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Patent # Description
US-9,615,495 Electronic component mounting system and electronic component mounting method
An electronic component is mounted on a substrate according to a mounting mode which is set in advance in the following mounting information--when component...
US-9,615,494 Substrate conveyance mechanism and component mounting device
A substrate conveyance mechanism includes conveyance units and a clamp mechanism. The conveyance units include a working unit corresponding to a working area...
US-9,615,493 Light emitting device, and method for manufacturing circuit board
A method for manufacturing a circuit board constituted by a light emitting device and a mounting board includes the steps of: conveying the light emitting...
US-9,615,492 Electromagnetic gaskets for a cable connection
A gasket assembly structure including a frame which includes a front half and a back half joined together with a plurality of interlocking tabs located around a...
US-9,615,491 Insulating body with a cruciform shield
The invention discloses an insulating body (1) which is provided for receiving and/or electrically contacting at least one conductor of a cable to be connected...
US-9,615,490 Coldplate with integrated DC link capacitor for cooling thereof
A coldplate for use with an inverter of an electric vehicle includes a coldplate member. The coldplate member includes a pocket configured to receive a DC link...
US-9,615,489 Arrangement for providing air to a room
The invention relates to an arrangement for providing air to a room is provided. The arrangement comprises a first inlet for taking in air from the room, a...
US-9,615,488 Datacenter aisle containment structure
An air containment system for a datacenter. The air containment system includes horizontally slidable vertical rails that engage the rear rails to two adjacent...
US-9,615,487 Computer storage array
A computer storage array and ventilation system comprising a vertical air passageway adjacent to a plurality of ventilation apertures defined in a plurality of...
US-9,615,486 Thermal interface devices
A thermal interface device having a containment structure and a thermal conductor is provided. Further, the containment structure includes at least one wall,...
US-9,615,485 Computing system enclosure airflow management
The disclosed technology provides systems and methods for an enclosure system with optimized internal dynamically controllable airflow distribution. The systems...
US-9,615,484 Method, system and apparatus for cooling a mobile device
Method, system and apparatus for cooling a mobile device is provided. The device comprises: a housing comprising one or more apertures; a heat producing device;...
US-9,615,483 Techniques and configurations associated with a package load assembly
Embodiments of the present disclosure are directed toward techniques and configurations associated with a package load assembly. In one embodiment, a package...
US-9,615,482 Shaped heat sinks to optimize flow
A heat sink with shape-optimized fins provides for improved heat transfer. Synthetic jets create vortices which enhance heat transfer and cooling of downstream...
US-9,615,481 Modular mount rack frame
A modular mount rack frame for storing mounted devices is described herein. A first embodiment of a mount rack frame includes a modular rigid support structure...
US-9,615,480 Storage device assembly
The disclosed technology includes an open frame storage device assembly for computing equipment. The assembly is configured to vertically suspend carriers,...
US-9,615,479 Slide rail interlocking apparatus and electronic device having the same
An electronic device includes a cabinet, a number of chasses received in the cabinet, a number of first slide rails mounted to the cabinet, a second slide rail...
US-9,615,478 Arrangement for a blade server slide-in module
An arrangement for a blade server slide-in module includes a motherboard with a plug connector, a riser card inserted in the plug connector of the motherboard,...
US-9,615,477 Connecting device, flat panel device, image sensor, display and touch apparatus
A connecting device for connecting a substrate unit and a chip unit includes a first flexible connection unit having at least one first wire extending from a...
US-9,615,476 Housing for encasing a mobile device
This disclosure relates generally to an apparatus and/or system for housing a device. The apparatus includes a housing that is configured such that a device may...
US-9,615,475 Touch panel sealing apparatus
A sealing apparatus of a touch panel provided in a portable terminal including a body and the touch panel, wherein the sealing apparatus is attached and coupled...
US-9,615,474 Device for quick splicing of a display screen
A device for quick splicing of a display screen is provided. The device includes a left assembly and a right assembly. The left assembly includes a rotation...
US-9,615,473 Flexible electronic device
A flexible electronic device is disclosed, including: a case frame, comprising a plurality of unit case frames space at regular intervals, engaged to move...
US-9,615,472 Preload anchoring mechanism with top cap adapted to receive subsystems, controls, indicators, and the like
An apparatus for removably securing an electrical element within a tubular steerer tube within a frame element consists of a canister for housing the electrical...
US-9,615,471 Component carrier
An apparatus having a component carrier assembly configured for supporting a component. The component carrier assembly having a first mating element and a...
US-9,615,470 Wiring combiner box
A wiring combiner box for combining wires from photovoltaic panels includes a fuse block mounted to a side wall of an enclosure. This construction design allows...
