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| Patent # | Description |
|---|---|
| US-9,603,295 |
Mounted structure and manufacturing method of mounted structure In a case where a first mounted substrate to which a semiconductor element is bounded by solder is mounted on a second substrate, connection strength becomes... |
| US-9,603,294 |
Apparatus for mounting semiconductor chips An apparatus includes a pick and place system with a bonding head, picking head and support table. The picking head and support table are mounted on a carriage.... |
| US-9,603,293 |
Noise-reducing shielded cable As a noise-reducing shielded cable according to the present invention, provided is a shielded cable having an inverter (10), a motor (30), a cable (20)... |
| US-9,603,292 |
Aluminum EMI/RF shield with fins A shield made from aluminum (AL) or an aluminum-based alloy coated with a solderable plating such as nickel or tin provides thermal improvement over existing... |
| US-9,603,291 |
Semiconductor device A semiconductor device includes a semiconductor element accommodated in an outer case; a control circuit board fixed to the outer case at a position away from... |
| US-9,603,290 |
Shield unit and method of manufacturing same A first plate of a shield shell includes a flat plate member and at least one crimping piece extending from an outer circumferential edge of the flat plate... |
| US-9,603,289 |
Chassis arrangement systems and methods for dual depth cards and dual
depth faraday cages A chassis arrangement includes different depth cards with associated Faraday cages. The chassis arrangement provides support for a first set of cards at a first... |
| US-9,603,288 |
Electronic/electrical component housing with strips of metal plate and
shape memory material forming a heat... A housing for electronic/electrical components includes an inner panel and an outer panel, a strip of metal plate, and a strip of shape memory material. The... |
| US-9,603,287 |
Integrated power module An integrated power module is provided, which may include a gate driver circuit, a plurality of first metal plates, a plurality of chips, a plurality of second... |
| US-9,603,286 |
Heat sink attachment apparatus and method There is provided an electronic device. The electronic device includes a circuit board having heat generating components thereon. The electronic device further... |
| US-9,603,285 |
Coolant supply unit, cooling unit, and electronic device A coolant supply unit includes a plurality of pumps, a casing that includes a coolant inlet port, a plurality of branch ports that respectively convey coolant... |
| US-9,603,284 |
Fluid heat exchanger configured to provide a split flow A fluid heat exchanger can define a plurality of microchannels each having a first end and an opposite end and extending substantially parallel with each other... |
| US-9,603,283 |
Electronic module with free-formed self-supported vertical interconnects An electronic module, and method for making same, includes free-formed, self-supported interconnect pillars that electrically connect cover electronic... |
| US-9,603,282 |
Datacenter and cooling control fault-tolerance using compute resources Management of infrastructure devices is performed by computing devices that are associated with the processing being provided by the data center, such as... |
| US-9,603,281 |
Truly modular building datacenter facility A modular datacenter facility is constructed with a set of building modules of different types of functionality to form an entire datacenter facility having a... |
| US-9,603,280 |
Flash module A flash module includes a top cover and a bottom cover, a printed circuit board (PCB) comprising memory, solid state storage, a storage controller configured to... |
| US-9,603,279 |
Central electronics complex (`CEC`) and fan structure A server chassis, including: a first compartment configured to receive one or more central electronics complexes (`CECs`); and a second compartment configured... |
| US-9,603,278 |
Server casing and plate connecting structure thereof A server casing includes a frame having first and second plates and a plate connecting structure including first and second side boards extending from the first... |
| US-9,603,277 |
Field-reconfigurable backplane system In a circuit card chassis, a backplane system includes card guides that are slideable on rails to provide any selected spacing between adjacent circuit cards. A... |
| US-9,603,276 |
Electronic assembly that includes a plurality of electronic packages Some forms relate to an electronic assembly that includes a plurality of electronic package. The electronic assembly includes a frame and a first electronic... |
| US-9,603,275 |
Blackplane board and wiring method of backplane board The present invention is a backplane board including a first circuit board, a second circuit board, a first slot in which a first connector is connected with... |
| US-9,603,274 |
Container for housing electronic component and electronic device A container for housing an electronic component includes: a container body including a bottom plate and a polygonal side wall surrounding a central region of... |
| US-9,603,273 |
Universal system for mounting rack doors A mount for mounting a door to rack includes a rack including a first pair of vertically-extending supports, each support including an array of openings; a... |
| US-9,603,272 |
Lid structure and electronic device A lid structure includes: a housing; a lid body configured to open and close an opening of the housing; an elastic member configured to be compressed by the... |
| US-9,603,271 |
Foldable display apparatus A foldable display apparatus including a display panel configured to include a display area including a first display area, a second display area, and a bending... |
| US-9,603,270 |
Docking mechanism for locking and undocking multiple electronic
