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Patent # Description
2019/0067289 SEMICONDUCTOR MEMORY DEVICE HAVING AN ELECTRICALLY FLOATING BODY TRANSISTOR
An IC may include an array of memory cells formed in a semiconductor, including memory cells arranged in rows and columns, each memory cell may include a...
2019/0067288 Memory Circuitry
In some embodiments, memory circuitry comprises a pair of immediately-adjacent memory arrays having space laterally there-between. The memory arrays...
2019/0067287 SEMICONDUCTOR DEVICE WITH FIN FIELD EFFECT TRANSISTORS
A semiconductor device includes a substrate with a NMOS region and a PMOS region, a device isolation layer on the substrate to define active fins, and gate...
2019/0067286 SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
Semiconductor structures and fabrication methods are provided. An exemplary fabrication method includes providing a base substrate including a plurality of...
2019/0067285 SEMICONDUCTOR DEVICES AND METHOD OF FABRICATING THE SAME
A semiconductor device and a method of fabricating a semiconductor device, the device including a substrate; an active pattern spaced apart from the substrate...
2019/0067284 Hybrid Scheme for Improved Performance for P-type and N-type FinFETs
A method includes etching a hybrid substrate to form a recess extending into the hybrid substrate. The hybrid substrate includes a first semiconductor layer...
2019/0067283 FIN FIELD-EFFECT TRANSISTOR STRUCTURE AND METHOD FOR FORMING THE SAME
A fin field-effect transistor (FinFET) structure and a method for forming the same are provided. The FinFET structure includes a first fin structure that...
2019/0067282 BOUNDARY REGION FOR HKMG INTEGRATION TECHNOLOGY
The present disclosure relates to an integrated circuit (IC) that includes a boundary region defined between a low voltage region, and a method of formation....
2019/0067281 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
A semiconductor device includes a first active area of a first type, a second active area of a second type, and a plurality of gates. The gates are arranged...
2019/0067280 STACKED COMPLEMENTARY JUNCTION FETS FOR ANALOG ELECTRONIC CIRCUITS
A semiconductor device comprises a substrate, a first source/drain region on the substrate, a first channel region extending vertically with respect to the...
2019/0067279 Methods of Gate Replacement in Semiconductor Devices
A method of forming a semiconductor device includes forming a plurality of fins on a substrate, forming a polysilicon gate structure, and replacing the...
2019/0067278 SEMICONDUCTOR DEVICE INCLUDING A GATE INSULATION PATTERN AND A GATE ELECTRODE PATTERN
A semiconductor device includes a substrate including an active region defined by a device isolation layer. A word line structure is in a trench formed in an...
2019/0067277 Cut Metal Gate with Slanted Sidewalls
A semiconductor device includes a substrate, first and second fins protruding out of the substrate, and first and second high-k metal gates (HK MG) disposed...
2019/0067276 FINFET ISOLATION STRUCTURE AND METHOD FOR FABRICATING THE SAME
Embodiments of the disclosure provide a semiconductor device including a substrate, an insulating layer formed over the substrate, a plurality of fins formed...
2019/0067275 LOGIC GATE CELL STRUCTURE
A logic gate cell structure is disclosed. The logic gate cell structure includes a substrate, a channel layer disposed over the substrate, and a field-effect...
2019/0067274 PROCESS FOR FABRICATING CAPACITIVE ELEMENTS IN TRENCHES
A capacitive element is fabricated by forming a sacrificial trench isolation and directionally etching through the sacrificial trench isolation and into an...
2019/0067273 SEMICONDUCTOR DEVICE
Improving reliability of a semiconductor device including a transistor and resistance portion. Providing a semiconductor device including: a transistor...
2019/0067272 FILTER CIRCUIT BASED ON A MOS FIELD EFFECT TRANSISTOR AND CHIP INCLUDING THE SAME
Some embodiments of the application provide a filter circuit that is based on a MOS field effect transistor and a chip including the same. The filter circuit...
2019/0067271 CIRCUIT-PROTECTION DEVICES
Circuit-protection devices may include first and second circuit-protection units, a first gate having a first source/drain connected to a first node of the...
2019/0067270 ELECTRO-STATIC DISCHARGE TRANSISTOR ARRAY APPARATUS
The present application discloses an electro-static discharge (ESD) transistor array apparatus, and relates to the field of semiconductor technologies. The ESD...
2019/0067269 TVS SEMICONDUCTOR DEVICE AND METHOD THEREFOR
In one embodiment, a TVS semiconductor device includes a P-N diode that is connected in parallel with a bipolar transistor wherein a breakdown voltage of the...
2019/0067268 LAYOUT PATTERN FOR SRAM AND MANUFACTURING METHODS THEREOF
The present invention provides a layout pattern of a static random access memory (SRAM). The layout pattern includes a first inverter and a second inverter...
2019/0067267 MOTOR DRIVE CIRCUIT, SEMICONDUCTOR APPARATUS, AND ELECTRONIC DEVICE
An H bridge circuit that is connected to nodes N1 and N2 for a power source and nodes N3 and N4 for a motor includes: a PchMOS transistor that is disposed in...
2019/0067266 ELECTRONIC DEVICE INCLUDING A TRANSISTOR HAVING STRUCTURES WITH DIFFERENT CHARACTERISTICS
An electronic device can include a transistor having a gate electrode, a first portion, and a second portion, wherein along the gate electrode, the first...
