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Patent # Description
2019/0096947 IMAGE SENSORS WITH LIGHT CHANNELING REFLECTIVE LAYERS THEREIN
An image sensor includes a two-dimensional array of image sensor pixels, which are formed in a semiconductor layer. Each image sensor pixel is formed in a...
2019/0096946 IMAGING APPARATUS, METHOD OF MANUFACTURING THE SAME, AND DEVICE
An imaging apparatus includes a substrate including a photoelectric conversion portion; and a silicon nitride layer arranged to cover at least a portion of the...
2019/0096945 Multi-Pixel Detector And Associated Method For Increasing Angular Sensitivity
An image sensor includes a multi-pixel detector. The multi-pixel detector includes a first pixel formed in a substrate and having a first photodiode region, a...
2019/0096944 SOLID-STATE IMAGE PICKUP DEVICE AND MANUFACTURING METHOD OF THE SAME
First bumps and second bumps are arranged on a substrate. Top surfaces in a desired positional relationship are formed by pressing the bumps by a pressing...
2019/0096943 IMAGE SENSORS WITH DIFFRACTIVE LENSES FOR STRAY LIGHT CONTROL
An image sensor may include an array of imaging pixels. Each imaging pixel may have a photosensitive area that is covered by a microlens and a diffractive lens...
2019/0096942 IMAGE SENSORS WITH DIFFRACTIVE LENSES
An image sensor may include an array of imaging pixels. Each imaging pixel may have a photosensitive area that is covered by a respective diffractive lens to...
2019/0096941 SOLID STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
A solid state imaging device including: a pixel region that is formed on a light incidence side of a substrate and to which a plurality of pixels that include...
2019/0096940 SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD THEREOF, AND CAMERA WITH ALTERNATIVELY ARRANGED PIXEL COMBINATIONS
A solid-state imaging device includes a semiconductor substrate; and a pixel unit having a plurality of pixels on the semiconductor substrate, wherein the...
2019/0096939 Image Sensor, Color Filter Array, and Preparation Method Thereof
The present disclosure provides an image sensor, a color filter array, and a preparation method thereof. The method includes: etching a photosensitive array...
2019/0096938 HIGH RELIABILITY HOUSING FOR A SEMICONDUCTOR PACKAGE
Implementations of semiconductor packages may include: a substrate coupled to one or more die and to one or more connectors, a glass lid coupled over one or...
2019/0096937 Semiconductor Switching Device Separated by Device Isolation
A device including a gate structure formed over a semiconductor substrate, the gate structure having extensions, a device isolation structure formed into the...
2019/0096936 SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING SOLID-STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS
A solid-state imaging device including an imaging area where a plurality of unit pixels are disposed to capture a color image, wherein each of the unit pixels...
2019/0096935 SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING SOLID-STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS
A solid-state imaging device including an imaging area where a plurality of unit pixels are disposed to capture a color image, wherein each of the unit pixels...
2019/0096934 SKILL-BASED PROGRESSIVE INTERLEAVED WAGERING SYSTEM
A skill-based progressive interleaved wagering system is disclosed, including an interactive controller connected to an application controller, and configured...
2019/0096933 SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE
The present technology relates to a solid-state imaging device and an electronic device that can expand a dynamic range in a pixel having a high-sensitivity...
2019/0096932 SOLID STATE IMAGE SENSOR WITH ON-CHIP FILTER AND EXTENDED SPECTRAL RESPONSE
Various embodiments are directed to an image sensor that includes a first sensor portion and a second sensor portion. The second sensor portion may be...
2019/0096931 MEMBER FOR SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTURING SOLID-STATE IMAGE PICKUP DEVICE
A member for a solid-state image pickup device having a bonding plane with no gaps and a method for manufacturing the same are provided. The manufacturing...
2019/0096930 SEMICONDUCTOR IMAGE SENSOR
A BSI image sensor includes a substrate including a front side and a back side opposite to the front side, and a plurality of pixel sensors arranged in an...
2019/0096929 BACK-SIDE DEEP TRENCH ISOLATION (BDTI) STRUCTURE FOR PINNED PHOTODIODE IMAGE SENSOR
The present disclosure relates to a CMOS image sensor having a photodiode surrounded by a back-side deep trench isolation (BDTI) structure, and an associated...
2019/0096928 ULTRAVIOLET LIGHT RECEIVING ELEMENT AND METHOD OF MANUFACTURING ULTRAVIOLET LIGHT RECEIVING ELEMENT
Provided is an ultraviolet light receiving element capable of reducing visible light sensitivity. The ultraviolet light receiving element includes: a first...
2019/0096927 MANUFACTURING METHOD OF THIN FILM TRANSISTOR AND MASK
A manufacturing method of a thin film transistor is provided, which comprising the steps of: providing a substrate which includes a film layer; coating a...
2019/0096926 POLY-SILICON THIN FILM AND METHOD FOR FABRICATING THE SAME, AND THIN FILM TRANSISTOR AND METHOD FOR FABRICATING...
Embodiments of this disclosure provide a thin film of poly-silicon and a method for fabricating the same, and a thin film transistor and a method for...
2019/0096925 DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
A display device includes a substrate, a buffer layer on the substrate, a first semiconductor layer of a first transistor on the buffer layer, a first...
2019/0096924 METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY DEVICE
A method for manufacturing a display panel, a display panel, and a display device are provided. The method includes: forming a plurality of gate lines and a...
2019/0096923 DISPLAY PANEL AND DISPLAY DEVICE
The present disclosure provides a display panel including a display area and a non-display area, a base substrate, a plurality of thin film transistors, a...