US-9,615,469 Electronic device and method for producing an electronic device
An electronic device including: an electronic unit accommodated in a circuit housing and a molded body which surrounds the circuit housing. The molding compound...
US-9,615,468 Injection molded control panel with in-molded decorated plastic film
Provided are systems and methods for a control assembly including: a first film that is in-molded that includes decorative graphics, a front surface and a rear...
US-9,615,467 Mounting structure for circuit boards in electronic device
A mounting structure for circuit boards in an electronic device is provided. The mounting structure includes a housing, a first circuit board, a second circuit...
US-9,615,466 Tool less component carrier
A component carrier includes a housing having an open front portion, two partially open sidewalls, and a partial rear wall forming a receiving space. The...
US-9,615,465 Method of production of multilayer circuit board
A method of production of a multilayer circuit board comprising using a curable composition which contains a heat curable resin and curing agent (I) to form an...
US-9,615,464 Method of mounting semiconductor element, and semiconductor device
A method of mounting a semiconductor element, the method includes: attaching a first solder joint material onto a first pad formed on a substrate supplying a...
US-9,615,463 Method for producing a high-aspect ratio conductive pattern on a substrate
Conductive patterns and methods of using and printing such conductive patterns are disclosed. In certain examples, the conductive patterns may be produced by...
US-9,615,462 Capacitive touch sensor integrated with window panel and fabrication method thereof
Disclosed is a capacitive touch sensor integrated with window panel, comprising: a transparent window panel substrate 311; a non-conductive opaque decorative...
US-9,615,461 Wiring module including wiring substrate having border portion separating two side metallic foils and...
A wiring substrate includes a resin substrate in which first and second through holes are formed, a metallic foil on one surface of the resin substrate coating...
US-9,615,460 Circuit board device and circuit board device for reducing acoustic noise
A circuit board device for reducing acoustic noise is provided. The circuit board device includes a substrate, a first capacitor packaging area, a second...
US-9,615,459 Inductor, circuit board, and implementing method of the inductor
An inductor, a circuit board and a method for forming an inductor are provided. The inductor comprises: a first pad arranged on a first metal wiring layer of a...
US-9,615,458 Three-dimensional circuit component, method of making the same, and physical-quantity measuring instrument
For producing a three-dimensional circuit component, an electronic component is mounted on a synthetic resin block. A plurality of electrically-conductive...
US-9,615,457 Electronic entity with coupling integrated between a microcircuit and an antenna and method of fabrication
An electronic entity includes a module formed of a support film carrying, on an internal face, a microcircuit and a first coupling coil, and a body including a...
US-9,615,456 Microelectronic assembly for microelectronic packaging with bond elements to encapsulation surface
A structure may include bond elements having bases joined to conductive elements at a first portion of a first surface and end surfaces remote from the...
US-9,615,455 Copper particulate dispersion, conductive film forming method and circuit board
The copper particulate dispersion includes copper particulates, at least one kind of a dispersion vehicle containing the copper particulates, and at least one...
US-9,615,454 Transparent conductor, method of manufacturing the same, and electronic device including the transparent conductor
A transparent conductor includes a metallic glass, and a method of manufacturing a transparent conductor includes: preparing a metallic glass or a mixture...
US-9,615,453 Method for fabricating glass substrate package
A substrate comprising a solid glass core having a first surface and a second surface opposed to the first surface; multiple conductors extending through the...
US-9,615,452 Silver filled trench substrate for high power and/or high temperature electronics
A power substrate utilizing silver conductors on ceramic, and the process for making said device. The insulating portion of the substrate is fabricated from a...
US-9,615,451 Porous alumina templates for electronic packages
Interposers and methods of making the same are disclosed herein. In one embodiment, an interposer includes a region having first and second oppositely facing...
US-9,615,450 Conductive pattern and manufacturing method thereof
The present invention provides a method for manufacturing a conductive pattern, comprising the steps of: a) forming a conductive film on a substrate; b) forming...
US-9,615,449 Foldable display device
A foldable display device having an excellent folding characteristic without image quality deterioration on a folding portion is provided. The foldable display...
US-9,615,448 Method for fabricating thin sheets of glass
Fabrication of thin sheets of glass or other substrate material for use in devices such as touch sensor panels is disclosed. A pair of thick glass sheets,...
US-9,615,447 Multilayer electronic support structure with integral constructional elements
A multilayer electronic support structure including at least one pair of adjacent feature layers extending in an X-Y plane that are separated by a via layer;...
US-9,615,446 Low cross-talk differential microstrip lines having slots therein of subwavelength configuration
The present invention discloses a pair of differential microstrip lines with low cross-talk for high-frequency signal transmission. The pair of microstrip lines...
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