2019/0067265 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
A semiconductor device includes a substrate including a first region and a second region, memory transistors on the first region, a first interconnection layer...
2019/0067264 MEMORY ARRAY CIRCUIT AND METHOD OF MANUFACTURING THE SAME
A memory array includes a column of cells arranged along a first direction and a bit line extending along the first direction over the column of cells. The...
2019/0067263 LEVEL SHIFTER SPARE CELL
A method for configuring level shifter spare cells includes providing a power rail connectable to a corresponding power domain, and providing a spare cell...
2019/0067262 SRAM STRUCTURE WITH ALTERNATE GATE PITCHES
The present disclosure relates to semiconductor structures and, more particularly, to a SRAM structure with alternate gate pitches and methods of manufacture....
2019/0067261 INTEGRATED PASSIVE COMPONENT AND METHOD FOR MANUFACTURING THE SAME
An integrated passive component comprises a capacitor, a first passivation layer, an inductor, an insulation layer and an external contact. The first...
2019/0067260 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
A semiconductor device includes: an interposer mounted on an upper surface of a printed board; a first semiconductor element mounted on an upper surface of the...
2019/0067259 ELECTRONIC UNIT
The present invention relates to an electronic unit having at least one first electronic component and one second electronic component that are fastened to a...
2019/0067258 SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Disclosed are a semiconductor package and a method of fabricating the same. The semiconductor package comprises a lower semiconductor chip on a lower...
2019/0067257 LIGHT-EMITTING DIODE (LED) DEVICE
A light-emitting diode (LED) device configured to provide a multi-color display includes a plurality of light-emitting cells at least partially defined by a...
2019/0067256 LIGHT-EMITTING DEVICE
A light-emitting device includes: a light-emitting element that includes a light-transmissive substrate having a first surface and a second surface opposite to...
2019/0067255 LIGHT-EMITTING ELEMENT PACKAGE AND DISPLAY DEVICE HAVING SAME
An embodiment relates to a light emitting element package and display device. The light emitting element package according to the embodiment comprises: a...
2019/0067254 PIXEL ELEMENTS INCLUDING LIGHT EMITTERS OF VARIABLE HEIGHTS
A head-mounted display (HMD) presents viewable media to a user. The HMD includes a light source and an optical block. The light source includes a first...
2019/0067253 STACKED SEMICONDUCTOR DIES INCLUDING INDUCTORS AND ASSOCIATED METHODS
Semiconductor devices, systems including semiconductor devices, and methods of making and operating semiconductor devices. Such semiconductor devices can...
2019/0067252 METHODS AND SYSTEMS FOR IMPROVING POWER DELIVERY AND SIGNALING IN STACKED SEMICONDUCTOR DEVICES
Semiconductor die assemblies including stacked semiconductor dies having parallel plate capacitors formed between adjacent pairs of semiconductor dies in the...
2019/0067251 ELECTRONIC DEVICE
An improvement is achieved in the heat dissipation property of an electronic device including power transistors. A semiconductor module includes first and...
2019/0067250 SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
A semiconductor device includes a base including interconnects, a first semiconductor chip including a first semiconductor element portion, and a second...
2019/0067249 POP DEVICE AND METHOD OF FORMING THE SAME
A PoP device includes a first package structure, a second package structure and an underfill layer is provided. The first package structure includes a die, a...
2019/0067248 SEMICONDUCTOR DEVICE HAVING LATERALLY OFFSET STACKED SEMICONDUCTOR DIES
Semiconductor devices including stacked semiconductor dies and associated systems and methods are disclosed herein. In one embodiment, a semiconductor device...
2019/0067247 DUAL SIDED FAN-OUT PACKAGE HAVING LOW WARPAGE ACROSS ALL TEMPERATURES
Semiconductor devices including a dual-sided redistribution structure and having low-warpage across all temperatures and associated systems and methods are...
2019/0067246 SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
A semiconductor structure includes a substrate, a stack of alternate conductive layers and insulating layers, a hole, and an active structure. The stack is...
2019/0067245 INTEGRATED SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING THE SAME
Integrated semiconductor assemblies and associated methods of manufacturing are disclosed herein. In one embodiment, a semiconductor device assembly comprises...
2019/0067244 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
A semiconductor structure includes a substrate; a first die disposed over the substrate; a second die disposed over the substrate; a molding disposed over the...
2019/0067243 APPARATUS AND METHOD FOR MANUFACTURING PLURALITY OF ELECTRONIC CIRCUITS
A method of manufacturing a plurality of electronic circuits is disclosed. Each electronic circuit comprises a respective first portion, comprising a...
2019/0067242 Method for Fabricating Bump Structures on Chips with Panel Type Process
A method for fabricating bump structures on chips with a panel type process is provided. First, a panel type substrate is provided. Semiconductor chips are...
2019/0067241 Semiconductor Device and Method of Forming Insulating Layers Around Semiconductor Die
A semiconductor device has a semiconductor wafer including a plurality of semiconductor die and a plurality of contact pads formed over a first surface of the...
2019/0067240 FLEXIBLE DISPLAY PANEL AND PREPARATION METHOD THEREOF, FLEXIBLE DISPLAY DEVICE
A flexible display panel, a preparation method thereof and a flexible display device are provided. The flexible display panel includes a flexible substrate; a...
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