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Patent # Description
2019/0088532 Methods Of Forming One Or More Covered Voids In A Semiconductor Substrate
Some embodiments include methods of forming voids within semiconductor constructions. In some embodiments the voids may be utilized as microstructures for...
2019/0088531 IN-SITU APPARATUS FOR SEMICONDUCTOR PROCESS MODULE
Aspects of the present disclosure generally relate to apparatuses and methods for edge ring replacement in processing chambers. In one aspect, a carrier for...
2019/0088530 DUAL-BLADE ROBOT INCLUDING VERTICALLY OFFSET HORIZONTALLY OVERLAPPING FROG-LEG LINKAGES AND SYSTEMS AND METHODS...
A dual-blade robot having overlapping frog-leg linkages is disclosed. The robot includes first and second arms, coplanar with each other and each rotatably...
2019/0088529 APPARATUS AND METHOD FOR MANUFACTURING DISPLAY DEVICE
An apparatus for manufacturing a display device and a method for manufacturing a display device are provided. According to an exemplary embodiment of the...
2019/0088528 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
A method for manufacturing a semiconductor device includes at least the following three steps: (A) A step of preparing a structure including a semiconductor...
2019/0088527 METHOD AND APPARATUS FOR STACKING DEVICES IN AN INTEGRATED CIRCUIT ASSEMBLY
Methods and apparatuses for stacking devices in an integrated circuit assembly are provided. A tray for supporting multiple dies of a semiconductor material...
2019/0088526 MICRO-TRANSFER-PRINTABLE FLIP-CHIP STRUCTURES AND METHODS
In certain embodiments, a method of making a semiconductor structure suitable for transfer printing (e.g., micro-transfer printing) includes providing a...
2019/0088524 Support Substrates, Methods of Fabricating Semiconductor Packages Using the Same, and Methods of Fabricating...
Disclosed are support substrates, methods of fabricating semiconductor packages using the same, and methods of fabricating electronic devices using the same....
2019/0088523 PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
A plasma processing apparatus includes a base, an electrostatic chuck provided on the base, and a dielectric layer. A bias power, whose magnitude is changed...
2019/0088522 SYSTEM FOR COUPLING A VOLTAGE TO SPATIALLY SEGMENTED PORTIONS OF THE WAFER WITH VARIABLE VOLTAGE
The present disclosure generally relates to plasma assisted or plasma enhanced processing chambers. More specifically, embodiments herein relate to...
2019/0088521 SYSTEM FOR COUPLING A VOLTAGE TO PORTIONS OF A SUBSTRATE
The present disclosure generally relates to plasma assisted or plasma enhanced processing chambers. More specifically, embodiments herein relate to...
2019/0088520 SUBSTRATE SUPPORT WITH MULTIPLE EMBEDDED ELECTRODES
A method and apparatus for biasing regions of a substrate in a plasma assisted processing chamber are provided. Biasing of the substrate, or regions thereof,...
2019/0088519 SUBSTRATE SUPPORT WITH DUAL EMBEDDED ELECTRODES
Embodiments described herein generally relate to plasma assisted or plasma enhanced processing chambers. More specifically, embodiments herein relate to...
2019/0088518 SUBSTRATE SUPPORT WITH COOLED AND CONDUCTING PINS
Embodiments described herein generally relate to plasma assisted or plasma enhanced processing chambers. More specifically, embodiments herein relate to...
2019/0088517 ELECTROSTATIC CHUCK DEVICE
An aspect of the present invention has an object to provide an electrostatic chuck device which is provided with a plurality of divided heaters and in which...
2019/0088516 CHIP BONDING APPARATUS AND METHOD
A chip bonding device is disclosed, including a first motion stage (110), a second motion stage (200), a chip pickup element (160), a transfer carrier (170), a...
2019/0088515 SYSTEM AND METHOD FOR CONTROLLING SEMICONDUCTOR MANUFACTURING FACILITY, METHOD OF MANUFACTURING INTEGRATED...
A method for controlling a semiconductor manufacturing facility includes measuring output change amounts of differential pressure sensors in the facility when...
2019/0088514 Recipe Optimization Based Zonal Analysis
Metrology methods and modules are provided, which comprise carrying out recipe setup procedure(s) and/or metrology measurement(s) using zonal analysis with...
2019/0088513 LIGHT IRRADIATION TYPE HEAT TREATMENT APPARATUS
A semiconductor wafer held by a susceptor in a chamber is irradiated with halogen light radiated from a plurality of halogen lamps to be heated. A stainless...
2019/0088512 Cooled Focus Ring for Plasma Processing Apparatus
A pedestal assembly for use in a plasma processing apparatus for processing a substrate includes a baseplate. The pedestal assembly can further include a puck...
2019/0088511 METHOD OF PROCESSING SUBSTRATE AND SUBSTRATE PROCESSING APPARATUS
A liquid of a hydrophobizing agent is supplied to a surface of a substrate to form a liquid film of the hydrophobizing agent that covers an entire surface...
2019/0088510 SUBSTRATE CLEANING DEVICE, SUBSTRATE CLEANING METHOD, SUBSTRATE PROCESSING DEVICE, AND SUBSTRATE DRYING DEVICE
High-performance substrate cleaning apparatus, substrate cleaning method, substrate processing apparatus, and substrate drying apparatus are provided. A...
2019/0088509 BREAK-IN APPARATUS, BREAK-IN SYSTEM AND STORAGE MEDIA
A break-in apparatus 100 has a supply unit 20 for supplying a cleaning liquid, a substrate support unit 30 for holding a dummy substrate W1 and a cleaning...
2019/0088508 WAFER PROCESSING APPARATUS AND METHOD
Disclosed is a wafer processing apparatus and method. The wafer processing apparatus comprises a chamber, which is a sealed structure having an openable...
