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Patent # Description
2019/0221541 LIGHT EMITTING DEVICE
A light emitting device includes first and second light emitting elements, first and second color conversion material layers, a support member and a light...
2019/0221540 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
A method of manufacturing a semiconductor device of the present disclosure includes the steps of sequentially forming an adhesion-improving film, a Pt film, a...
2019/0221539 ELECTRONIC DEVICE HAVING AN UNDER-FILL ELEMENT, A MOUNTING METHOD OF THE SAME, AND A METHOD OF MANUFACTURING A...
A mounting method of an electronic device includes providing an electronic device which includes a semiconductor chip body including an upper surface, a lower...
2019/0221538 SEMICONDUCTOR STRUCTURE
A semiconductor structure includes a substrate, a chip, a plurality of conductive bumps, a flexible printed circuit (FPC) board and a plurality of circuit...
2019/0221537 WIRE BALL BONDING IN SEMICONDUCTOR DEVICES
A method of interconnecting components of a semiconductor device using wire bonding is presented. The method includes creating a free air ball at a first end...
2019/0221536 Semiconductor Device
A semiconductor device includes a semiconductor chip including a semiconductor substrate, an element formed in an element forming region of the semiconductor...
2019/0221535 SEMICONDUCTOR DEVICE
A semiconductor device includes a semiconductor substrate having a chip region and an edge region, a plurality of connection structures provided in a lower...
2019/0221534 BOND PAD STRUCTURE FOR BONDING IMPROVEMENT
Some embodiments relate to a bond pad structure of an integrated circuit (IC). The bond structure includes a bond pad and an intervening metal layer positioned...
2019/0221533 SEMICONDUCTOR DEVICES COMPRISING METALLIZATIONS COMPOSED OF POROUS COPPER AND ASSOCIATED PRODUCTION METHODS
A semiconductor device includes a semiconductor chip, an electrical connection element for electrically connecting the semiconductor device to a carrier, and a...
2019/0221532 POLYMER RESIN AND COMPRESSION MOLD CHIP SCALE PACKAGE
A method for fabricating a chip scale package, comprising: providing a wafer; applying a polymer resin on at least part of a first surface of the wafer and to...
2019/0221531 On-Chip Antennas for Semiconductor Devices and Related Manufacturing Methods
A semiconductor device includes a semiconductor die having an active main surface and an opposite main surface opposite the active main surface. The...
2019/0221530 INTEGRATED CIRCUIT AND TRANSMISSION CIRCUIT THEREOF
An integrated circuit and a transmission circuit thereof are provided. The transmission circuit includes an input buffer and a voltage holding circuit. The...
2019/0221529 ON-PACKAGE INTEGRATED STIFFENER ANTENNA
Described herein are microelectronics packages and methods for manufacturing the same. The microelectronics package may include a transmitter, a receiver, and...
2019/0221528 SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
A semiconductor package structure and a method for forming the same are disclosed. The semiconductor package structure includes a semiconductor die, a molding...
2019/0221527 REDISTRIBUTION SYSTEM WITH ROUTING LAYERS IN MULTI-LAYERED HOMOGENEOUS STRUCTURE AND A METHOD OF MANUFACTURING...
An embodiment of the present invention provides a method and system of manufacturing a redistribution platform comprising: providing a substrate; patterning a...
2019/0221526 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A semiconductor device with improved reliability is provided. The semiconductor device is characterized by its embodiments in that sloped portions are formed...
2019/0221525 NEUTRON SHIELDING PACKING BODY FOR AIR TRANSPORTATION OF SEMICONDUCTOR DEVICE
A neutron shielding packing body configured to pack a semiconductor device is disclosed. The neutron shielding packing body reduces Total Ionizing Dose (TID)...
2019/0221524 THERMAL MANAGEMENT AND/OR EMI MITIGATION MATERIALS HAVING INCREASED CONTRAST AND PRESENCE DETECTION
Disclosed are exemplary embodiments of thermal management and/or EMI (electromagnetic interference) mitigation materials with one or more additives. The...
2019/0221523 STRUCTURE AND METHOD TO REDUCE SHORTS AND CONTACT RESISTANCE IN SEMICONDUCTOR DEVICES
In an exemplary method, a first dielectric layer is formed on a substrate. A second dielectric layer is formed on the first dielectric layer. The second...
2019/0221522 Contact Structure and Method of Forming
Contact structures and methods of forming contacts structures are contemplated by this disclosure. A structure includes a dielectric layer over a substrate, an...
2019/0221521 Power Semiconductor Module Having a Direct Copper Bonded Substrate and an Integrated Passive Component, and an...
A power semiconductor module includes a power semiconductor die attached to the first metallized side, a passive component attached to the first metallized...
2019/0221520 SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
A semiconductor package includes a lower chip, an upper chip on the lower chip, and an adhesive layer between the lower chip and the upper chip. The lower chip...
2019/0221519 FORMING DUAL METALLIZATION INTERCONNECT STRUCTURES IN SINGLE METALLIZATION LEVEL
Techniques are provided to fabricate metallic interconnect structures in a single metallization level, wherein different width metallic interconnect structures...
2019/0221518 SEMICONDUCTOR DEVICE
A semiconductor device includes: a first gate line and a second gate line extending along a first direction, a third gate extending along a second direction...
