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Patent # Description
2019/0096745 METHOD OF DEPOSITING CHARGE TRAPPING POLYCRYSTALLINE SILICON FILMS ON SILICON SUBSTRATES WITH CONTROLLABLE FILM...
A semiconductor on insulator multilayer structure is provided. The multilayer comprises a high resistivity single crystal semiconductor handle substrate, a...
2019/0096744 SINKER TO BURIED LAYER CONNECTION REGION FOR NARROW DEEP TRENCHES
An electronic device, e.g. an integrated circuit, includes a semiconductor substrate having a top surface and an area of the semiconductor substrate surrounded...
2019/0096743 BARRIER FOR PREVENTING EUTECTIC BREAK-THROUGH IN THROUGH-SUBSTRATE VIAS
A method involving a barrier for preventing eutectic break-through in through-substrate vias is disclosed. The method generally includes steps (A) to (D). Step...
2019/0096742 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
A semiconductor structure includes a substrate, a gate structure disposed over the substrate, a dielectric material disposed over the substrate and the gate...
2019/0096741 INTERCONNECT STRUCTURES AND METHODS FOR FORMING SAME
A method for forming an interconnect structure in an element is disclosed. The method can include patterning a cavity in a non-conductive material. The method...
2019/0096739 METHOD AND EQUIPMENT FOR FORMING GAPS IN A MATERIAL LAYER
A method and equipment for forming gaps in a material layer are provided. The equipment includes a supporter and an etching device. The supporter is configured...
2019/0096738 SUBSTRATE PROCESSING APPARATUS, REACTION TUBE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND RECORDING MEDIUM
A substrate processing apparatus includes: a reaction tube including inner and outer tubes installed to surround the inner tube; a substrate holder for holding...
2019/0096737 SUBSTRATE TREATMENT APPARATUS
A substrate processing apparatus includes a spin base on which a chuck member that holds a peripheral edge of a substrate is disposed, a motor which rotates...
2019/0096736 WAFFER PEDESTAL AND SUPPORT STRUCTURE THEREOF
The invention discloses a support structure for a wafer pedestal; particularly the wafer pedestal has a wafer carrying surface defining holes for accommodation...
2019/0096735 Wafer Table with Dynamic Support Pins
A method for semiconductor fabrication includes mounting a wafer onto a first wafer table. The first wafer table includes a first set of pins that support the...
2019/0096734 Wafer Table with Dynamic Support Pins
A method for semiconductor fabrication includes mounting a wafer onto a first wafer table. The first wafer table includes a first set of pins that support the...
2019/0096733 WAFER SUPPORT SYSTEM, WAFER SUPPORT DEVICE, SYSTEM COMPRISING A WAFER AND A WAFER SUPPORT DEVICE AS WELL AS...
A wafer support system has a wafer support device and a dicing frame, wherein the wafer support device has a bottom plate and a top plate. The top plate has a...
2019/0096732 DEVICES, SYSTEMS AND METHODS FOR ELECTROSTATIC FORCE ENHANCED SEMICONDUCTOR BONDING
Various embodiments of microelectronic devices and methods of manufacturing are described herein. In one embodiment, a method for enhancing wafer bonding...
2019/0096731 PLASMA PROCESSING-APPARATUS PROCESSING OBJECT SUPPORT PLATFORM, PLASMA PROCESSING APPARATUS, AND PLASMA...
According to one embodiment, a plasma processing-apparatus processing object support platform includes a lower plate, an upper plate, and a variable condenser....
2019/0096730 SUBSTRATE PROCESSING APPARATUS
A substrate processing apparatus includes carry in/out station, transfer station, processing station, and image capturing unit. The carry in/out station...
2019/0096729 SUBSTRATE INVERTING DEVICE, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE CATCH-AND-HOLD DEVICE
In a substrate inverting device, each lower guide has a downward inclined plane that comes in contact with a peripheral edge portion of a substrate held in a...
2019/0096728 LOAD PORT APPARATUS AND METHOD OF DRIVING THE SAME
A load port apparatus connects a main opening of a wafer transportation container with a frame opening. The load port apparatus includes an installation part,...
2019/0096727 Compliant Needle for Direct Transfer of Semiconductor Devices
An apparatus includes a needle and a needle actuator to move the needle to a position at which the needle presses an electrically-actuatable element into...
2019/0096726 DUAL SCARA ARM
A substrate transport apparatus having a drive section and a scara arm operably connected to the drive section to move the scara arm. The scara arm has an...
2019/0096725 METHOD FOR MANUFACTURING CIRCUIT BOARD AND STACKING STRUCTURE APPLIED THERETO
A method for manufacturing a circuit board includes forming recess structures on a transferring layer; forming a dielectric layer on the transferring layer to...
2019/0096724 METHOD AND SYSTEM FOR SCHEDULING APPARATUSES ON PRODUCTION LINE
A method and a system for scheduling apparatuses in a production line are disclosed. Each of the apparatuses on the production line includes one or more...
2019/0096723 FAULT DETECTION METHOD IN SEMICONDUCTOR FABRICATION FACILITY
A method for fault detection in a fabrication tool is provided. The method includes processing a semiconductor wafer in a fabrication tool according to a...
2019/0096722 SEMICONDUCTOR FABRICATION USING PROCESS CONTROL PARAMETER MATRIX
A method of processing substrates includes: subjecting each respective first substrate of a first plurality of substrates to a process that modifies a...
2019/0096721 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
A substrate processing method which processes a substrate having a metal layer on a surface thereof includes a metal oxide layer forming step of forming a...
