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Patent # Description
2019/0109069 COOLER
Provided is a cooler including an upper plate configured to have a semiconductor chip to be arranged thereon, a plurality of plate-like fins arranged under the...
2019/0109068 POWER CONVERSION APPARATUS
A power conversion apparatus mounted in a vehicle includes a semiconductor stack in which a plurality of semiconductor modules and a plurality of coolants...
2019/0109067 SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE
A semiconductor device includes a semiconductor chip having an electrode portion and a joining member electrically connected to the electrode portion to allow...
2019/0109066 POWER AMPLIFIER MODULE
A power amplifier module includes a substrate including, in an upper surface of the substrate, an active region and an element isolation region. The power...
2019/0109065 SEMICONDUCTOR DEVICE
An interlayer insulating film covers a gate electrode and a gate insulating film embedded in a trench. A source electrode includes a first TiN film, a NiSi...
2019/0109064 CHIP PACKAGE
A chip package including a lead frame, a first chip, a heat dissipation structure, and an insulating encapsulant is provided. The lead frame includes a chip...
2019/0109063 INTEGRATED CIRCUIT STRUCTURES WITH EXTENDED CONDUCTIVE PATHWAYS
Integrated circuit (IC) structures with extended conductive pathways, as well as related structures, devices, and methods, are disclosed herein. For example,...
2019/0109062 Zinc Layer For A Semiconductor Die Pillar
A method for fabricating a copper pillar. The method includes forming a layer of titanium tungsten (TiW) over a semiconductor wafer, forming a layer of zinc...
2019/0109061 Edge Bend for Isolation Packages
In one instance, a semiconductor isolation package includes a leadframe that includes a plurality of leadframe leads. At least one of the plurality of...
2019/0109060 MOLDED AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF
Molded air cavity packages and methods for producing molded air cavity packages are disclosed. In one embodiment, the molded air cavity package includes a...
2019/0109059 SEMICONDUCTOR DEVICE
A semiconductor device includes: a base plate; a semiconductor chip mounted on the base plate; a case surrounding the semiconductor chip on the base plate; an...
2019/0109058 CUSTOMIZED MODULE LID
A method of forming a custom module lid. The method may include placing a multichip module (MCM) between a module base and a temporary lid, target components...
2019/0109057 APPARATUS AND METHODS FOR THROUGH SUBSTRATE VIA TEST
A stack of vertically-connected, horizontally-oriented integrated circuits (ICs) may have electrical connections from the front side of one IC to the back side...
2019/0109056 POROUS SILICON RELAXATION MEDIUM FOR DISLOCATION FREE CMOS DEVICES
A method for forming CMOS devices includes masking a first portion of a tensile-strained silicon layer of a SOI substrate, doping a second portion of the layer...
2019/0109055 HIGH PERFORMANCE SiGe HETEROJUNCTION BIPOLAR TRANSISTORS BUILT ON THIN-FILM SILICON-ON-INSULATOR SUBSTRATES FOR...
A silicon-on-insulator (SOI) CMOS transistor and a SOI heterojunction bipolar transistor (HBT) are fabricated on the same semiconductor substrate. First and...
2019/0109054 High Performance SiGe Heterojunction Bipolar Transistors Built On Thin Film Silicon-On-Insulator Substrates For...
A silicon-on-insulator (SOI) CMOS transistor and a SOI heterojunction bipolar transistor (HBT) are fabricated on the same semiconductor substrate. First and...
2019/0109053 FIN FIELD-EFFECT TRANSISTOR DEVICE AND METHOD
A method includes removing a first portion of a dummy gate structure over a first fin while keeping a second portion of the dummy gate structure over a second...
2019/0109052 NANOSHEET SUBSTRATE ISOLATED SOURCE/DRAIN EPITAXY BY NITROGEN IMPLANTATION
Parasitic transistor formation under a semiconductor containing nanosheet device is eliminated by implantation of nitrogen into physically exposed surfaces of...
2019/0109051 SEMICONDUCTOR DEVICE STRUCTURE
A semiconductor device structure is provided. The semiconductor device structure includes a substrate. The semiconductor device structure includes a gate stack...
2019/0109050 SEMICONDUCTOR DEVICE
A semiconductor device includes a substrate having a fin structure extending along a first direction. The fin structure protrudes from a top surface of a...
2019/0109049 3D SEMICONDUCTOR DEVICE AND SYSTEM
A 3D semiconductor device including: a first level comprising first single crystal transistors, a first metal layer, and a plurality of latches; a second level...
2019/0109048 Semiconductor Device and Method of Using a Standardized Carrier in Semiconductor Packaging
A semiconductor device has a carrier with a fixed size. A plurality of first semiconductor die is singulated from a first semiconductor wafer. The first...
2019/0109047 MASK-INTEGRATED SURFACE PROTECTIVE TAPE
A surface protective tape, which is used for a method of producing a semiconductor chip including the steps (a) to (d), and contains a substrate film, and a...
2019/0109046 INTEGRATED ANTENNA ON INTERPOSER SUBSTRATE
The present disclosure, in some embodiments, relates to an integrated antenna structure. The structure includes an excitable element and a first ground plane....
2019/0109045 METHODS OF FORMING CONDUCTIVE CONTACT STRUCTURES TO SEMICONDUCTOR DEVICES AND THE RESULTING STRUCTURES
One illustrative method disclosed herein may include forming a contact etching structure in a layer of insulating material positioned above first and second...
2019/0109043 Semiconductor Device and Method
A method includes forming a first opening in a dielectric layer over a substrate, lining sidewalls and a bottom of the first opening with a conductive barrier...
