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Patent # Description
US-9,997,689 Chip reducing thermal stress of current path thereon
A chip reducing thermal stress of current path thereon, including: a substrate having at least one nanowires zone formed on a surface thereof; and at least one...
US-9,997,688 Display apparatus and manufacturing method thereof
A display apparatus and a method of manufacturing the same includes a plurality of light emitting diode modules each including a plurality of light emitting...
US-9,997,687 Light-emitting device
A light-emitting device comprising: a supportive substrate; a transparent layer formed on the supportive substrate, and the transparent layer comprising...
US-9,997,686 Islanded carrier for light emitting device
A low-cost conductive carrier element provides structural support to a light emitting device (LED) die, as well as electrical and thermal coupling to the LED...
US-9,997,685 Light-emitting device
Light emitting device includes structure protruding from a side of a surface of second conductive semiconductor layer of LED chip toward a side of a surface of...
US-9,997,684 Pre-rotated overmoulded bidirectional spreading lens for stretched leadframe architecture
A method for manufacturing a solid state light-emitting device (LED) lighting apparatus includes forming a leadframe assembly with a group of leadframes...
US-9,997,683 Light emitting device package and lighting device having the same
A light emitting device package is provided. The light emitting device package may include a frame, a first lead frame spaced apart from the frame, a second...
US-9,997,682 Light emitting element unit and method for manufacturing the same, light emitting element package and...
A light emitting element unit according to the present invention includes a semiconductor light emitting element that has a surface, a back surface, and a side...
US-9,997,681 Lens and light emitting diode package including same
One embodiment relates to a lens comprising: a lower end portion having an incident surface to which light is incident; and an upper end portion having an...
US-9,997,680 Light emitting device having first and second resin layers
A light emitting device includes a substrate, a light emitting element provided on the substrate, a first resin layer provided on the substrate to directly...
US-9,997,679 Light-emitting device
A light-emitting device of the invention includes, a first substrate; a light-emitting element mounted on the first substrate and includes a second substrate...
US-9,997,678 Light-emitting device, method for designing light-emitting device, method for driving light-emitting device,...
An object of the present invention is to provide a light-emitting device that can implement a natural, vivid, highly visible and comfortable appearance of...
US-9,997,677 Illumination method and light-emitting device
To provide an illumination method and a light-emitting device which are capable of achieving, under an indoor illumination environment where illuminance is...
US-9,997,676 Light emitting device and manufacturing method thereof
A light emitting device includes a wavelength conversion layer, at least one light emitting unit and a reflective protecting element. The wavelength conversion...
US-9,997,675 Light-emitting-device package and production method therefor
A light-emitting-device package according to one aspect of the present invention includes: a metal substrate; a light emitting device disposed on a first...
US-9,997,674 Optical cavity including a light emitting device and wavelength converting material
Embodiments of the invention include a semiconductor light emitting diode attached to a substrate. A first region of wavelength converting material is disposed...
US-9,997,673 Light emitting diode for surface mount technology, method of manufacturing the same, and method of...
A light emitting diode (LED) includes a substrate, a first semiconductor layer disposed on the substrate, an active layer disposed on the first semiconductor...
US-9,997,672 Electrode structure of light emitting diode
An electrode structure of an LED includes an adhesion layer and a bond pad layer. The adhesion layer is stacked on the LED. The bond pad layer is stacked on the...
US-9,997,671 Composite substrate, semiconductor chip having a composite substrate and method for producing composite...
A composite substrate has a carrier and a utility layer. The utility layer is attached to the carrier by means of a dielectric bonding layer and the carrier...
US-9,997,670 Semiconductor light emitting device package
A semiconductor light emitting device package includes a light emitting structure having a first conductive semiconductor layer, an active layer, a second...
US-9,997,669 High power light emitting device and method of making the same
Disclosed herein are a light emitting device and a method of making the same. The light emitting device includes: a substrate including a first lead and a...
US-9,997,668 Semiconductor light-emitting device
A semiconductor light-emitting device includes a substrate, a first reflective layer disposed on the substrate and including first openings, a first...
US-9,997,667 Semiconductor material doping
A solution for designing and/or fabricating a structure including a quantum well and an adjacent barrier is provided. A target band discontinuity between the...
US-9,997,666 Light emitting device
The disclosed light emitting device includes an intermediate layer interposed between the light emitting semiconductor structure and the substrate. The light...
US-9,997,665 Multiple quantum well structure and light emitting diodes
A light emitting diode has a light emitting region including a multiple quantum well structure, including a first protection layer, a first intermediate layer...
US-9,997,664 Optical elements and electronic devices including the same
An optical element includes a plurality of nanowires disposed in the form of an array and a light emitting material disposed on the nanowires, where the...