2019/0096720 SUBSTRATE TREATMENT DEVICE AND SUBSTRATE TREATMENT METHOD
A substrate treatment device includes: a substrate rotation part that horizontally holds and rotates a substrate; a nozzle that supplies a treatment liquid to...
2019/0096719 SUBSTRATE TREATING APPARATUS
A substrate treating apparatus includes a plurality of solution treating units for performing solution treatment of substrates, and a plurality of individual...
2019/0096718 PRECISE ASSEMBLY MECHANISM
A precise assembly mechanism contains: a control unit controlling a clamp unit, a loading unit, and a visual sensing unit to operate. The clamp unit includes a...
2019/0096717 APPARATUS AND METHOD FOR TREATING SUBSTRATE
Provided are an apparatus and a method for treating a substrate at a high-pressure atmosphere. The apparatus for treating the substrate includes a first body...
2019/0096716 HEATING TREATMENT APPARATUS AND HEATING TREATMENT METHOD
A side surface unit of a heat treatment space S is formed by a shutter member 250 including an outer shutter 260 and an inner shutter 270. Supply air A is...
2019/0096715 CHAMBER FOR DEGASSING SUBSTRATES
A heater and/or cooler chamber includes a heat storage block or chunk. In the block a multitude of parallel, stacked slit pockets are each dimensioned to...
2019/0096714 METHOD FOR CONTROLLING TEMPERATURE OF FURNACE IN SEMICONDUCTOR FABRICATION PROCESS
A method for processing semiconductor wafers in a furnace is provided. The method includes forming a thin film on each of the semiconductor wafers. The method...
2019/0096713 WAFER COOLING SYSTEM
The present disclosure describes a wafer cooling/heating system that includes a load-lock and a thermo module. The load-lock uses a level stream design to...
2019/0096712 PROCESS CHAMBER FOR A SUPERCRITICAL PROCESS AND APPARATUS FOR TREATING SUBSTRATES HAVING THE SAME
Disclosed are a supercritical process chamber and an apparatus having the same. The process chamber includes a body frame having a protrusion protruding in an...
2019/0096711 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
A substrate processing apparatus and a substrate processing method capable of suppressing precipitation of a silicon oxide while improving selectivity for...
2019/0096710 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND RECORDING MEDIUM
A substrate processing apparatus, a substrate processing method and a recording medium capable of suppressing precipitation of a silicon oxide while improving...
2019/0096709 SEMICONDUCTOR FABRICATION WITH ELECTROCHEMICAL APPARATUS
A method includes holding a semiconductor substrate by a substrate holder of an electrochemical apparatus. The electrochemical apparatus includes a reaction...
2019/0096708 CHEMICAL DISPENSING APPARATUS AND METHODS FOR DISPENSING A CHEMICAL TO A REACTION CHAMBER
A chemical dispensing apparatus for providing a chlorine vapor to a reaction chamber is disclosed. The chemical dispensing apparatus may include: a chemical...
2019/0096707 METHOD FOR CLEANING A SEMICONDUCTOR SUBSTRATE
A method for cleaning a semiconductor substrate is provided. The method includes the steps of: applying a first agent onto a top surface of the semiconductor...
2019/0096706 SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS AND RECORDING MEDIUM
When performing a liquid processing on a substrate W being rotated and removing a processing liquid by a cleaning liquid, a cleaning liquid nozzle 421...
2019/0096705 SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS
A substrate processing method for processing a surface of a substrate includes: a first solvent supply step (a) of supplying IPA to a surface of a substrate...
2019/0096704 SUBSTRATE TREATING METHOD, SUBSTRATE TREATING LIQUID AND SUBSTRATE TREATING APPARATUS
Disclosed is a substrate treating method of performing drying treatment on a pattern-formed surface of a substrate, the substrate treating method comprising: a...
2019/0096703 Semiconductor Device, Tool, and Method of Manufacturing
A semiconductor device is manufactured using a cleaning process. The cleaning process utilizes a semiconductor manufacturing tool that has a wet cleaning...
2019/0096702 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND COMPUTER STORAGE MEDIUM
A substrate processing apparatus includes a processing chamber in which a substrate is processed in a depressurized atmosphere and a transfer chamber connected...
2019/0096701 METHOD FOR MANUFACTURING MODULE COMPONENT
A plurality of surface mounting components are arranged on a component mounting surface of a transfer substrate. A resin layer is formed on the transfer...
2019/0096700 Method of Manufacturing a Release Film as Isolation Film in Package
A method includes forming a release film over a carrier, forming a metal post on the release film, encapsulating the metal post in an encapsulating material,...
2019/0096699 PACKAGE STRUCTURE AND CHIP STRUCTURE
A package structure including a die, a plurality of first conductive connectors, a second conductive connector electrically insulated from the die, a...
2019/0096698 Integrated Circuit Packages and Methods of Forming Same
Integrated circuit packages and methods of forming the same are disclosed. A first die is mounted on a first side of a workpiece, the workpiece including a...
2019/0096697 METHOD FOR ALIGNING CHIP COMPONENTS RELATIVE TO SUBSTRATE BY USING LIQUID
A liquid is supplied to a substrate and a chip component is arranged on the liquid. The substrate includes a first surface in which a rectangular mounting...
2019/0096696 METHOD FOR FILLING VIA HOLE OF CERAMIC SUBSTRATE AND CERAMIC SUBSTRATE VIA HOLE FILLER FORMED THEREBY
The present invention relates to a method for filling a via hole in a ceramic substrate and a filler for the via hole in the ceramic substrate filled using the...
2019/0096695 METHODS OF ETCHING METAL-CONTAINING LAYERS
A method of removing a metal-containing layer (e.g., tungsten) from a substrate is provided. The method includes generating a first plasma in a process volume...
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