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Patent # Description
US-1,003,4420 DIMM extraction tool
Aspects of the present invention disclose a DIMM extraction tool for extracting a DIMM from a DIMM socket. Exemplary embodiments of the DIMM extraction tool...
US-1,003,4419 Detaching apparatus for detaching component from circuit board
A detaching apparatus includes a bench, a first supporting member attached to the bench, a convey system, a positioning member, a second supporting member, and...
US-1,003,4418 Concrete mix for shotcrete applications for electromagnetic shielding
Conductive concrete mixtures for shotcrete applications are described that are configured to provide varied EM shielding and reflect and/or absorb, for...
US-1,003,4417 System and methods for simulation-based optimization of data center cooling equipment
Aspects of this disclosure are directed to a simulation-based cooling optimization method that provides real-time cooling set points in a data center. The...
US-1,003,4416 Transverse cooling system and method
A system and method for cooling a plurality of electronics cabinets having horizontally positioned electronics assemblies. The system includes at least one...
US-1,003,4415 Water cooling device
A water cooling device includes a radiator provided with a radiating member and connected with a water tank, which is connected with a first pump and a second...
US-1,003,4414 Modular data center
A modular data machine room includes a data cabinet subsystem, a cooling subsystem and a power distribution subsystem. The data cabinet subsystem includes two...
US-1,003,4413 Air deflection plug-in box for forced air-cooled cabinet and forced air-cooled cabinet
The disclosure discloses an air deflection plug-in box for a forced air-cooled cabinet. The air deflection plug-in box includes a front vertical plate with one...
US-1,003,4412 Device with heat transfer portion
A subsea electronic device includes a housing, a chassis within the housing to which one or more electronic cards are mounted and heat transfer sections in...
US-1,003,4411 Thermal flow assembly including integrated fan
An electronic device includes an outer housing having an upper enclosure and a foot coupled thereto, a heat generating component, and a fan assembly integrated...
US-1,003,4410 Support apparatus
A support apparatus is configured to support electronic components. The support apparatus includes a tray and a plurality of recessed structures. The tray has a...
US-1,003,4409 Individual front hot-pluggable power suppy unit with cable routing
Server rack assembly having a chassis and two or more power supply units configured to be received within the chassis. Each power supply unit configured to be...
US-1,003,4408 Locking devices
Examples herein relate to locking devices. In one example, a locking device comprises a metal sheet, the metal sheet comprising an elongated flexible arm...
US-1,003,4407 Storage sled for a data center
Examples may include a sled for a rack of a data center including physical storage resources. The sled comprises mounting flanges to enable robotic insertion...
US-1,003,4406 Uniform equipment mounting system
A universal mounting system is provided for use in connection with substantially any type of electronic equipment so was to reduce or substantially avoid the...
US-1,003,4405 Compute device casing that doubles as packaging and shipping container for the compute device
A method for structurally protecting an information handling system (IHS) for both shipment and operation includes: providing a lightweight server (LWS)...
US-1,003,4404 Interchangeable panel or plate for server case
A server case, chassis, or enclosure with an easily removable front panel or plate. The outside or front of the front panel may be decorated with a logo,...
US-1,003,4403 Card retainer device
A card retainer device for securing a card module in a channel of a chassis. The card retainer device includes wedge members which have main portions with...
US-1,003,4402 Components of an electronic device and methods for their assembly
Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or...
US-1,003,4401 Power semiconductor device and power conversion device
A power semiconductor device includes a plurality of power semiconductor elements constituting upper and lower arms of an inverter circuit, a first sealing...
US-1,003,4400 Item storage arrangement system and method
A system for storing and tracking at least one item includes a housing having an interior with a plurality of item storage arrangements disposed in or...
US-1,003,4399 Display device
A display device is disclosed. The display device of the present invention includes: a display panel; a back cover provided to the rear side of the display...
US-1,003,4398 Docking station with rotatable multi-plug connector
In one example, a docking station includes a base and a rotatable multi-plug connector to electrically plug into the electronic device. The multi-plug connector...
US-1,003,4397 System and method for seismically stabilized UPS
In accordance with presently disclosed embodiments, an seismically stabilized uninterruptable power supply (UPS) is provided. The UPS utilizes a series of rails...
US-1,003,4395 Flexible display device
A flexible display device is disclosed. In one aspect, the display device includes a display substrate and a display element layer formed over the display...
US-1,003,4394 Electrical component enclosure with a hygienic hinge
An electrical component enclosure with a hygienic hinge, which is used to house electric components, includes a body for fixing to a surface and having six...
