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Electronic devices with cavity-type, permeable material filled packages,
and methods of their manufacture
Embodiments include devices and methods of their manufacture. A device embodiment includes a package housing, at least one electronic circuit (e.g., a sensor...
Automatic splicing device
A control device that moves and positions number one and number two takeup members at number one and number two aperture forming positions until the number one...
Mixture of hydrofluoroolefin and fluoroketone for use as an insulation
and/or ARC extinguishing medium and a...
There is provided a method of providing an electric insulating and/or electric arc extinguishing gaseous medium within a sealed enclosure of a medium-voltage...
Casing and manufacturing method thereof
A manufacturing method of a casing is provided. First, a plate, a frame and a main shell are provided, wherein the plate has an adhering region and at least one...
Electromagnetic shield termination device
An electromagnetic shield termination assembly includes a wire assembly having an electrically conductive wire. An electromagnetic shield extends coaxially with...
There is provided an electronic device. The electronic device includes: a wiring board; a first electronic component mounted on the wiring board and configured...
High isolation grounding device
The device includes a body and a plurality of contact portions. The body is substantially planar. The plurality of contact portions are associated with the body...
Motor drive unit with heat sink dealing with drop of cutting fluid
A motor drive unit includes a housing in which a heat sink and at least one electronic component to be cooled by the heat sink are disposed. An end of the heat...
Power conversion apparatus
A power conversion apparatus includes: a power semiconductor module (150a); a flow channel forming body (20) for housing the power semiconductor module (150a);...
Data center cooling system having electrical power generation
A data center cooling system having electrical power generation, which utilizes heat generated by servers to simultaneously cool the data center and generate...
Expandable, modular information technology facility with modularly
An Expandable Modular Information Technology (EMIT) Facility (EMITF) includes: an EMIT Building Infrastructure (EMITBI) having an initial enclosure that...
A system that includes four racks arranged in a cruciform arrangement having a center, when viewed from above. Each rack has a front and a rear, with the rear...
Cooling a chassis by moving air through a midplane between two sets of
channels oriented laterally relative to...
Heat dissipating electronic components and circuitry in a communication chassis are cooled by moving air at least through a midplane, between two groups of...
Wire harness fixing structure
A wire harness fixing structure includes a cooling medium tank provided with a cooling medium relief valve; a sensor that is installed in the cooling medium...
Refrigerant jacket and air conditioning apparatus equipped therewith
A refrigerant jacket includes a refrigerant cooling member, a cover member and a strength member. The cooling member is constructed of aluminum or aluminum...
An electronic apparatus includes: a case; a support device arranged at the case; a rotating plate articulated to the support device; a driving device; and a...
Fluid-cooled module for integrated circuit devices
A self-contained fluid-cooled electro-optical plug in type module capable of being exchangeably mounted in an external chassis incorporates electronic or...
Cooling device including etched lateral microchannels
In some examples, a cooling system includes a silicon substrate defining a first trench, a second trench, and a plurality of channels extending between the...
A server includes a chassis, a protecting component and at least one power supply. The chassis includes a case, a cover and a lid. The cover is disposed on the...
Standardization of server module in high-density server
A server includes a housing having a server-module storage space, a power source disposed in the rear side inside the housing, and a pair of server modules...
Mechanical assembly and method to provide form-factor and wire alike
adaptation of existing platform hardware...
An Intelligent Electronic Device (IED) includes a plurality of hardware modules including a pair of analog input modules (AIM) modules, a Power Supply Module...
Solid state drive (SSD) assembly method
A solid state drive (SSD) assembly and an assembly method for solid state drives, which does not require using screws. The assembly method includes aligning a...
A display device includes a panel laminated body including a panel laminated body including a plurality of panels stacked together, flexible printed circuit...
Cover and information processing apparatus with cover
An upper cover attaching concavity and a lower cover attaching concavity are respectively formed on rear surfaces of an upper housing and a lower housing of a...
An electronics cabinet having a cabinet frame, a front equipment rail, and a structural air dam. The cabinet frame includes a first pair of front-to-back beams...
