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Patent # Description
US-1,011,5884 Flexible display
A flexible display, including: a flexible display panel; an electroactive polymer layer disposed on a side of the flexible display panel that faces away from a...
US-1,011,5883 Device using a piezoelectric element and method for manufacturing the same
An inkjet printing head 1 includes a pressure chamber (cavity) 5, a movable film 10A defining a top surface portion of the pressure chamber 5, and a...
US-1,011,5882 Thermoelectric conversion element and thermoelectric conversion module
Provided are a thermoelectric conversion element and a thermoelectric conversion module using the thermoelectric conversion element. The thermoelectric...
US-1,011,5881 Portable lighting device with thermoelectric power source
A lighting device which includes a light emitting unit, a thermoelectric power generation module for powering the light emitting unit, a top panel supporting...
US-1,011,5880 System and method for harvesting energy down-hole from an isothermal segment of a wellbore
Systems and methods of generating power in a wellbore extending through a subterranean formation are described. A swirling flow of pressurized fluid is passed...
US-1,011,5879 Thermoelectric conversion material and method of production thereof
Provided herein is a skutterudite-type material having high thermoelectric conversion characteristics in a high temperature region. A thermoelectric conversion...
US-1,011,5878 Optical sensor
An optical sensor includes a flexible substrate, a light emitting element, and a light receiving element. The light emitting element and the light receiving...
US-1,011,5877 Method for manufacturing semiconductor device
A method for manufacturing a semiconductor device includes: providing a support with a semiconductor light-emitting element including a first electrode and a...
US-1,011,5876 Light emitting device mount, leadframe, and light emitting apparatus
A light emitting device mount includes a positive lead terminal, and a negative lead terminal. Each of the positive and negative lead terminal includes a first...
US-1,011,5875 Light-emitting device and method of manufacturing the same
A method of manufacturing a light emitting device that includes a plurality of light emitting parts is provided. The method includes providing a base member...
US-1,011,5874 Light-emitting device including photoluminescent layer
A light-emitting device comprises a photoluminescent layer that emits light including first light in an infrared region; and a light-transmissive layer located...
US-1,011,5873 Surface-modified phosphor and light emitting device
A surface-modified phosphor includes: a phosphor matrix represented by Chemical Formula 1, K.sub.2SiF.sub.6:Mn.sup.4+; and Chemical Formula 1 a nano-sized...
US-1,011,5872 Light emitting device and method of manufacturing the same
A light emitting device includes a first light emitting element that outputs a first emitted light having a first peak wavelength, a second light emitting...
US-1,011,5871 Optoelectronic semiconductor component and method for producing same
An optoelectronic semiconductor component and a method for producing the same are disclosed. In an embodiment the semiconductor component includes a...
US-1,011,5870 Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device,...
A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength...
US-1,011,5869 Optoelectronic semiconductor chip, optoelectronic component and method for singulating semiconductor chips
The invention relates to an optoelectronic semiconductor chip (10) comprising a carrier (2) and a semiconductor body (1) having an active layer (13) provided...
US-1,011,5868 Optoelectronic semiconductor chip, optoelectronic component, and method of producing semiconductor chips
An optoelectronic semiconductor chip includes a carrier and a semiconductor body having an active layer that generates electromagnetic radiation, wherein the...
US-1,011,5867 Optoelectronic semiconductor chip
An optoelectronic semiconductor chip is disclosed. In an embodiment the optoelectronic semiconductor chip includes a semiconductor body of semiconductor...
US-1,011,5866 Light emitting device and projector
In a light emitting device, a ridge section has first and second tapered sections respectively increasing in width from a center position toward first and...
US-1,011,5865 High-performance LED fabrication
High-performance light-emitting diode together with apparatus and method embodiments thereto are disclosed. The light emitting diode devices emit at a...
US-1,011,5864 Optoelectronic device with light-emitting diodes and an improved radiation pattern
An optoelectronic device provided with a support including a face having at least one concave or convex portion, the amplitude of the sagitta of said portion...
US-1,011,5862 Fluidic assembly top-contact LED disk
A method is provided for forming a direct emission display. The method provides a transparent substrate with an array of wells formed in its top surface. A...
US-1,011,5861 Light emitting diode and fabrication method thereof
A light-emitting diode includes: an epitaxial-laminated layer having from bottom up: an n-type ohmic contact layer, a first n-type transition layer, an n-type...
US-1,011,5860 High voltage monolithic LED chip
Monolithic LED chips are disclosed comprising a plurality of active regions on submount, wherein the submount comprises integral electrically conductive...
US-1,011,5859 Nitride based devices including a symmetrical quantum well active layer having a central low bandgap delta-layer
A symmetrical quantum well active layer provides enhanced internal quantum efficiency. The quantum well active layer includes an inner (central) layer and a...