instruments A docking mechanism for locking and undocking multiple electronic instruments is provided which includes upper and lower instruments. The upper electronic... |
| US-9,603,269 |
Modular enclosure and construction method A modular enclosure configurable to achieve one of a plurality of environmental ratings is disclosed. The modular enclosure includes a base having a... |
| US-9,603,268 |
Gas barrier film, method of producing a gas barrier film, and electronic
device Provided is a gas barrier film including a base, a first barrier layer containing silicon which is formed on at least one surface of the base, and a second... |
| US-9,603,267 |
Bracket and frame body having the same A frame body includes a bottom plate, a connection portion, and a bracket. The bracket includes a first sidewall, a second sidewall, a bending portion, a... |
| US-9,603,266 |
Display device Provided is a display device that has: first engaging portions formed on a frame member; and second engaging portions that are formed on a front plate and... |
| US-9,603,265 |
Multi-layered printed circuit board having inner-layer portion and
outer-layer portions and manufacturing... A multi-layered printed circuit board and a manufacturing method thereof are disclosed. The multi-layered printed circuit board in accordance with an aspect of... |
| US-9,603,264 |
Method and apparatus for welding printed circuits The invention relates to a method for bonding stacked layers (19, 20) for making printed circuits, by electromagnetic induction. In particular, a magnetic flux... |
| US-9,603,263 |
Manufacturing method of circuit substrate A manufacturing method of a circuit substrate includes the following steps. The peripheries of two metal layers are bonded to form a sealed area. At least a... |
| US-9,603,262 |
Electronic component mounting apparatus and method An electronic component mounting apparatus includes a bonding tool for thermally bonding an electronic component onto a substrate, the bonding tool to be driven... |
| US-9,603,261 |
Method for improving coating A system and a method, the method includes determining or receiving a multiple iteration printing scheme indicative of multiple printing iterations of a coating... |
| US-9,603,260 |
Method and products related to deposited particles The invention concerns a method of removing encapsulating material from encapsulated particles deposited onto a substrate. According to the method, a substrate... |
| US-9,603,259 |
Methods for surface attachment of flipped active components An active substrate includes a plurality of active components distributed over a surface of a destination substrate, each active component including a component... |
| US-9,603,258 |
Composition and method for electroless plating of palladium phosphorus on
copper, and a coated component therefrom A solution comprising a palladium compound and a polyaminocarboxylic compound has been found to be suitable as a bath for electroless plating of palladium onto... |
| US-9,603,257 |
Pattern substrate, method of producing the same, information input
apparatus, and display apparatus A pattern substrate includes a substrate having a surface on which a first area and a second area are formed, and a pattern layer formed at the first area among... |
| US-9,603,256 |
Process for producing articles having an electrically conductive coating The present invention relates to a process for producing articles having on at least part of their surface an electrically conductive coating by at least partly... |
| US-9,603,255 |
Method for producing a printed circuit board A method for producing a printed circuit board is disclosed. In the method, a slot is formed in a substrate having at least three layers with the slot extending... |
| US-9,603,254 |
Apparatus for filling a wafer via with solder A wafer via solder filling device includes a solder bath comprising an accommodation space for accommodating a molten solder, with an open top, and an air... |
| US-9,603,253 |
Wiring substrate, manufacturing method therefor, and semiconductor package A wiring substrate includes a heat radiation plate and a substrate provided on the heat radiation plate interposed by an adhesive layer. The substrate includes... |
| US-9,603,252 |
Integrated circuit device system with elevated configuration and method of
manufacture thereof A system and method of manufacture of an integrated circuit device system includes: a carrier having a first side; a base device mounted on the first side; a... |
| US-9,603,251 |
Apparatus and method of midplane panel connections A connector board for an electronic assembly, the connector board including a passive circuit board, mounted horizontally at an elevated position within the... |
| US-9,603,250 |
Electromagnetic field manipulation around vias A circuit may include a signal path, a first layer including the signal path, and a second layer including the signal path. The circuit may additionally include... |
| US-9,603,249 |
Direct metalization of electrical circuit structures An electrical interconnect including a first circuitry layer with a first surface and a second surface. At least a first dielectric layer is printed on the... |
| US-9,603,248 |
Wiring board and method for manufacturing the same A wiring board includes a board including a core, a conductive layer on the core, and a laminated structure over the core and conductive layer, and a stacked... |
| US-9,603,247 |
Electronic package with narrow-factor via including finish layer This disclosure relates generally to an electronic package and methods that include an electrically conductive pad, a package insulator layer including a... |
| US-9,603,246 |
Electronic package, package carrier, and method of manufacturing package
carrier A method of manufacturing package carrier is provided. In the method, a holding substrate and a conductive layer are provided. The conductive layer is on the... |
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