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Patent # Description
US-1,023,1370 Electronic component mounting device
An electronic component mounting device, including: a board conveyance device which conveys and positions a board on which an electronic component is mounted; a...
US-1,023,1369 Shield cap and method for manufacturing the same
A shield cap for protecting an electronic component includes a cap member having a side wall portion and a ceiling portion, a conductive film formed on the cap...
US-1,023,1368 Manufacturing method of a hollow shielding structure for circuit elements
A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a...
US-1,023,1367 Electronic device having structure for shielding magnetic force
An electronic device including a structure to shield magnetic force is provided. The electronic device includes a housing having a first surface facing a first...
US-1,023,1366 Electric shock prevention apparatus
Provided is an electric shock protection apparatus. The electric shock protection apparatus, according to one exemplary embodiment of the present invention,...
US-1,023,1365 Thermal control process for a multijunction electronic power device and corresponding electronic power device
A thermal control process for an electronic power device including a multi junction integrated circuit may include defining a first and at least one second...
US-1,023,1364 Fluidly cooled power electronics assemblies having a thermo-electric generator
A power electronics assembly that includes a first cooling chip fluidly coupled to a second cooling chip. The first cooling chip and the second cooling chip...
US-1,023,1363 Modular cooling apparatus for high-voltage direct-current transmission system
The present invention relates to a modular cooling apparatus for a high-voltage direct-current transmission system. A sub-module (10) according to the present...
US-1,023,1362 Hazard warning system
A flooring element is used in a raised floor having removable flooring panels and a supporting structure and having a load bearing surface. The flooring element...
US-1,023,1361 Fan system management
In some embodiments, a rack system is configured to comprise a removable fan system. The fan system enables thermal management of the rack system. The removable...
US-1,023,1360 Dual-mode passive thermal management system and method
Embodiments include a heat sink cell comprising a first reservoir having a first volume of space and a first material stored in the first volume of space. The...
US-1,023,1359 Active control for two-phase cooling
Methods and devices for active control for two-phase cooling include a cooling volume that has cavities and active coolant flow controls in the cavities...
US-1,023,1358 Trim cooling assembly for cooling electronic equipment
A trim cooling assembly provides a sensible trim cooling capability for intake air provided to a downstream computing pod that includes an air cooling system...
US-1,023,1357 Two-phase cooling with ambient cooled condensor
An apparatus for cooling a computer system includes a primary cooling loop. The primary cooling loop includes an evaporator configured to cool at least a...
US-1,023,1356 Cold plate
A cold plate, an electronic assembly including a cold plate, and a method for forming a cold plate are provided. The cold plate includes an interface plate and...
US-1,023,1355 Cooling structure for electronic device
A cooling structure for an electronic device is configured to include internal heat dissipating fins (first heat dissipating member) accommodated inside a...
US-1,023,1353 Patch panel assembly
A patch panel assembly mounts in a rack on a side of the rack other than the front side of the rack and other than the back side of the rack and fits within a...
US-1,023,1352 Anodizing resistant components and methods of use thereof
Methods and structures for forming anodization layers that protect and cosmetically enhance metal surfaces are described. In some embodiments, methods involve...
US-1,023,1351 Housing, method for making the same, electronic device, and automotive interior component
A housing for an electronic device in the home or car includes a substrate and a composite layer. The composite layer is formed on a surface of the substrate....
US-1,023,1350 Electronic device
A drive mechanism has an engaging member that abuts on a first engageable part and moves to a first axial center direction position and an engaging member that...
US-1,023,1349 Display device
A display device includes a display panel, a back cover placed in the back surface of the display panel, and a coupling unit placed in an area between the back...
US-1,023,1348 Heat dissipation structure for connector module
A connector module is provided with first and second bus bars which are respectively formed by a metal plate, a control board on which an electronic component...
US-1,023,1347 Electronic device including flexible display
An electronic device includes a flexible display, a foldable housing, and a flexible display disposed on one surface of the housing. The housing includes a...
US-1,023,1346 Display device
A display device is disclosed. The display device includes a display panel, a transparent back cover positioned at a rear of the display panel, a side frame...
US-1,023,1345 Attachment apparatus and attachment method for conductive adhesive
Embodiments of the present invention provide an attachment apparatus and an attachment method for a conductive adhesive. The attachment apparatus includes: a...
