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Patent # Description
2019/0088886 Organic Compound, Light-Emitting Element, Light-Emitting Device, Display Device, Electronic Device, and...
A novel organic compound that forms an exciplex emitting light with high efficiency is provided. An organic compound with a triarylamine skeleton in which the...
2019/0088885 ORGANIC COMPOUND AND PHOTOELECTRIC CONVERSION ELEMENT
Provided is an organic compound represented by the general formula [1]: ##STR00001## in the formula [1], R.sub.1 to R.sub.18 each represent a hydrogen atom, an...
2019/0088884 COMPOUNDS FOR ORGANIC LIGHT EMITTING DIODE MATERIALS
Described herein are molecules for use in organic light emitting diodes. Example compounds include molecules represented by structural formula (I). Values and...
2019/0088883 ORGANIC ELECTROLUMINESCENT ELEMENT
Provided is an organic EL device that exhibits high luminous efficiency and has high stability when driven despite having low voltage. The organic...
2019/0088882 LIGHT-EMITTING ELEMENT, DISPLAY DEVICE, ELECTRONIC DEVICE, AND LIGHTING DEVICE
A light-emitting element containing a light-emitting material with high light emission efficiency is provided. The light-emitting element includes a high...
2019/0088881 PHOTOELECTRIC CONVERSION ELEMENT AND RADIATION DETECTOR
According to one embodiment, a photoelectric conversion element includes a first conductive layer, a second conductive layer, an organic semiconductor layer,...
2019/0088880 PHOTOVOLTAIC ELEMENT
A photovoltaic element includes at least a cathode, a photoelectric conversion layer, a hole extraction layer, and an anode in this order, the hole extraction...
2019/0088879 COMPOUND, MATERIAL FOR ORGANIC ELECTROLUMINESCENCE DEVICES, ORGANIC ELECTROLUMINESCENCE DEVICE, AND ELECTRONIC...
A compound represented by formula (1) provides an organic electroluminescence device having a low driving voltage and an excellent emission efficiency: ...
2019/0088878 MATERIALS FOR ORGANIC ELECTROLUMINESCENT DEVICES
The present invention describes amines with dibenzofuran, dibenzothiophene and fluorene groups, especially for use as triplet matrix materials in organic...
2019/0088877 CONDENSED-CYCLIC COMPOUND, ELECTROLUMINESCENT DEVICE AND METHOD FOR MANUFACTURING THEREOF
A method for manufacturing a condensed-cyclic compound and an electroluminescent device is provided, the condensed-cyclic compound is represented by the...
2019/0088876 CORRELATED ELECTRON MATERIAL DEVICES USING DOPANT SPECIES DIFFUSED FROM NEARBY STRUCTURES
Subject matter disclosed herein may relate to fabrication of correlated electron materials used, for example, to perform a switching function. In embodiments,...
2019/0088875 ACCESS DEVICES TO CORRELATED ELECTRON SWITCH
Subject matter disclosed herein may relate to programmable fabrics including correlated electron switch devices.
2019/0088874 NON-VOLATILE MEMORY DEVICES, RRAM DEVICES AND METHODS FOR FABRICATING RRAM DEVICES WITH MAGNESIUM OXIDE...
Non-volatile memory (NVM) devices, resistive random access memory (RRAM) devices and methods for fabricating such devices are provided. In an exemplary...
2019/0088873 SEMICONDUCTOR STRUCTURES INCLUDING MEMORY MATERIALS SUBSTANTIALLY ENCAPSULATED WITH DIELECTRIC MATERIALS, AND...
A semiconductor structure includes stack structures. Each of the stack structures comprises a first conductive material, a chalcogenide material over the first...
2019/0088872 STORAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME
A storage device according to an embodiment includes a first conductive layer, a second conductive layer, and a resistance change layer. The resistance change...
2019/0088871 ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME
In a method for fabricating an electronic device including a semiconductor memory, the method includes: forming stack structures, each of the stack structures...
2019/0088870 MEMORY ELEMENT
According to one embodiment, a memory element includes a first layer, a second layer, and a third layer. The first layer is conductive. The second layer is...
2019/0088869 MEMORY DEVICE
A memory device includes a first conductive layer and a second conductive layer. A variable resistance layer is disposed between the first conductive layer and...
2019/0088868 MEMORY DEVICE
According to one embodiment, a memory device includes a nonvolatile memory element having a first resistance state and a second resistance state having a...
2019/0088867 PHASE CHANGE MEMORY STACK WITH TREATED SIDEWALLS
Memory devices and methods for fabricating memory devices have been disclosed. One such method includes forming the memory stack out of a plurality of...
2019/0088866 Multilayer Structure for Reducing Film Roughness in Magnetic Devices
A seed layer stack with a uniform top surface having a peak to peak roughness of 0.5 nm is formed by sputter depositing an amorphous layer on a smoothing layer...
2019/0088865 METHOD FOR MANUFACTURING MAGNETIC TUNNEL JUNCTION ELEMENT, AND INDUCTIVELY COUPLED PLASMA PROCESSING APPARATUS
There is provided a method for manufacturing a magnetic tunnel junction element which prevents properties degradation due to hydrogen ions, and to which RIE...
2019/0088864 METHOD OF MANUFACTURING A MAGNETORESISTIVE RANDOM ACCESS MEMORY DEVICE
A method of manufacturing an MRAM device including forming a first insulating interlayer and a lower electrode contact, the lower electrode contact extending...
