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Patent # Description
US-1,005,8020 Electronic component mounting system
An electronic component mounting system includes: mounting line management apparatuses disposed in each of mounting lines and an integrated management apparatus...
US-1,005,8019 Bonding apparatus
A bonding apparatus includes: a backup unit including a light-transmissive transmission member having a support surface which supports at least a bonding region...
US-1,005,8018 Flexible assembly machine, system and method
An assembly machine includes a plurality of track modules, each track module including a section of track, the plurality of track modules connectable to form a...
US-1,005,8017 Electromagnetic contamination neutralization composition, device, and method
A tangible device such as a credit card shaped device that includes at least one waffler carved therein. A bottom stabilizing material in the shape of a film or...
US-1,005,8016 Compensation of magnetic interference
A compensation coil placed at least partially underneath a magnetic field sensor package in an electronic system provides attenuation of electromagnetic...
US-1,005,8015 Solderable two piece board level shields
According to various aspects, exemplary embodiments are disclosed of a two-piece metallic board level shield (BLS). In an exemplary embodiment, the BLS is...
US-1,005,8014 Conductive adhesive layer for gasket assembly
An apparatus suitable for EMC shielding applications comprises a first component comprising an electrically conductive first surface, and a gasket member...
US-1,005,8013 Environment-controlled cooling mode selection for a modular data center based on detection of contaminants and...
A cooling system circulates cooling air through information technology (IT) modules within a large scale information handling system (IHS). An air handling unit...
US-1,005,8012 Multizone variable damper for use in an air passageway
A multizone variable damper for air passageways having a plurality of damper zones, a plurality of opposed blades that are rotatable about a horizontal axis, a...
US-1,005,8011 Passive cooling systems for network cabinet
Certain embodiments of the present invention provide a cooling duct assembly for electronic equipment installed in a cabinet. The cooling duct assembly...
US-1,005,8010 Heat-exchanger heat sink and heat exchanger provided with the heat sink
A heat-exchanger heat sink (1; 102; 103; 104) includes a plurality of fin plates (2; 202; 203; 203a, 203b; 205), which are lined up spaced apart from one...
US-1,005,8009 External function extension device
An external function extension device includes a casing, a transition circuit board, a liquid cooling system, at least one connecting member and a power supply...
US-1,005,8008 Temperature control system having adjacently-installed temperature equalizer and heat transfer fluid and...
The present invention provides a temperature control system having adjacently-installed temperature equalizer and heat transfer fluid and application device...
US-1,005,8007 Water-cooling radiator unit and water-cooling module using same
A water-cooling radiator unit and a water-cooling module using same are disclosed. The water-cooling radiator unit includes a main body divided into a first...
US-1,005,8006 Lever release mechanism for information handling system chassis sled
A chassis sled for carrying information handling resources may include a sled housing, a lever mechanically coupled to the sled housing and for aiding a user in...
US-1,005,8005 Computer hardware unit with collapsible mounting brackets
A computer hardware unit, a data center cabinet having the same, and a method of removing the computer hardware unit from the data center cabinet. The computer...
US-1,005,8004 Interlock assembly
An openable IT component is configured to be mounted within an IT rack and includes a shell assembly. A drawer assembly is configured to receive a plurality of...
US-1,005,8003 Electronic device storage apparatus with an enhanced self-locking mechanism in communication with a slidable cover
An electronic device storage apparatus with an enhanced self-locking mechanism in communication with a slidable cover is provided. The apparatus includes an...
US-1,005,8002 Casing and rubber plug of power conversion equipment
It is structured that plural service holes are provided on a surface of the casing, that a flange of a rubber plug for sealing the service hole has a lip seal...
US-1,005,8001 Hybrid thermoplastic gels and their methods of making
Methods, compositions, apparatuses, and systems are provided for a hybrid thermoplastic gel or sealant. The methods comprise providing (a) a base polymer having...
US-1,005,8000 Waterproof structure for casing of electronic device
A waterproof structure for a casing of an electronic device includes: a first casing member, having a first casing portion, a first side portion surrounding the...
US-1,005,7999 Electronic device having a reduced dead border
An electronic device having two or more opposing sides is disclosed. The electronic device comprises a display module, a window on the display module, and a...
US-1,005,7998 Flexible display device
A flexible display device is disclosed which includes a body having a body bearing face; a flexible display screen having a fixed section and at least one bent...
US-1,005,7997 Device for integrating a screen or monitor in a case
A device for integrating a monitor in a case comprises a support element made from plastic material and having a recess which corresponds to a predetermined...
US-1,005,7996 Foldable portable terminal device
A foldable portable terminal device is disclosed. In one aspect, the device includes a flexible display configured to display an image and a foldable body...
