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Patent # Description
US-1,025,7970 Feeder for an electronic component
A feeder and a feeder control method, as well as an electronic component device, reliably engaging a supply tape in a loading operation even if there is an...
US-1,025,7969 Electromagnetic wave shielding structure
According to an embodiment, provided is an electromagnetic wave shielding structure comprising: a shielding structure encompassing an electromagnetic wave...
US-1,025,7968 Assembling component and assembling method thereof
An assembling component includes a frame and a cover. The frame has an opening, a first plane, and a first assembling structure. The first plane surrounds and...
US-1,025,7967 Electromagnetic interference splice shield
A splice device for electromagnetically sealing a junction or bond between a plurality of cables is provided. A first and second cable each has a conductive...
US-1,025,7966 Shielding device to reduce the impact of electromagnetic radiation
The present invention relates to a shielding device to reduce the impact of radiation, that contains a container (10) with a receptacle (14) and a functional...
US-1,025,7965 Electromagnetically shielded coverings for optical openings
The electromagnetic shielding of an enclosable building structure is provided by applying a shielded covering to overlay optical openings in the building...
US-1,025,7964 Reducing condensation risk within liquid cooled computers
An approach is provided in which a manufacturing test scheduling system predicts a dew point forecast indoor a facility based upon outdoor weather data and...
US-1,025,7963 Methods and system for oil immersion cooling
A system for immersion cooling computing system equipment includes a container containing a volume of immersion cooling fluid. At least one heat generating...
US-1,025,7962 Wire-spring retained heatsink installation and removal tool
A wire-spring retained heatsink installation and removal tool for installing and removing wire-spring retained heatsinks. The wire-spring retained heatsink...
US-1,025,7961 Fixation of heat sink on SFP/XFP cage
An apparatus and system for a heat sink assembly, and a procedure for forming a heat sink assembly. The heat sink assembly includes a heat sink having a base...
US-1,025,7960 Power distribution for immersion-cooled information systems
A two-phase immersion cooling system includes two or more voltage converters and a plurality of circuit boards, which are held in a modular case inside an...
US-1,025,7959 Method and apparatus for monitoring electromechanical device performance and reliability
Methods and apparatus for monitoring air cooling fans including, by way of non-limiting examples, the determination of an upper and lower boundary limit of...
US-1,025,7957 Cooling system for electronic devices employing adjacent fan cages with interflow passages
Cooling systems employing adjacent fan cages having cage walls with interflow passages are disclosed. A cooling system includes cooling fans disposed in...
US-1,025,7956 Self-biasing storage device sled
A storage device sled for mounting a storage device within a chassis is provided. The storage device sled includes a bezel, which includes a first portion that...
US-1,025,7955 Cable backplane system having individually removable cable connector assemblies
A cable backplane system includes cable backplanes each including a tray configured to be coupled to a chassis and a plurality of cable connector assemblies...
US-1,025,7954 Electronic device
An electronic device includes a battery including a first end portion in a plan view, the first end portion including a first engagement portion, a first case...
US-1,025,7953 Configuring a modular storage system
Provided is an enclosure for use in a modular storage system, the enclosure comprising a plurality of drive bays, a controller canister, an expansion canister,...
US-1,025,7952 Side clamping BGA socket
Disclosed is a socket apparatus for ball grid array (BGA) balls, including a base member of electrically insulative material, a plurality of electrical contact...
US-1,025,7951 Substrate-free interconnected electronic mechanical structural systems
Substrate-free mechanical structural systems comprised of interconnected subsystems of electronic and/or electromechanical components.
US-1,025,7950 Magnetic block locking of an electronic device
An electronic device or electronic device assembly may comprise a first portion and a second portion, a first magnet disposed inside the first portion and...
US-1,025,7949 Covert rooftop vent enclosure and adjustable multi-tiered rack for electronic surveillance equipment
An apparatus for supporting electronic equipment on the exterior of an outdoor structure includes a base member configured to be coupled to the exterior of the...
US-1,025,7948 Clamping module for securing to a support rail
The invention relates to a clamping module for securing to a support rail, which has a housing, a bracing device and at least one retaining claw arranged...
US-1,025,7947 Housing for electrical unit
An electrical unit (1) having a housing (5) having a first wall (7) and a circuit board (3) mounted inside the housing (5), wherein an inner side (7a) of the...
US-1,025,7946 Electronic device
One embodiment provides an electronic device, comprising: a main body component; an adjustable display component comprising a display area, a first shape, a...
US-1,025,7945 Rollable display
A rollable display includes a flexible display panel where pixels are arranged to display an image; a reinforcing structure that is bonded to the rear side of...