2019/0088863 MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
A method for manufacturing a memory device is provided. The method includes forming a stack over a first portion of a bottom electrode layer, in which the...
2019/0088862 MAGNETIC MEMORY DEVICE
According to one embodiment, a magnetic memory device includes a conductive underlayer having an amorphous structure and containing at least one first...
2019/0088861 MAGNETORESISTIVE EFFECT ELEMENT AND METHOD OF MANUFACTURING THE SAME
According to one embodiment, a method of manufacturing a magnetoresistive-effect element includes: forming a second layer on a stack of layers, the stack of...
2019/0088860 MAGNETIC MEMORY
A magnetic memory according to an embodiment includes: first to third terminals; a nonmagnetic conductive layer including first to third regions, the second...
2019/0088859 MAGNETIC MEMORY DEVICE
According to one embodiment, a magnetic memory device includes a conductive layer, first and second magnetic layers, a first nonmagnetic layer and a...
2019/0088858 MAGNETIC MEMORY
According to one embodiment, a magnetic memory device includes a first conductive layer, a first magnetic layer, a first nonmagnetic layer, a second magnetic...
2019/0088857 SEMICONDUCTOR MEMORY DEVICE
A semiconductor memory device includes free magnetic pattern on a substrate, a reference magnetic pattern on the free magnetic pattern, the reference magnetic...
2019/0088856 MAGNETIC MEMORY DEVICE
According to one embodiment, a magnetic memory device includes a stacked structure, the stacked structure including a first magnetic layer having a variable...
2019/0088855 MAGNETIC MEMORY DEVICE
According to one embodiment, a magnetic memory device includes a lower region, and a stacked structure provided on the lower region, wherein the stacked...
2019/0088854 MEMORY DEVICE
A memory device includes a first element and a second element. The first element includes: first and second ferromagnets; a first nonmagnet; a first conductor;...
2019/0088853 MAGNETIC MEMORY CELL OF CURRENT PROGRAMMING TYPE
A memory cell, including a stack of: a conductive layer of a conductive material including a first chemical element; an oxide layer sufficiently thin to allow...
2019/0088852 PIEZOELECTRIC DEVICE
A piezoelectric device includes a piezoelectric vibrating piece, a ceramic base, a connection bump, and a step portion. The piezoelectric vibrating piece...
2019/0088851 MULTILAYER PIEZOELECTRIC ELEMENT AND VIBRATING DEVICE
A multilayer piezoelectric element includes a piezoelectric element body, a first internal electrode and a second internal electrode, a plurality of first...
2019/0088850 LAYERED BODY
A layered body includes: a polymer film (A), the polymer film (A) including an organic piezoelectric material having a weight average molecular weight of from...
2019/0088849 Ultrasound Transducer and Manufacturing Method Thereof
An ultrasound transducer used in an ultrasound system and a method of manufacturing the same are disclosed. The ultrasound transducer is manufactured by...
2019/0088848 THERMOELECTRIC CONVERSION MODULE AND THERMOELECTRIC CONVERSION ELEMENT
A thermoelectric conversion module applied to a heating source, comprising a plurality of thermoelectric conversion elements arranged adjacent to each other,...
2019/0088847 DISTRIBUTED THERMOELECTRICS WITH NON-UNIFORM THERMAL TRANSFER CHARACTERISTICS
A thermoelectric assembly includes a thermoelectric device that has varying distribution of p-n pellets in an in-plane direction that is configured to provide...
2019/0088846 ENERGY RECOVERY UNIT FOR VEHICLE USE
An energy recovery unit (8) for use in a vehicle exhaust system (6) comprises an inlet (24) for receiving exhaust gas from the exhaust system (6); an outlet...
2019/0088845 THERMOELECTRIC GENERATION SYSTEM
Disclosed is a thermoelectric generation system that generates electricity using waste heat from a steam condenser that exchanges heat with steam as cyclic...
2019/0088844 THERMOELECTRIC POWER GENERATION DEVICE AND METHOD FOR MANUFACTURING SAME
Each of a first outside plate and a second outside plate includes bent portions at its both ends in a direction perpendicular to a direction in which a...
2019/0088843 LIGHT-EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURE
An LED package for connection to a heat sink, the LED package comprising an LED structure having a first surface for emitting light and an opposite second...
2019/0088842 LED PACKAGE STRUCTURE AND MULTILAYER CIRCUIT BOARD
An LED package structure includes a multilayer circuit board, an LED chip, and a cover. The multilayer circuit board has a conductive layer, a first resin...
2019/0088841 LIGHT EMITTING DIODE PACKAGE
An LED package includes N number of first pins, six second pins and N number of LED units, where N is four or six. Each of the LED units includes first to...
2019/0088840 FLIP-CHIP SMT LEDS WITH VARIABLE NUMBER OF EMITTING SURFACES
A method to make light-emitting diode (LED) units include arranging LEDs in a pattern, forming an optically transparent spacer layer over the LEDs, forming an...
2019/0088839 LIGHT-EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME
A light-emitting diode (LED) package includes: a reflective structure including a cavity, a bottom portion having a through hole, and a sidewall portion...
2019/0088837 LIGHT EMITTING DEVICE PACKAGE AND LIGHT SOURCE APPARATUS
A light emitting device package can include first and second frames spaced apart from each other; a package body including a body portion between the first and...
2019/0088836 METHOD OF MANUFACTURING AN LED MODULE
The invention describes a method of manufacturing an LED module, comprising the steps of providing a translucent encapsulant comprising a number of layers to...
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