US-1,005,7995 Electronic device
An electronic device includes a resin layer, a conductive layer buried in the resin layer, an electronic part buried in the resin layer, and a wiring layer...
US-1,005,7994 Method for installing integrated circuit devices on a substrate
In one embodiment, a biasing device is actuated using an actuator which is aligned with the biasing device along an alignment axis. A first frame is thereby...
US-1,005,7993 Manufacturing method of power-module substrate
A manufacturing method of power-module substrate (10), the power-module substrate (10) being obtained by joining a circuit layer (12) made of copper to one...
US-1,005,7992 Ceramic circuit substrate and its production method
A method for producing a ceramic circuit substrate comprising the steps of forming brazing regions each comprising brazing material powder and an organic binder...
US-1,005,7991 Electrical contacts in layered structures
Provided herein are layered structures and methods for forming the same, the layered structures including a conductive layer and an overcoat layer formed on a...
US-1,005,7990 Flexibile printed circuit and electronic device
According to one embodiment, a flexible printed circuit has a first circuit substrate and a second circuit substrate extending over the first circuit substrate....
US-1,005,7989 Multilayer structure and related method of manufacture for electronics
Multilayer structure, including a substrate film having a first and second opposite side, said substrate film including electrically insulating material,...
US-1,005,7988 Multilayer capacitor and board having the same
A multilayer capacitor and a board having the same includes external electrodes and internal electrodes. The external electrodes include connection portions...
US-1,005,7987 Printed circuit board with side access termination pads
A printed circuit board provides lateral notches for receiving wire conductors in a lateral direction to be joined with printed circuit board traces by solder...
US-1,005,7986 Thermal overload device containing a polymer composition containing thermally exfoliated graphite oxide and...
A thermal overload device containing a polymer composite, which contains at least one polymer and a modified graphite oxide material, containing thermally...
US-1,005,7985 Printed substrate and electronic device
A printed substrate includes a land that is to be soldered. The land includes a plating film that defines a surface of the land. The plating film includes a...
US-1,005,7984 Composite thin copper foil and carrier
A method and production of composite foils and thin copper foils peeled from said composite copper foils is disclosed for use in forming printed circuit boards...
US-1,005,7983 Fabrication methods for bio-compatible devices using an etch stop and/or a coating
A method may involve: forming a first bio-compatible layer; forming an etch stop over a portion of the first bio-compatible layer; forming a conductive pattern...
US-1,005,7982 Solderless breadboard
Embodiments of the invention provide a solderless breadboard for prototyping electrical circuits. The breadboard includes a plurality of electrically conductive...
US-1,005,7981 Stretchable circuit board and method of manufacturing the same
A stretchable circuit board has stretchability as well as flexibility of the flexible substrate and retains mechanical and electrical properties even under...
US-1,005,7980 Method and apparatus for reducing corrosion in flat flexible cables and flexible printed circuits
According to one aspect, an apparatus includes a substrate, a conductor, and a contact pad. The substrate has a first edge, and the conductor is formed on the...
US-1,005,7979 Conductive structure body and method for manufacturing the same
An exemplary embodiment of the present invention relates to a conductive structure body that comprises a darkening pattern layer having AlOxNy, and a method for...
US-1,005,7978 Display panel, method for producing display panel, and flexible printed circuit board
A display panel including: a substrate; a plurality of first connecting wires in a first portion of the substrate and connected to a first flexible printed...
US-1,005,7977 Wiring board and electronic device
A wiring board includes a first wire, a second wire, a third wire and a fourth wire formed over a substrate and extending in a first direction respectively, the...
US-1,005,7976 Power-ground co-reference transceiver structure to deliver ultra-low crosstalk
An interface layout for a vertical interface of a first semiconductor component is disclosed. A first one or more conductors configured to carry power signals...
US-1,005,7975 Electronic assemblies and method for manufacturing the same
An electronic assembly and a method for manufacturing the electronic assembly are provided. The method includes: configuring a chip and a connector at a first...
US-1,005,7974 Integrated panel level liquid cooling for bus bars
An electrical contactor assembly is provided including: an electrical contactor; an electrical bus bar; a panel; at least one post protruding through the panel...
US-1,005,7973 Electrodeless single low power CW laser driven plasma lamp
An ignition facilitated electrodeless sealed high intensity illumination device is configured to receive a laser beam from a continuous wave (CW) laser light...
US-1,005,7972 Extreme ultraviolet light generation system and method of generating extreme ultraviolet light
An extreme ultraviolet light generation system may include a laser system and a controller. The laser system may irradiate the first target with a first pulse...
US-1,005,7971 Apparatuses, methods and systems for active counter directed energy platform protection
The present disclosure relates to the active initiation of incident energy-dissipating material from a structure surface coating as a counter measure response...
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