US-1,025,7944 Board edge connector
Apparatuses and methods for forming serial advanced technology attachment (SATA) board edge connectors with electroplated hard gold contacts. One example method...
US-1,025,7943 Electronic device with integrated circuit chip provided with an external electrical connection network
An electronic device includes a substrate having an external surface, and an integrated circuit over the external surface of the substrate. The substrate is...
US-1,025,7942 Stackable variable height via package and method
A stackable variable height via package includes a substrate having a first surface and terminals thereon. The terminals include a first terminal and a second...
US-1,025,7941 Connection substrate
A connection substrate includes a ceramic substrate with a through hole therein and a through conductor provided in the through hole and having first main...
US-1,025,7940 Conformal coating materials
In an example, a process for reversibly bonding a conformal coating to a dry film solder mask (DFSM) material is disclosed. The process includes applying a...
US-1,025,7939 Method of fabricating tamper-respondent sensor
Methods of fabricating tamper-respondent electronic circuit structures and electronic assembly packages are provided which include, at least in part, a...
US-1,025,7938 Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper...
The present invention provides a surface-treated copper foil capable of imparting the profile shape of the substrate surface after removal of the copper foil,...
US-1,025,7937 Device for electrically coupling a plurality of semiconductor device layers by a common conductive layer
An assembly includes a first laminate electronic component and a second laminate electronic component. The first laminate electronic component includes a first...
US-1,025,7936 Chip resistor, method of producing chip resisitor and chip resistor packaging structure
[Object] A method for efficiently manufacturing chip resistors is provided. [Means] The method includes the steps of preparing at least three conductive...
US-1,025,7935 Method for manufacturing a printed circuit board assembly based on printed electronics
A printed circuit board assembly (1) and a method for manufacturing a printed circuit board assembly (1) are provided. The method comprises: providing a...
US-1,025,7934 Circuit board module
A circuit board module is electrically connectable to a socket by inserting one end part thereof into the socket, and includes a circuit board and a terminal...
US-1,025,7933 Transverse circuit board to route electrical traces
An electronic device including a transverse circuit board to route electrical traces is provided. In some embodiments, the electronic device includes: a...
US-1,025,7932 Laser diode chip on printed circuit board
A light source module comprising a semiconductor light source mounted directly to a conducting trace of a multilayer printed circuit board having a core...
US-1,025,7931 Systems and methods for providing grooved vias in high-speed printed circuit boards
Systems and methods for grooved vias are described. For example, a method may include: drilling a via hole in a Printed Circuit Board (PCB), where the PCB...
US-1,025,7930 Trace anywhere interconnect
The present invention provides for a method and structure for forming three-dimensionally routed dielectric wires between discrete points on the two or more...
US-1,025,7929 Variable stiffness film, variable stiffness flexible display, and method of manufacturing the variable...
A variable stiffness film, a variable stiffness flexible display, and a manufacturing method thereof may include a lower electrode, a variable fluid, and an...
US-1,025,7928 Resin sheet
Resin sheets which includes a support and a resin composition layer in contact on the support, and which are characterized in that an extracted water...
US-1,025,7927 Mother ceramic substrate, ceramic substrate, mother module component, module component, and method of...
Provided is a mother ceramic substrate that, when divided into individual substrates (ceramic substrates), can be divided to cause divided end surfaces to be...
US-1,025,7926 Wired circuit board and producing method thereof
A method of producing a wired circuit board including an insulating layer and a conductive pattern, including: (1), an insulating layer having an inclination...
US-1,025,7925 Method for manufacturing an electronic assembly
A method for manufacturing an electronic assembly and electronic assemblies are presented. The method includes obtaining a substrate film for accommodating...
US-1,025,7924 Tamper-proof electronic packages formed with stressed glass
Tamper-proof electronic packages and fabrication methods are provided which include a glass enclosure enclosing, at least in part, at least one electronic...
US-1,025,7923 Resin substrate and electronic device
A resin substrate includes a first portion including a plurality of resin sheets provided at one end in a stacking direction and a second portion including a...
US-1,025,7922 Method for reducing conductor track spacing in electronic circuit boards and electronic circuit board with...
A method for reducing conductor track spacings in a printed circuit board, wherein the printed circuit board has an input part, wherein the input part is fed by...
US-1,025,7921 Embedded air gap transmission lines
Embedded air gap transmission lines and methods of fabrication are provided. An apparatus having an air gap transmission line can include a first conductive...
US-1,025,7920 Semiconductor device
A semiconductor device includes: an annular or partially annular substrate; a first control circuit provided on the substrate and configured to control a first...
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