2019/0096922 DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME
This display device is provided with: a circuit substrate having a display region and a non-display region; pixel-driving TFTs for driving pixels, formed in...
2019/0096921 DISPLAY DEVICE AND ELECTRONIC DEVICE
A transistor whose channel region includes an oxide semiconductor is used as a pull down transistor. The band gap of the oxide semiconductor is 2.0 eV or more,...
2019/0096920 ARRAY SUBSTRATE, METHOD OF MANUFACTURING THE SAME AND DISPLAY DEVICE
an array substrate, a method of manufacturing the array substrate, and a display device are provided. The array substrate includes: a base substrate; a first...
2019/0096919 ACTIVE MATRIX SUBSTRATE, LIQUID CRYSTAL DISPLAY DEVICE, ORGANIC ELECTROLUMINESCENT DISPLAY DEVICE AND METHOD...
An active matrix substrate (100) according to an embodiment of the present invention has a display region (DR) defined by a plurality of pixel regions (P)...
2019/0096918 AN ARRAY SUBSTRATE, MASK PLATE AND ARRAY SUBSTRATE MANUFACTURING METHOD
This invention provides a kind array substrate, includes a substrate, a thin film transistor layer disposed on the substrate, and a planarization layer...
2019/0096917 SEMICONDUCTOR DIODES EMPLOYING BACK-SIDE SEIMCONDUCTOR OR METAL
Integrated circuit (IC) strata including one or more transistor and one or more semiconductor diode. A transistor may include one or more non-planar...
2019/0096916 ULTRA-THIN-BODY GaN ON INSULATOR DEVICE
An ultra-thin-body GaN-on-Insulator device and a method of manufacturing may be provided. The device comprises a front-end-of-line processed CMOS platform...
2019/0096915 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
According to one embodiment, a semiconductor device includes an insulating substrate, a first semiconductor layer located above the insulating substrate, a...
2019/0096914 DISPLAY DEVICE
A display device may include a substrate; a plurality of signal lines on the substrate; a plurality of scan lines on the substrate, the scan lines crossing the...
2019/0096913 DISPLAY DEVICE
A display device in one embodiment includes a flexible substrate, a back plate disposed under the flexible substrate to support it, a conductive layer disposed...
2019/0096912 ARRAY SUBSTRATE AND DISPLAY DEVICE
An display device is provided which including a stacked array substrate, a display medium layer and an opposite substrate. The array substrate includes a...
2019/0096911 ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE
The present disclosure relates to an array substrate, a display panel and a display device. The array substrate includes a substrate, data lines, gate lines,...
2019/0096910 SEMICONDUCTOR INTEGRATED CIRCUIT
Provided is a semiconductor integrated circuit that improves insulation reliability between a high-voltage circuit and a low-voltage circuit. The semiconductor...
2019/0096909 LOCAL INTERCONNECT STRUCTURE
The present disclosure describes an apparatus with a local interconnect structure. The apparatus can include a first transistor, a second transistor, a first...
2019/0096908 NON-VOLATILE SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
A non-volatile semiconductor storage device has a plurality of memory strings to each of which a plurality of electrically rewritable memory cells are...
2019/0096907 MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME
A memory device memory device includes a multi-layers stack, a charge-trapping layer, a first channel layer and a SSL switch. The multi-layers stack includes a...
2019/0096906 THREE-DIMENSIONAL MEMORY DEVICES, AND RELATED METHODS AND ELECTRONIC SYSTEMS
A method of forming a semiconductor device structure comprises forming a stack structure comprising stacked tiers. Each of the stacked tiers comprises a first...
2019/0096905 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
Provided herein may be a semiconductor device and a method of manufacturing the same. The semiconductor device may include a memory string including memory...
2019/0096904 THREE-DIMENSIONAL MEMORY DEVICE CONTAINING STRUCTURALLY REINFORCED PEDESTAL CHANNEL PORTIONS AND METHOD OF...
A source select level silicon nitride layer and an alternating stack of insulating layers and sacrificial silicon nitride layers are formed over a substrate. A...
2019/0096903 NON-VOLATILE MEMORY AND METHOD OF MANUFACTURING SAME
A semiconductor device is provided. The semiconductor device comprises a first active region, a second active region and a third active region, a first poly...
2019/0096902 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A semiconductor device having a nonvolatile memory cell arranged in a p-type well (active region) PW1 in a memory cell region 1A in a semiconductor substrate 1...
2019/0096901 MEMORY CELL STRUCTURE OF A THREE-DIMENSIONAL MEMORY DEVICE
Various embodiments disclose a 3D memory device, including a substrate; a plurality of conductor layers disposed on the substrate; a plurality of NAND strings...
2019/0096900 MEMORY DEVICE HAVING A PLURALITY OF FIRST CONDUCTIVE PILLARS PENETRATING THROUGH A STACKED FILM
A memory device according to an embodiment includes: a stacked film having a plurality of semiconductor films, and a plurality of insulating films each...
2019/0096899 SEMICONDUCTOR DEVICE
According to one embodiment, a semiconductor device includes a stacked body, first, second, third, and fourth insulating bodies, first and second columnar...
2019/0096897 SEMICONDUCTOR STRUCTURES, MEMORY CELLS AND DEVICES COMPRISING FERROELECTRIC MATERIALS, SYSTEMS INCLUDING SAME,...
A semiconductor structure includes an electrode, a ferroelectric material adjacent the electrode, the ferroelectric material comprising an oxide of at least...
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