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Patent # Description
2019/0067086 SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
A method of fabricating a semiconductor package includes providing a substrate having at least one contact and forming a redistribution layer on the substrate....
2019/0067085 SEMICONDUCTOR ON INSULATOR STRUCTURE COMPRISING A PLASMA NITRIDE LAYER AND METHOD OF MANUFACTURE THEREOF
A method is provided for preparing a semiconductor-on-insulator structure comprising a silicon nitride layer deposited by plasma deposition.
2019/0067084 Semiconductor Constructions Comprising Dielectric Material, and Methods of Forming Dielectric Fill Within...
Some embodiments include a semiconductor construction which has one or more openings extending into a substrate. The openings are at least partially filled...
2019/0067083 METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT FABRICATION
A method of semiconductor device fabrication includes providing a substrate having a hardmask layer thereover. The hardmask layer is patterned to expose the...
2019/0067082 METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE SUBSTRATE MANUFACTURED USING...
A method of manufacturing a semiconductor package substrate includes forming a trench and a post by etching an upper surface of a base substrate including a...
2019/0067081 WAFER EDGE PROTECTION FOR CRACK-FREE MATERIAL GROWTH
A method of fabricating a wafer is disclosed. The method includes forming a protective layer on a device side and a non-device side of a substrate of the...
2019/0067080 SEMICONDUCTOR MEMORY HAVING REDUCED INTERFERENCE BETWEEN BIT LINES AND WORD LINES
A flash memory device includes a substrate, a plurality of active regions and a plurality of first isolation regions alternately arranged in a first direction...
2019/0067079 PROTECTION OF LOW TEMPERATURE ISOLATION FILL
A semiconductor structure includes a plurality of semiconductor fins on an upper surface of a semiconductor substrate. The semiconductor fins spaced apart from...
2019/0067078 PROTECTION OF LOW TEMPERATURE ISOLATION FILL
A semiconductor structure includes a plurality of semiconductor fins on an upper surface of a semiconductor substrate. The semiconductor fins spaced apart from...
2019/0067077 SUBSTRATE INVERTING DEVICE, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE SUPPORTING DEVICE, AND SUBSTRATE...
A pair of guide parts of a substrate inverting device comes in contact with the peripheral edge portion of a substrate on both sides in the width direction of...
2019/0067076 VACUUM ADJUSTMENT DEVICE HAVING A COLLET COUPLING
A vacuum adjustment device having a coupling for coupling an active element and a drive unit is disclosed. The drive unit adjusts the coupling from a normal...
2019/0067075 SUBSTRATE GRIPPING HAND AND SUBSTRATE TRANSFER APPARATUS
A substrate gripping hand includes: a base plate on which a center line and a gripping position are defined; at least one fixed claw provided on the base plate...
2019/0067074 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
A semiconductor device manufacturing method includes: (A) orienting an upper surface of a semiconductor element which has the upper surface and a suction...
2019/0067073 SUBSTRATE HOLDING DEVICE
A substrate holding device includes robot arms, wherein the robot arm includes a supporting portion for supporting a substrate; a plurality of substrate...
2019/0067072 TAPE CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM
Introduced here are carrier tape assemblies that can improve efficiency and reduce costs when utilized in the handling, transport, or storage of semiconductor...
2019/0067071 MOMENT CANCELLING PAD RAISING MECHANISM IN WAFER POSITIONING PEDESTAL FOR SEMICONDUCTOR PROCESSING
An assembly used in a process chamber for depositing a film on a wafer including a pedestal assembly having a pedestal movably mounted to a main frame. A lift...
2019/0067070 ESC SUBSTRATE SUPPORT WITH CHUCKING FORCE CONTROL
Embodiments described herein provide methods and apparatus used to reduce or substantially eliminate undesirable scratches to the non-active surface of a...
2019/0067069 WAFER CONTACT SURFACE PROTRUSION PROFILE WITH IMPROVED PARTICLE PERFORMANCE
An electrostatic chuck with a generally non-arcuate top surface shaped protrusions that has edge surfaces similar to a portion of a ellipse. The structure of...
2019/0067068 Storage Rack
A storage rack includes: a plurality of supporting pillars and a platform on which an object to be stored is to be placed. The platform includes a platform...
2019/0067067 TOWER LIFT
A tower lift includes a main frame extending in a vertical direction, a movable frame configured to be movable in the vertical direction along the main frame,...
2019/0067066 SEMICONDUCTOR MANUFACTURING APPARATUS, WAFER CONVEYING APPARATUS AND WAFER CONVEYING METHOD
In one embodiment, a semiconductor manufacturing apparatus includes a container to contain wafers, and supporting tables provided in the container so as to be...
2019/0067065 Reticle Transfer System and Method
A method comprises transporting semiconductor devices between a global system and a local system, wherein an input terminal of the local system is connected to...
2019/0067064 SEPARATORS FOR HANDLING, TRANSPORTING, OR STORING SEMICONDUCTOR WAFERS
Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the...
2019/0067063 WAFER CONTAINER
A wafer container includes a container body and a door. The container body has a pair of upright side walls, a top wall, a bottom wall and a rear wall...
2019/0067062 SEPARATORS FOR HANDLING, TRANSPORTING, OR STORING SEMICONDUCTOR WAFERS
Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the...