US-1,011,5858 Light emitting diode and fabrication method thereof
A method of fabricating a light emitting diode includes providing a substrate, and forming successively an N-type layer, an active layer, an electronic blocking...
US-1,011,5857 Method for manufacturing semiconductor element of polygon shape
A method for manufacturing a semiconductor element is provided. The method includes providing a semiconductor wafer including a substrate and a semiconductor...
US-1,011,5856 System and method for curing conductive paste using induction heating
One embodiment can provide a system for curing conductive paste applied on photovoltaic structures using induction heating. The system can include a wafer...
US-1,011,5855 Conductive foil based metallization of solar cells
Methods of fabricating a solar cell, and system for electrically coupling solar cells, are described. In an example, the methods for fabricating a solar cell...
US-1,011,5854 Method for forming a virtual germanium substrate using a laser
The present disclosure provides a method of manufacturing a semiconductor device. Furthermore the present disclosure provides a photovoltaic device and a light...
US-1,011,5853 Electronic power cell memory back-up battery
An electronic power cell memory back-up battery is disclosed. The electronic power cell memory back-up battery utilizes stored light photons to produce usable...
US-1,011,5852 Solar cell module
A solar cell module includes: first and second solar cell strings each including solar cells arranged in an arrangement direction and electrically connected to...
US-1,011,5851 Solar cell having a dielectric rear face coating and method for producing same
Solar cell (11; 21; 31) having a dielectric coating arranged on a back side of the solar cell (11; 21; 31) which is at least partly covered by at least one...
US-1,011,5850 Roof integrated solar panel system with side mounted micro inverters
A roof integrated solar panel system includes a plurality of solar panel modules, each modules having a frame, a photovoltaic panel mounted to the frame, and a...
US-1,011,5849 Solar cell and method of fabricating the same
A solar cell includes a substrate, a back electrode layer on the substrate, a light absorbing layer on the back electrode layer, a buffer layer on the light...
US-1,011,5848 Method of transferring thin film
A method of transferring a thin film includes: providing a first element structure, wherein the first element structure includes a first substrate and a...
US-1,011,5847 Cupric oxide semiconductors
A method of preparing a cupric oxide semiconductor. The method includes providing a substrate having a first surface, forming a cuprous oxide layer on the first...
US-1,011,5846 Solar cell and solar cell manufacturing method
In a method for manufacturing a solar cell, a photoelectric conversion element, which has a surface whose outer periphery is surrounded by a plurality of sides,...
US-1,011,5845 Composition for forming solar cell electrodes and electrodes fabricated using the same
The present invention relates to a composition for forming solar cell electrodes which includes a conductive powder, a glass frit and an organic vehicle, and...
US-1,011,5844 Electrodes comprising nanostructured carbon
An electrode includes a network of compressed interconnected nanostructured carbon particles such as carbon nanotubes. Some nanostructured carbon particles of...
US-1,011,5843 Broadband antireflection coatings under coverglass using ion gun assisted evaporation
The present disclosure generally relates to broadband antireflective coatings for reducing reflection of light in the infrared without compromising visible...
US-1,011,5842 Semiconductor optical package and method
Embodiments of the present disclosure are directed to optical packages having a package body that includes a light protection coating on at least one surface of...
US-1,011,5841 Integrated photovoltaic panel circuitry
A photovoltaic module is presented, which may include a photovoltaic panel and a converter circuit having a primary input connected to the photovoltaic panel...
US-1,011,5840 Solar cell and method for producing thereof
Solar cell including: a semiconductor substrate of a first conductivity type having a region of the first conductivity type and region of a second conductivity...
US-1,011,5839 Module fabrication of solar cells with low resistivity electrodes
One embodiment of the present invention provides a solar module. The solar module includes a front-side cover, a back-side cover, and a plurality of solar cells...
US-1,011,5838 Photovoltaic structures with interlocking busbars
One embodiment can provide a current-collecting mechanism of a photovoltaic structure. The current-collecting mechanism can include a top metallic grid...
US-1,011,5837 Integrated circuits with solar cells and methods for producing the same
Integrated circuits and methods of producing the same are provided. In an exemplary embodiment, an integrated circuit includes a substrate with a handle layer,...
US-1,011,5836 Lead-bismuth-tellurium-silicate inorganic reaction system having improved adhesion properties
An inorganic reaction system comprising a lead-bismuth-tellurium-silicate composition of Formula (I): Pb.sub.a--Bi.sub.b--Te.sub.c--Si.sub.g-M.sub.d-O.sub.e,...
US-1,011,5835 Variable capacitor based on buried oxide process
Certain aspects of the present disclosure provide a semiconductor variable capacitor based on a buried oxide process. The semiconductor variable capacitor...
US-1,011,5834 Method for manufacturing an edge termination for a silicon carbide power semiconductor device
A method for manufacturing an edge termination structure for a silicon carbide power semiconductor device having a central region and an edge region is...
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