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Patent # Description
2019/0230837 Shiitake Mushroom Plant Named 'HOKSY 10gokin'
The present variety of mushroom plant named `HOKSY 10gokin` was cultivated by the gathering and repeated breeding of Shiitake mushrooms having dominant traits,...
2019/0230835 Hydrangea plant named 'COUMONT'
A new and distinct Hydrangea cultivar named `COUMONT` is disclosed, characterized mophead inflorescences composed of yellow-green and pink flowers. Plants...
2019/0230834 Sorbaria Plant Named 'COUSORB05'
A new and distinct Sorbaria cultivar named `COUSORB05` is disclosed, characterized by a compact plant size having early budding and easy care in the garden....
2019/0230833 Spiraea 'DAVROU01"
`DAVROU01` is a new cultivar of hybrid Spiraea with distinctive dark red-purple new foliage and stems. Plants are compact and bloom continuously throughout...
2019/0230832 PRODUCTION MANAGEMENT DEVICE
A production management device includes data management section having multiple correspondence data in which component types are linked to each product type of...
2019/0230831 COMPONENT MOUNTING ROBOT SYSTEM
A component mounting robot system includes a component transfer robot which transfers a mounting component including a mounting portion to a base component's...
2019/0230830 ELECTRONIC COMPONENT MOUNTER AND ELECTRONIC COMPONENT RELEASE METHOD
An electronic component mounter including a suction nozzle to pick up an electronic component housed in a housing section; a switching device configured to...
2019/0230829 COMPONENT SUPPLY DEVICE
A component supply device is a device for supplying components housed in a component storage tape to a component extraction position. The component storage...
2019/0230828 ELECTROMAGNETIC PULSE/HIGH ALTITUDE ELECTROMAGNETIC PULSE (EMP/HEMP) FILTER SYSTEM
A filter design configured to operate in the medium voltage range of 1000 to 5000 volts, provides protection against Electromagnetic Pulse/High Altitude...
2019/0230827 BACK COVER MODULE
A back cover module adapted to be disposed on a casing having a back opening is provided. The back cover module includes a fixing bracket, a sliding bracket...
2019/0230826 DEVICE FOR COOLING A POWER ELECTRONICS CIRCUIT
Device (1) for cooling at least one power electronics circuit (4), including: a liquid-cooled heatsink (2); and an interface plate (3) that is in thermal...
2019/0230825 POWER CONVERTER
A power converter includes a component compartment in which heat-generating components are housed, a duct for exhausting heat generated by the heat-generating...
2019/0230824 CLOSED LOOP COOLING SYSTEM FOR A JUNCTION BOX IN A VEHICLE, AND RELATED COMPONENTS, SYSTEMS, AND METHODS
A closed loop cooling system for a junction box in a vehicle includes a junction box housing and a storage compartment for a vehicle. A cool air duct interior...
2019/0230823 SYSTEM FOR COOLING AN ELECTRONIC DEVICE AND ASSEMBLY METHOD
An electronic device includes a rear end and a front end of a first group of fins respectively defining an air inlet and an air outlet of the first group, a...
2019/0230822 Control Boxes and System-On-Module Circuit Boards for Unmanned Vehicles
A control box includes a housing defining an interior, a circuit board disposed within the interior, and an input/output connector extending from the housing....
2019/0230821 RACK HOUSINGS HAVING ANADJUSTABLE AIR VOLUME
A rack housing includes, for example, a frame, a door attachable to a front of said frame, a plurality of movable supports for supporting a plurality of...
2019/0230820 HEATSINK SECURED TO A HEAT SOURCE
Particular embodiments described herein provide for an electronic device that can be configured to include a printed circuit board, where the printed circuit...
2019/0230819 DEVICE AND DISASSEMBLY METHOD
A device (1) such as a lighting device, e.g. a luminaire, is disclosed that comprises an assembly of components including a first component (10) and a second...
2019/0230818 Wire-Spring Retained Heatsink Installation and Removal Tool
A wire-spring retained heatsink installation and removal tool for installing and removing wire-spring retained heatsinks. The wire-spring retained heatsink...
2019/0230817 RECEPTACLE ASSEMBLY AND THERMAL-TRANSFER ASSEMBLY
Receptacle assembly includes a receptacle cage and a thermal-transfer module that is coupled to a thermal side of the receptacle cage. The thermal-transfer...
2019/0230816 TWO-PHASE LIQUID COOLED ELECTRONICS
Techniques that facilitate two-phase liquid cooling electronics are provided. In one example, a server system comprises a two-phase cooling system and an air...
2019/0230815 Radio Remote Unit and Communications Device
A radio remote unit, including a unit body, and multiple heat dissipation fins that are disposed on a surface of the body, where an opening groove is disposed...
2019/0230814 AIR BLOWER
In an air blower, an exhaust includes fins and extends in a first direction that is a radial component of an impeller. Assuming that a first virtual circle is...
2019/0230813 Power Conversion Device
Insulating properties between a metallic member supporting a power semiconductor module and an input/output terminal of the power semiconductor module are...
2019/0230812 ELECTRONIC COMPONENT AND POWER CONVERSION DEVICE
Provided is an electronic component (13) that can be miniaturized while including a cooling structure. The electronic component includes an electronic...