2019/0067061 RIGID CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM
Introduced here are carrier trays that include an adhesive film affixed to a deck area. For example, the adhesive film may be integrally laminated onto the top...
2019/0067060 Identifying Nuisances and Defects of Interest in Defects Detected on a Wafer
Methods and systems fir identifying nuisances and defects of interest (DOIs) in defects detected on a wafer are provided. One method includes acquiring...
2019/0067059 SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
A semiconductor manufacturing apparatus and a method of manufacturing semiconductor device are provided. The semiconductor manufacturing apparatus includes a...
2019/0067058 APPARATUS AND METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEVICES
A method for predicting characteristics of semiconductor devices includes collecting first data for a plurality of first characteristics from first ...
2019/0067057 APPARATUS AND METHOD FOR INSPECTING WAFER CARRIERS
An apparatus for inspecting wafer carriers is disclosed. In one example, the apparatus includes: a housing having an opening on a wall of the housing; a load...
2019/0067056 PARALLEL TEST STRUCTURE
An exemplary apparatus includes a testing module connected to, and providing a test voltage to, an integrated circuit containing devices under test. The...
2019/0067055 TRANSFER DEVICE, SUBSTRATE PROCESSING APPARATUS, AND TRANSFER METHOD
A transfer device of an embodiment includes a transporter including a temperature sensor disposed thereon and configured to move between a measurement position...
2019/0067054 APPARATUS FOR TRANSFERRING SUBSTRATE AND APPARATUS FOR PROCESSING SUBSTRATE INCLUDING THE SAME
The inventive concepts provide apparatuses for transferring a substrate and/or apparatuses for processing a substrate including the same. The substrate...
2019/0067053 COLD FLUID SEMICONDUCTOR DEVICE RELEASE DURING PICK AND PLACE OPERATIONS, AND ASSOCIATED SYSTEMS AND METHODS
Systems and methods for releasing semiconductor dies during pick and place operations are disclosed. In one embodiment, a system for handling semiconductor...
2019/0067052 APPARATUS AND METHOD FOR SECURING COMPONENTS OF AN INTEGRATED CIRCUIT
Systems and methods of securing an integrated circuit assembly includes: arranging a plurality of securing elements within a plurality of orifices fabricated...
2019/0067051 LIGHT IRRADIATION TYPE HEAT TREATMENT APPARATUS AND HEAT TREATMENT METHOD
Pressure in a chamber receiving a semiconductor wafer is reduced to a level less than atmospheric pressure. The semiconductor wafer is subjected to heat...
2019/0067050 MULTI-BLADE AND PROCESSING METHOD OF WORKPIECE
A multi blade that processes semiconductor packages into a desired shape while dividing a package substrate includes plural cutting blades that divide the...
2019/0067049 RADIATIVE WAFER CUTTING USING SELECTIVE FOCUSING DEPTHS
Semiconductor wafer cutting is optimised by directing a plurality of laser beams at the wafer, with the laser beams being focused so that at least some of...
2019/0067048 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
A recovery route returns, to a retaining tank, mixed solution supplied to a substrate processing unit. A discarding route discards the supplied mixed solution...
2019/0067047 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
A substrate processing method includes a substrate holding step of holding a substrate horizontally, a processing liquid supply step of supplying a...
2019/0067046 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
A substrate processing method includes a substrate holding step of holding a substrate horizontally, a hydrophobic agent supplying step of supplying to an...
2019/0067045 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
A substrate processing method includes a substrate holding step of disposing a substrate at a position surrounded by a plurality of guards which have a first...
2019/0067044 WAFER SHIPPING BOX AND A LOWER RETAINING MEMBER THEREOF
A wafer shipping box includes a case and a positioning unit. The case includes a base, a cover, and a receiving space defined by the base and the cover. The...
2019/0067043 COATING PROCESSING APPARATUS AND COATING LIQUID COLLECTING MEMBER
A coating processing apparatus includes: a substrate holding part for horizontally holding a substrate and configured to rotate around a vertical axis; a...
2019/0067042 SEMICONDUCTOR MANUFACTURING SYSTEM AND CONTROL METHOD
A system includes a chamber, an inlet valve, and a control device. The chamber is configured to perform a semiconductor process. The inlet valve is coupled to...
2019/0067040 APPARATUS AND METHOD FOR HANDLING WAFER CARRIER DOORS
An apparatus for handling wafer carriers in a semiconductor fabrication facility (FAB) is disclosed. In one example, the apparatus includes: a table configured...
2019/0067039 INTEGRATED FAN-OUT PACKAGE
An integrated fan-out package includes a first redistribution structure, a die, an insulation encapsulation, and a second redistribution structure. The die is...
2019/0067038 THRUMOLD POST PACKAGE WITH REVERSE BUILD UP HYBRID ADDITIVE STRUCTURE
Semiconductor devices having a semiconductor die electrically coupled to a redistribution structure and a molded material over the redistribution structure are...
2019/0067037 FLIP-CHIP HIGH SPEED COMPONENTS WITH UNDERFILL
A flip-chip manufacture is described. Methods of blocking adhesive underfill in flip-chip high speed component manufacture include creating topology...
2019/0067036 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
A semiconductor package includes a die and a patterned conductive layer electrically connected to the die. The patterned conductive layer includes a connection...
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