2019/0109042 DIFFUSION BARRIER COLLAR FOR INTERCONNECTS
Representative implementations of techniques and devices are used to reduce or prevent conductive material diffusion into insulating or dielectric material of...
2019/0109041 Contact Plugs and Methods Forming Same
A method includes forming a transistor including forming a source/drain region on a side of a dummy gate stack, forming a first Inter-Layer Dielectric (ILD)...
2019/0109040 DIELECTRIC ISOLATION IN GATE-ALL-AROUND DEVICES
A semiconductor device is fabricated with a first layer of a first sacrificial material deposited over a surface of a substrate. A first set of layers of a...
2019/0109039 DEVICE ISOLATION STRUCTURE AND METHODS OF MANUFACTURING THEREOF
Semiconductor devices and methods of forming thereof are disclosed. A substrate with different device regions defined in the substrate is provided. A deep...
2019/0109038 THERMAL SENSOR ARRANGEMENT AND METHOD OF MAKING THE SAME
A method of making a temperature sensor arrangement includes forming a sensor array. The sensor array includes a first transistor of a first device and a...
2019/0109037 APPARATUS AND METHOD FOR ADJUSTING A PEDESTAL ASSEMBLY FOR A REACTOR
The invention is directed to an alignment assembly for changing the relative position of a plate of a pedestal assembly with respect to a processing chamber of...
2019/0109036 Spring-Loaded Pins For Susceptor Assembly And Processing Methods Using Same
Apparatus and methods for processing a semiconductor wafer including a susceptor assembly with recesses comprising at least three lift pins. The lift pins...
2019/0109035 EXPANDING METHOD AND EXPANDING APPARATUS
A method of expanding a sheet includes the steps of gripping the sheet with a first gripping unit and a second griping unit and gripping the sheet with a third...
2019/0109034 METHOD AND DEVICE FOR BONDING TWO SUBSTRATES
A method and device for temporarily bonding a product substrate to a carrier substrate. The method includes a) applying a bonding adhesive to the product...
2019/0109033 Method For Joining Quartz Pieces And Quartz Electrodes And Other Devices Of Joined Quartz
A method for joining quartz pieces using metallic aluminum as the joining element. The aluminum may be placed between two quartz pieces and the assembly may be...
2019/0109032 METHODS AND APPARATUS FOR NOVEL CLEANSPACE FABRICATORS
The present disclosure provides various apparatus and methods for novel cleanspace fabricator designs. In some examples, a cleanspace fabricator may be...
2019/0109031 SUBSTRATE PROCESSING APPARATUS
Provided is a substrate processing apparatus, including: transportation chamber maintained in an atmospheric environment where a substrate is transported; a...
2019/0109030 METHOD OF PROCESSING TARGET SUBSTRATE
A method of processing a target substrate includes a process of serially executing multiple processes including a main process and first to M-th subprocesses...
2019/0109029 Methods, Apparatus and System for Dose Control for Semiconductor Wafer Processing
At least one method, apparatus and system disclosed herein involves performing a wafer to wafer feedback control of process performed on a semiconductor...
2019/0109028 SUBSTRATE TRANSFER DEVICE, TRANSFER METHOD AND PHOTOLITHOGRAPHY APPARATUS
A substrate transfer device and method as well as a photolithography apparatus are disclosed. The device includes a motion platform and a plurality of transfer...
2019/0109027 MICRO-LED PICK AND PLACE USING METALLIC GALLIUM
An LED die containing a gallium semiconductor layer is placed on a target substrate using a pick-up tool (PUT) attached to the LED die using metallic gallium....
2019/0109026 SEMICONDUCTOR PICK-UP APPARATUS
Provided is a technique for detaching a semiconductor chip from a mount tape without failures in the semiconductor chip, such as cracking and chipping. A...
2019/0109025 BOLTED WAFER CHUCK THERMAL MANAGEMENT SYSTEMS AND METHODS FOR WAFER PROCESSING SYSTEMS
A workpiece holder includes a puck, first and second heating devices in thermal communication with respective inner and outer portions of the puck, and a...
2019/0109024 TIME-VARYING FREQUENCY POWERED HEAT SOURCE
A semiconductor or other substrate can include one or more electrodes, located directly or indirectly on the substrate, separated from each other and coupled...
2019/0109023 APPARATUS FOR DIVIDING WORKPIECE
A dividing apparatus divides a workpiece along projected dicing lines into chips, the workpiece being stuck to an upper surface of a protective tape mounted on...
2019/0109022 METHOD FOR THE RAPID PROCESSING OF POLYMER LAYERS IN SUPPORT OF IMIDIZATION PROCESSES AND FAN OUT WAFER LEVEL...
A process for the drying, and subsequent imidization, of polyimide precursors which minimizes or eliminates voids and which minimizes or eliminates...
2019/0109021 RESIN-SEALING DEVICE AND RESIN-SEALING METHOD
Provided is a resin-sealing device having: a first molding die that has a holding surface for a workpiece on which a semiconductor element is mounted; a second...
2019/0109020 Integrated Circuit Packages and Methods of Forming Same
An integrated circuit package and a method of forming the same are provided. A method includes forming a conductive column over a carrier. An integrated...
2019/0109019 SEMICONDUCTOR DIE ASSEMBLIES WITH HEAT SINK AND ASSOCIATED SYSTEMS AND METHODS
Methods for forming semiconductor die assemblies with heat transfer features are disclosed herein. In some embodiments, the methods comprise providing a wafer...
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