2019/0088507 GAS FLOATED WORKPIECE SUPPORTING APPARATUS AND NONCONTACT WORKPIECE SUPPORT METHOD
An apparatus for conveying a substrate includes a base along which the substrate is conveyed, a first upward gas ejecting section, a second upward gas ejecting...
2019/0088506 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
A semiconductor package includes: (1) a first die; (2) conductive pads electrically connected to the first die, and each of the conductive pads having a lower...
2019/0088505 STACK PACKAGE AND METHODS OF MANUFACTURING THE SAME
A stack package and a method of manufacturing the stack package are provided. The method includes: attaching a first semiconductor device onto a first surface...
2019/0088504 WAFER LEVEL PACKAGE AND METHOD OF ASSEMBLING SAME
A method of of assembling semiconductor devices includes attaching semiconductor dies to a carrier, where backsides of the dies are attached to the carrier,...
2019/0088503 THERMOSONICALLY BONDED CONNECTION FOR FLIP CHIP PACKAGES
A method of making a package is disclosed. The method may include forming bond pads on a first surface of a substrate, forming leads in the substrate by...
2019/0088502 SEMICONDUCTOR DEVICE AND MANUFACTURING MEHOD THEREOF
A semiconductor device and a manufacturing method thereof are provided. The manufacturing method includes the following steps. A core structure and a first...
2019/0088501 LAMINATE, ETCHING MASK, METHOD OF PRODUCING LAMINATE, METHOD OF PRODUCING ETCHING MASK, AND METHOD OF PRODUCING...
A laminate by using a paste or solution containing aliphatic polycarbonates having an etching mask function is provided. A method of producing a laminate of...
2019/0088500 INTERCONNECTS FORMED BY A METAL REPLACEMENT PROCESS
Methods of forming interconnects. An interconnect opening is formed in a dielectric layer. A first conductor layer composed of a first metal is formed in the...
2019/0088499 Semiconductor Device and Method
A method includes forming a metal gate structure over a first fin, where the metal gate structure is surrounded by a first dielectric material, and forming a...
2019/0088498 Semiconductor Device and Method of Manufacture
A semiconductor device and method of manufacture are provided. In some embodiments a divergent ion beam is utilized to implant ions into a capping layer,...
2019/0088497 PLASMA ETCHING METHOD AND PLASMA ETCHING APPARATUS
A plasma etching method for plasma-etching an object including an etching target film and a patterned mask. The plasma etching method includes a first step of...
2019/0088496 METHOD OF PROCESSING TARGET OBJECT
A method of processing a target object is provided. In the method, the target object including a first protrusion portion, a second protrusion portion, an...
2019/0088495 Systems and Methods for Perforation and Ohmic Contact Formation For GaN Epitaxial Lift-Off Using An Etch Stop Layer
Methods and systems for forming a device structure free of a substrate are described. Exemplary embodiments include a device structure comprising of device...
2019/0088494 DEEP PHOTOENHANCED WET MATERIAL ETCHING USING HIGH-POWER ULTRAVIOLET LIGHT EMITTING DIODES
Methods and systems for etching a substrate using photoenhanced wet etching techniques are described. At least one light emitting diode source is used to...
2019/0088493 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE, AND A SEMICONDUCTOR SUBSTRATE
According to one embodiment, there is provided a method of manufacturing a semiconductor device which includes forming an alignment mark in a planned cutting...
2019/0088492 Etching Solution for Selectively Removing Silicon-Germanium Alloy From a Silicon-Germanium/Silicon Stack During...
Described herein is an etching solution comprising water; oxidizer; water-miscible organic solvent; fluoride ion source; and optionally, surfactant. Such...
2019/0088491 SEMICONDUCTOR DEVICE INCLUDING A CAPACITOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
A method for manufacturing a semiconductor device includes providing a substrate structure. The method includes forming a lower sacrificial layer, a lower...
2019/0088490 METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT AND A SEMICONDUCTOR COMPONENT
A method for manufacturing a semiconductor component including: providing a flat carrier with an upper side and a lower side, the carrier including a...
2019/0088489 Methods of Depositing Metal Films Using Metal Oxyhalide Precursors
Processing methods comprising exposing a substrate to an optional nucleation promoter followed by sequential exposure of a first reactive gas comprising a...
2019/0088488 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Provided is a method for fabricating a semiconductor device, which includes the following steps. First, a substrate having at least one transistor is provided....
2019/0088487 EMBEDDED SONOS WITH TRIPLE GATE OXIDE AND MANUFACTURING METHOD OF THE SAME
A method to integrate silicon-oxide-nitride-oxide-silicon (SONOS) transistors into a complementary metal-oxide-semiconductor (CMOS) flow including a triple...
2019/0088486 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
A manufacturing method of a semiconductor device includes the following steps. A first conductive layer, a first oxide layer, and a hardmask layer are...
2019/0088485 METHOD AND APPARATUS FOR SELECTIVE NITRIDATION PROCESS
Embodiments of the disclosure provide an improved apparatus and methods for nitridation of stacks of materials. In one embodiment, a method for processing a...
2019/0088484 SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME
A method of fabricating a semiconductor structure includes providing a semiconductor substrate, forming a trench in the semiconductor substrate, overfilling...
2019/0088483 PROCESS OF FORMING ELECTRON DEVICE HAVING GATE ELECTRODE
A process of forming a gate electrode in an electrode device is disclosed. The process includes steps of, depositing an insulating film on a nitride...
2019/0088482 Doping Method
A first dose of first dopants is introduced into a semiconductor body having a first surface. A thickness of the semiconductor body is increased by forming a...
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