2019/0230811 MOUNTING AID
Mounting aid for the mounting of rack mounts in frames, in particular racks for use in information technology, comprising at least two relatively to one...
2019/0230810 APPARATUS FOR MOUNTING PROCESSORS FOR CLUSTER COMPUTING
A bracket for mounting a processor and a support structure for receiving bracket-supported processors for cluster computing are provided. In some embodiments,...
2019/0230809 ELECTRIC DEVICE AND MOTOR DRIVING DEVICE
A motor driving device includes a printed board on which a pattern is printed, and a resin board which is formed by molding a resin and on which no pattern is...
2019/0230808 TWO-PHASE FLUID-ACTUATED COOLING DEVICE, SYSTEM, AND METHOD
An electronics circuit card system includes a flexible elongated hollow receptacle; a working fluid disposed within the flexible elongated hollow receptacle;...
2019/0230807 ELECTRICAL CONNECTOR EQUIPPED WITH DUAL LEVERS
A connector includes an insulative housing, a plurality of contacts retained in the housing, and a metallic stiffener surrounding the housing. A first pivot...
2019/0230806 EXPANSION MODULE SYSTEM
A system and approach that may connect communication modules together in a daisy chain fashion as an expansion bus. A communication module may be connected...
2019/0230805 Protective Enclosure For Encasing An Electronic Device
A protective enclosure for an electronic device includes a first case portion that may be adapted to surround at least a portion of a top device portion and a...
2019/0230804 Method for Producing an Electronic Assembly, and Electronic Assembly, in particular for a Transmission Control...
A method for producing an electronic assembly includes providing a printed circuit board with a first face, a second face facing away from the first face, and...
2019/0230803 REEL ASSEMBLY, DISPLAY DEVICE AND SMART BRACELET
A reel assembly operable to be wound by a screen assembly is provided. The reel assembly is received in a frame assembly, and includes a reel, a connector, a...
2019/0230802 COUPLING SYSTEM AND METHOD FOR FLAT PANEL DISPLAYS
A coupling system for flat panel displays includes a locking clip formed with a socket, a flat surface configuration, and is constructed to afford connection...
2019/0230801 Control Boxes and System-On-Module Circuit Boards for Unmanned Vehicles
A control box includes a housing defining an interior, the housing including a cover and a stiffener, the stiffener removably connected in contact with the...
2019/0230800 Control Boxes and System-On-Module Circuit Boards for Unmanned Vehicles
A SOM circuit board includes a main body having a first face surface, an opposing second face surface, a first side surface, an opposing second side surface, a...
2019/0230799 POWER SUPPLY WITH A STAGGERED CONFIGURATION
A power supply with a staggered configuration includes a housing having an accommodation space, a first power supply module, a second power supply module, and...
2019/0230798 PRINT CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
A print circuit board and a manufacturing method thereof are disclosed. The print circuit board includes a first substrate, a first insulating layer and a...
2019/0230797 CONDUCTIVE POLYMERS WITHIN DRILLED HOLES OF PRINTED CIRCUIT BOARDS
A triggering condition is applied to a conductive polymer positioned in a drilled hole in a printed circuit board. The applied triggering condition causes the...
2019/0230796 METHOD FOR CURING SOLDER PASTE ON A THERMALLY FRAGILE SUBSTRATE
A method for curing solder paste on a thermally fragile substrate is disclosed. An optically reflective layer and an optically absorptive layer are printed on...
2019/0230795 METHOD FOR ORIENTING SOLDER BALLS ON A BGA DEVICE
A BGA structure having larger solder balls in high stress regions of the array is disclosed. The larger solder balls have higher solder joint reliability (SJR)...
2019/0230794 SURFACE MOUNT DEVICE STACKING FOR REDUCED FORM FACTOR
A packaged module for use in a wireless communication device has a substrate supporting an integrated circuit die that includes at least a microprocessor and...
2019/0230793 Unmanned Vehicle Control Systems
A control system for an unmanned vehicle (UV) comprises a housing defining an interior, a first circuit board disposed within the interior, and a second...
2019/0230792 SUBSTRATE AND ELECTRONIC DEVICE
Provided is a substrate including a first wiring layer coupled to another wiring layer through a plurality of vias, wherein in the first wiring layer, an area...
2019/0230791 WIRING SUBSTRATE
A wiring substrate includes a pad, an insulation layer that covers the pad, and a via wiring extending through the insulation layer and connected to the pad....
2019/0230790 ADHESIVE FILM FOR MULTILAYER PRINTED-WIRING BOARD
The present invention relates to an adhesive film for a multilayer printed-wiring board, in which a property of filling irregularities is excellent even when...
2019/0230789 CONDUCTIVE SHEET AND TOUCH PANEL
A conductive component includes a first electrode pattern made of metal thin wires, and includes a plurality of first conductive patterns that extend in a...
2019/0230788 SUBSTRATE WITH STRESS RELIEVING FEATURES
Various examples disclosed relate to a substrate for a semiconductor. The substrate includes a first conducting layer, having a first surface and an opposite...
2019/0230787 FLEXIBLE CIRCUIT BOARD WITH IMPROVED BONDING FLATNESS
In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first...
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