US-1,003,4393 Implementing high-speed signaling via dedicated printed circuit-board media
Some embodiments of the inventive subject matter are directed to forming, on a first circuit board, first pins that connect to first leads of a first electronic...
US-1,003,4392 Method and system for nozzle compensation in non-contact material deposition
A method of printing is provided where printing is using a first printing unit having redundant nozzles. Then, the method may include stopping the printing with...
US-1,003,4391 Selective partitioning of via structures in printed circuit boards
The embodiments herein relate to a method for selective partitioning of a via in a printed circuit board as to produce an electrically isolating portion between...
US-1,003,4390 Metal post bonding using pre-fabricated metal posts
A method includes forming a plurality of metal posts. The plurality of metal posts is interconnected to form a metal-post row by weak portions between...
US-1,003,4389 Electric component mounting method
Provided is an electronic component mounting method including the steps of: placing an electronic component having a primary surface on which a first electrode...
US-1,003,4388 Suspension board with circuit and producing method thereof
A suspension board with circuit includes a metal supporting layer, a base insulating layer disposed at one side in a thickness direction of the metal supporting...
US-1,003,4387 Method for recycling of obsolete printed circuit boards
Processes for recycling printed wire boards using environmentally-friendly compositions, wherein electronic components, precious metals and base metals may be...
US-1,003,4386 Patterning of electroless metals by selective deactivation of catalysts
Methods and devices for patterning electroless metals on a substrate are presented. An active catalyst layer on the substrate can be covered with a patterned...
US-1,003,4385 Method of preparing metal pattern having 3D structure
The present application relates to a method of preparing a metal pattern having a 3D structure, a metal pattern laminate, and use of the metal pattern laminate....
US-1,003,4384 Structure containing conductor circuit, method for manufacturing same, and heat-curable resin composition
A method for manufacturing a structure containing a conductor circuit according to the present invention can provide openings in various shapes by patterning a...
US-1,003,4383 Manufacturing method of part-mounting package
A method of manufacturing a part-mounting package includes: forming a first through-hole in a first insulating sheet and forming a second through-hole whose...
US-1,003,4382 Method of manufacturing a flexible and/or stretchable electronic device
A method of manufacturing a flexible electronic device is provided. The method includes a) filtering a mixture including an electrically conducting...
US-1,003,4381 Flexible substrate having a via-hole with a conductive material and a method for manufacturing the same
In a flexible substrate and a method for manufacturing the flexible substrate, the flexible substrate includes a polymer substrate, a through conductive...
US-1,003,4380 Electronic device and method for manufacturing electronic device
An intermediate connection layer interposed between a wiring substrate and an electronic part includes a rigid substrate and a flexible substrate. A plurality...
US-1,003,4379 Stacked electronic structure
A stacked electronic structure is provided. The stacked electronic structure includes: a magnetic device, electronic devices, and a substrate. The substrate is...
US-1,003,4378 Curved display device
A curved display device includes a semiconductor chip package including a base film, a plurality of driving chips on the base film, and an input wire unit and...
US-1,003,4377 Display device
A display device includes a flexible insulating substrate, an insulating layer on the insulating substrate, and a plurality of terminals made of a conductive...
US-1,003,4376 Internal/external circuit board connection structure
A circuit board structure includes a first circuit board, a second circuit board and a plurality of first connection portions. The first circuit board has a...
US-1,003,4375 Circuit substrate with embedded heat sink
An apparatus includes a main substrate, a device, and a heat spreader. The main substrate is configured for mounting the device in a mounting location thereon...
US-1,003,4374 Display device
According to one embodiment, a display device includes a first substrate including a first basement and a first conductive layer, a second substrate including a...
US-1,003,4373 Circuit board secured to battery cell using a circuit board through hole and methods for welding the circuit board
An electronic device having a circuit board and a battery is disclosed. The circuit board may include a through hole and an electrical pad surrounding the...
US-1,003,4372 Stackable via package and method
A stackable via package includes a substrate having an upper surface and a trace on the upper surface, the trace including a terminal. A solder ball is on the...
US-1,003,4371 Resin composition for printed wiring board, prepreg, metal foil-clad laminate, resin composite sheet, and...
A resin composition for a printed wiring board including: a cyanate compound represented by the following general formula (1); and an epoxy resin, ##STR00001##
US-1,003,4370 Stretchable circuit board and method for manufacturing stretchable circuit board
A stretchable circuit board includes: a stretchable portion 50 that includes a stretchable base 53 haying stretchability and a stretchable wiring 55 formed on a...
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