, and... |
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