2019/0221517 SEMICONDUCTOR DEVICE
A semiconductor device on silicon-on-insulator (SOI) substrate includes: a first gate line and a second gate line extending along a first direction, a third...
2019/0221516 THIN FILM RESISTOR WITH PUNCH-THROUGH VIAS
A device including a thin film resistor (TFR) structure. The TFR structure is accessible by one or more conductive vias that extend vertically from an upper...
2019/0221515 METAL-INSULATOR-METAL CAPACITORS WITH ENLARGED CONTACT AREAS
Structures that include a metal-insulator-metal (MIM) capacitor and methods for fabricating a structure that includes a MIM capacitor. The MIM capacitor...
2019/0221514 SEMICONDUCTOR DEVICE INCLUDING SWITCH CELLS
A semiconductor device is provided. The semiconductor device includes a first switch and second switch cells that are disposed on a substrate and spaced apart...
2019/0221513 SEMICONDUCTOR PACKAGE
A semiconductor package includes a substrate, a first semiconductor chip and a second semiconductor chip adjacent to each other on the substrate, and a...
2019/0221512 SEMICONDUCTOR PACKAGE HAVING A CIRCUIT PATTERN
A semiconductor package includes a circuit pattern extending in a horizontal direction. The circuit pattern is conductive. A first insulation layer is disposed...
2019/0221511 COIL BUILT-IN MULTILAYER SUBSTRATE AND POWER SUPPLY MODULE
A coil built-in multilayer substrate includes a multilayer substrate, a coil, interlayer connection conductors, and gaps. The multilayer substrate includes a...
2019/0221510 BONDING OF LAMINATES WITH ELECTRICAL INTERCONNECTS
A microelectronic assembly including first and second laminated microelectronic elements is provided. A patterned bonding layer is disposed on a face of each...
2019/0221509 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a...
2019/0221508 WIRING SUBSTRATE AND ELECTRONIC COMPONENT DEVICE
A wiring substrate include a pad, an insulation layer having an opening arranged on the pad, a metal post including a seed layer and a metal plated layer, the...
2019/0221507 SEMICONDUCTOR DEVICE MOUNTING BOARD AND SEMICONDUCTOR PACKAGE
A semiconductor device mounting board includes a first substrate, a second substrate, a single line, a groove, a feedthrough conductor, and a side conductor....
2019/0221506 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
A method for forming packaged electronic devices includes providing a substrate having pads connected by conductive pad linking portions and semiconductor...
2019/0221505 SUBSTRATE-WITH-SUPPORT
A substrate-with-support includes: a substrate having a wiring area, an outer peripheral area provided on an outer peripheral side of the wiring area, and a...
2019/0221504 SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
A semiconductor device includes a first lead with a first block, a second lead with a second block, and a sealing resin partially covering the first and second...
2019/0221503 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
A semiconductor device that is a surface mount-type device includes a nitride semiconductor chip including a silicon substrate having a first thermal expansion...
2019/0221502 Down Bond in Semiconductor Devices
An apparatus includes a lead frame paddle configured for mounting a semiconductor die. The apparatus further includes a plating area formed on the lead frame...
2019/0221501 METHOD OF PRODUCING HEAT-DISSIPATING UNIT
[Purpose] To provide is a method capable of producing a heat-dissipating unit easily and at low cost. [Solution] The method of producing a heat-dissipating unit 12...
2019/0221500 PACKAGED POWER DEVICE HAVING IMPROVED HEAT DISSIPATION CAPACITY AND BETTER THERMAL PERFORMANCES
A packaged device, having a package, including a first dissipative region, a second dissipative region, a first connection element and a second connection...
2019/0221499 HEAT MANAGEMENT SYSTEM
A heat management system may include a die package. The die package may include a housing. The housing may include a housing surface. The housing may include a...
2019/0221498 ADHESIVE SEALING OF THERMAL INTERFACE MATERIALS
In one example, an apparatus is described, which includes an electronic component, a thermal dissipation unit, a thermal interface material disposed between...
2019/0221497 HOLDING DEVICE FOR SEMICONDUCTOR ELEMENT, AND POWER CONVERSION DEVICE USING HOLDING DEVICE
A problem to be solved by the present invention is to prevent smoke emission and ignition of a power semiconductor element that is installed inside a power...
2019/0221496 SEMICONDUCTOR DEVICE
A semiconductor device includes a first semiconductor element, a first heat dissipation plate connected to the first semiconductor element, a sealing body that...
2019/0221495 Method and Apparatus of Operating a Compressible Thermal Interface
A thermal electrical (TE) interface comprises a primary fiber thermal interface (FTI) having a first side configured to contact a heatsink, and a second side....
2019/0221494 SEMICONDUCTOR DEVICE
A semiconductor device includes first and second metal plates which are disposed to face each other, a semiconductor chip, a first insulator block, and a...
2019/0221493 HIGH POWER MODULE SEMICONDUCTOR PACKAGE WITH MULTIPLE SUBMODULES
In one general aspect, a package can include a first submodule including a first semiconductor die coupled to a first substrate and a first spacer, and...
2019/0221492 PROCESSOR SOCKET ASSEMBLY AND CARRIER THEREOF
A processor socket assembly includes a processor socket, a base frame, a guide member and a carrier. The processor socket is located on a circuit board. The...
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