US-9,997,663 Semiconductor light emitting device
There is provided a semiconductor light emitting device including a conductive substrate, a first electrode layer, an insulating layer, a second electrode...
US-9,997,662 Light-emitting metal-oxide-semiconductor devices and associated systems, devices, and methods
Various embodiments of solid state transducer ("SST") devices are disclosed. In several embodiments, a light emitter device includes a metal-oxide-semiconductor...
US-9,997,661 Method of making a copper oxide/silicon thin-film tandem solar cell using copper-inorganic film from a eutectic...
A method of making a copper oxide/inorganic thin film tandem semiconductor device including the steps of: depositing a textured buffer layer on an amorphous...
US-9,997,660 Light blocking sheet, imaging lens module and electronic apparatus
A light blocking sheet includes a first outer layer, a second outer layer, an inner substrate layer and a central axis. The first outer layer includes a first...
US-9,997,659 Group-IV solar cell structure using group-IV or III-V heterostructures
Device structures, apparatuses, and methods are disclosed for photovoltaic cells that may be a single junction or multijunction solar cells, with at least a...
US-9,997,658 Photovoltaic cell module
A photovoltaic cell module includes: a transparent upper cover plate, a first polyolefin encapsulation layer, a cell group layer, a second polyolefin...
US-9,997,657 Barrier assembly
An assembly that includes a barrier film interposed between a first polymeric film substrate and a first major surface of a pressure sensitive adhesive layer is...
US-9,997,656 Photodetector cell and solar panel with dual metal contacts and related methods
A photodetector cell may include a substrate, and a first contact carried by the substrate and having a first work function value. The photodetector cell may...
US-9,997,655 Solution process for silver-containing chalcogenide layer deposition
A method of preparing a Ag.sub.2ZnSn(S,Se).sub.4 compound, including dissolving selenourea (SeC(NH.sub.2).sub.2) in an aprotic solvent, and dissolving a silver...
US-9,997,654 Solar cell receiver
A solar cell receiver is provided that includes a semiconductor element that has a front face, a solar cell provided on the front face, a rear face, multiple...
US-9,997,653 Back-contact solar cell and method for manufacturing the same
A method for manufacturing a back-contact solar cell, comprising the steps of: (i) preparing a semiconductor substrate comprising an n-layer and a p-layer at...
US-9,997,652 Deposition approaches for emitter layers of solar cells
Methods of fabricating solar cells, and the resulting solar cells, are described herein. In an example, a method of fabricating a solar cell includes forming a...
US-9,997,651 Damage buffer for solar cell metallization
A solar cell structure includes a semiconductor region disposed in or above a substrate. A damage buffer can be disposed above the semiconductor region. First...
US-9,997,650 Solar cell, manufacturing method thereof, and solar cell module
A solar cell includes: a first-conductivity-type semiconductor substrate that includes an impurity diffusion layer on one surface side, which is a light...
US-9,997,649 Electrode composition, electrode manufactured using the same, and solar cell
An electrode composition, an electrode, and a solar cell, the composition including a conductive powder; glass frit; an organic binder; and a solvent, wherein...
US-9,997,648 Composition for solar cell electrode and electrode prepared using the same
A composition for solar cell electrodes and a solar cell electrode, the composition including silver powder; glass frit that contains tellurium, the glass frit...
US-9,997,647 Solar cells and manufacturing method thereof
A solar cell and a method for manufacturing the same are disclosed. The solar cell includes a substrate, an emitter region positioned at one surface of the...
US-9,997,646 Solar cell, and solar cell module employing the same
A solar cell is provided. The solar cell includes a first electrode, a second electrode, and a photoelectric conversion layer, disposed between the first...
US-9,997,645 Optical sensor device
A package for an optical sensor device has a double-molded structure in which a first resin molded portion and a second resin molded portion are integrated. The...
US-9,997,644 Control circuits for dynamically biased avalanche photodiodes
Method and apparatus for maximizing the output of a dynamically biased avalanche photodiode (APD). The output of the APD is amplified. A feedback loop...
US-9,997,643 Diode structure
A diode structure includes a rectangular first doping region, and a second doping region surrounds the first doping region wherein the first doping region and...
US-9,997,642 Diode, diode string circuit, and electrostatic discharge protection device having doped region and well...
A diode includes a substrate, a first insulating layer, a second insulating layer, a well, a deep doped region, a first doped region, and a second doped region....
US-9,997,641 SONOS ONO stack scaling
A method of scaling a nonvolatile trapped-charge memory device and the device made thereby is provided. In an embodiment, the method includes forming a channel...
US-9,997,640 Dual channel memory
Technologies are generally described related to a dual channel memory device, system and method of manufacture. Various described devices include utilization of...
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