Support structures for a flexible electronic component
An article includes a flexible electronic component and a flexible support coupled to the flexible electronic component. The flexible support is configured to...
Provided is a display apparatus. The display apparatus includes a display panel for displaying an image, a back cover mounted on a rear surface of the display...
Mobile terminal comprising lid unit with key device
The invention relates to a mobile terminal comprising a lid unit arranged to substantially block an opening in a mobile terminal housing in an assembled state...
Apparatus for holding a portable device
A method and apparatus for supporting a portable computer appliance. The invention may comprise rotating a computer appliance to convert between mouse-based use...
Electronic control apparatus for vehicle using coupling member and method
for manufacturing the same
Disclosed is an electronic control apparatus for a vehicle, comprising: a printed circuit board (PCB) configured to electrically control each part of the...
An electronic album includes a housing, and the housing includes a front housing and a rear housing, where the front housing and the rear housing are fixed, and...
Manufacturing method of circuit board
A manufacturing method of a circuit board is provided. A circuit substrate having a first surface and at least a first circuit is provided. A dielectric layer...
Coreless packaging substrate and fabrication method thereof
A coreless packaging substrate is provided, which includes: a dielectric layer having opposite first and second surfaces; a first circuit layer embedded in the...
Method for fabricating circuit board structure
A method for fabricating a circuit board structure is provided. The method includes providing a first circuit board and a second circuit board, wherein the area...
Electric component module and method of manufacturing the same
There is provided an electronic component module capable of increasing a degree of integration by mounting electronic component on both surfaces of a substrate,...
Method for aligning electronic components
For aligning an electronic component to a required orientation, the electronic component is picked up and it is inspected while it is being held to determine...
Environmental sensitive electronic device package and manufacturing method
An environmental sensitive electronic device package including a first substrate, a second substrate, an environmental sensitive electronic device, a side wall...
High aspect ratio traces, circuits, and methods for manufacturing and
using the same
High aspect ratio trace circuits and methods of manufacture and use are provided herein. A method may include obtaining a substrate, the substrate having a...
Methods of manufacturing metal wiring buried flexible substrate by using
plasma and flexible substrates...
Disclosed are methods of manufacturing a metal wiring buried flexible substrate by using plasma and flexible substrates manufactured by the same. The method...
Transparent conductor and preparation method thereof
A transparent conductor includes a transparent substrate, a conductive mesh, and an insulating protective layer, which are laminated in that order, wherein the...
Electronic component embedded substrate and manufacturing method thereof
The present invention discloses an electronic component embedded substrate and a manufacturing method thereof. The electronic component embedded substrate in...
Integrated interposer with embedded active devices
An integrated interposer between a first component and a second component includes a substrate. The substrate may have thermal and/or mechanical properties with...
A package carrier suitable for carrying at least a chip is provided. The package carrier includes an insulating layer, a patterned circuit layer, a plurality of...
Electromagnetic shielding member and electromagnetic shielding structure
An electromagnetic shielding member comprises: a shielding portion, including a metal material, for sealing an electronic component on an electronic circuit...
Laminated electric inductor
A laminated electronic component is configured such that insulator layers and conductor patterns are laminated and a coil is formed in a laminate of the...
Printed wiring board and method for manufacturing the same
A printed wiring board includes a insulation layer, a first conductive layer embedded into first surface of the insulation layer and having surface exposed on...
Multi-layer printed circuit board and method for fabricating multi-layer
printed circuit board
Embodiments of the present disclosure relate to the field of electronics and, in particular, to a multi-layer printed circuit board and a method for fabricating...
Maximizing surface area of surface mount contact pads of circuit board
also having via contact pads
A circuit board has a first side and a second side opposite thereto. The board includes vias extending through the substrate from the first side to the second...
Printed wiring board and method for manufacturing the same
A printed wiring board includes an insulation layer, a first conductive layer embedded into first surface of the insulation layer, a second conductive layer...
Printed circuit board and manufacture method thereof
A printed circuit board is disclosed having a substrate with an insulating layer, aluminum foil layers disposed on both sides of the insulating layer, and a...