US-1,023,1344 Metallic ink
Forming a conductive film comprising depositing a non-conductive film on a surface of a substrate, wherein the film contains a plurality of copper nanoparticles...
US-1,023,1343 Methods for producing ceramic substrates and module components
In a method for manufacturing ceramic substrates and module components, an unfired mother ceramic substrate is cut at predetermined positions for division into...
US-1,023,1342 Component built-in substrate
A component built-in substrate incorporates a chip capacitor in a multilayer substrate including laminated base material layers made of thermoplastic resin. The...
US-1,023,1341 Surface mount device stacking for reduced form factor
A packaged module for use in a wireless communication device has a substrate supporting an integrated circuit die that includes at least a microprocessor and...
US-1,023,1340 Single reflow power pin connections
A method, in some embodiments, comprises: providing a direct bonded copper (DBC) substrate including a plurality of copper traces; providing a guide plate...
US-1,023,1339 Circuit board, power storage device, battery pack, and electronic device
An electronic apparatus is provided including a substrate, a conductive land formed on a surface of the substrate, an electronic component including an...
US-1,023,1338 Methods of forming trenches in packages structures and structures formed thereby
Methods of forming a package structures comprising a trench are described. An embodiment includes a first die disposed on a first substrate, and at least one...
US-1,023,1337 Folded printed circuit assemblies and related methods
Printed circuit assemblies comprising two or more printed circuit boards stacked and/or folded together and related methods. In some embodiments, a first...
US-1,023,1336 Printed wiring board for mounting electronic component
A printed wiring board includes a first conductor layer forming an inner conductor layer, a second conductor layer forming a first outemiost conductor layer, a...
US-1,023,1335 Electronic module with embedded jumper conductor
The present invention generally provides a novel method for manufacturing an electronic module with crossed conducting lines and a novel electronic module with...
US-1,023,1334 Multi-stacked electronic device with defect-free solder connection
A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe,...
US-1,023,1333 Copper interconnect for PTH components assembly
Methods of making a copper interconnect plated through hole assembly are disclosed. Nano copper ink dispersed in an organic solvent is able to be filled in the...
US-1,023,1332 Inorganic filler and epoxy resin composition including the same
An inorganic filler includes surface-modified boron nitride having a surface on which a polycyclic aromatic hydrocarbon having a functional group is provided.
US-1,023,1331 Multilayer wiring board and probe card having the same
A multilayer wiring board includes: a multilayer body including a plurality of insulating layers; a lower outer electrode provided on a lower surface of the...
US-1,023,1328 Flexible circuit structures including connection arrangement connected to load measurement lead
Some aspects of this disclosure generally are related to improving the robustness of a flexible circuit structure, for example, by providing fault-tolerant...
US-1,023,1327 Optical module and optical transmission equipment
There is provided an optical module including an optical subassembly including an optical element, a printed circuit board, and a connection substrate. The...
US-1,023,1326 Flexible print circuit board and display device
A flexible printed circuit board and a display device are disclosed by embodiments of the invention. The flexible printed circuit board has one or more waveform...
US-1,023,1325 Placement of vias in printed circuit board circuits
In some examples, an electronic device includes a printed circuit board (PCB) device that includes a first trace electrically connected to a first pad of a...
US-1,023,1324 Staggered power structure in a power distribution network (PDN)
Some novel features pertain to an integrated device that includes a first metal layer and a second metal layer. The first metal layer includes a first set of...
US-1,023,1323 Printed circuit body
A printed circuit body includes a bus bar as a metal member electrically connected with a connected body, an insulator layer providing insulation properties,...
US-1,023,1322 Homologous dual-energy accelerator and accelerator therapy device
The present invention discloses a homologous dual-energy accelerator and a therapy device comprising the homologous accelerator. The homologous dual-energy...
US-1,023,1321 State-based adjustment of power and frequency
Systems and methods for state-based adjustment of power and frequency are described. A primary generator of a system includes a primary power supply for...
US-1,023,1320 Processing machine including electric discharger
In a processing machine according to the present invention, an electric discharger to remove static electricity from a charged work piece or charged machining...
US-1,023,1319 Methods and systems for controlling an electrical load
An electronic dimming ballast or light emitting diode (LED) driver for driving a gas discharge lamp or LED lamp may be operable to control the lamp to avoid...
US-1,023,1318 Method and system for controlling the switching on of lights
A lighting system having a plurality of lighting devices electrically connected thereto includes a control unit connected lighting devices and adapted to...
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